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STMicroelectronics STM32F412ZEJ6

Part No.:
STM32F412ZEJ6
Manufacturer:
STMicroelectronics
Category:
Microcontrollers
Package:
144-UFBGA
Datasheet:
AetrixSTM32F412ZEJ6.pdf
Description:
IC MCU 32BIT 512KB FLSH 144UFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,081

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Product details

Overview

STM32F412ZEJ6 from STMicroelectronics is a 32-bit Arm® Cortex®-M4 microcontroller with FPU, 100 MHz max clock, 1 MB Flash, 256 KB SRAM, and integrated USB OTG FS, dual CAN 2.0B, and 17 communication interfaces. It features ART Accelerator™ for zero-wait-state flash execution, Batch Acquisition Mode (BAM) for sensor hub efficiency, and operates from 1.7–3.6 V in industrial temperature range (–40 to +85 °C).

For engineers reviewing the STM32F412ZEJ6 datasheet, STM32F412ZEJ6 pinout, STM32F412ZEJ6 application, or STM32F412ZEJ6 equivalent, key selection criteria include its 100 MHz Cortex-M4+FPU performance, 1 MB Flash/256 KB SRAM memory partitioning, dual CAN support, low-power Stop mode (18 µA), and LQFP144 package compatibility with legacy STM32F4 designs.

Technical Context

The device implements an Arm Cortex-M4 core with hardware FPU and DSP instructions, coupled with ST's ART Accelerator™ that eliminates flash wait states at 100 MHz. Its memory subsystem includes flexible static memory controller (FSMC) supporting NOR/PSRAM and dual-mode Quad-SPI for external serial flash.

Peripherals are organized around a multi-AHB bus matrix: two independent CAN 2.0B controllers, USB OTG FS with integrated PHY, four I²C (SMBus/PMBus), five SPI/I²S (two full-duplex I²S), SDIO, and a 12-bit 2.4 MSPS ADC with up to 16 channels - all accessible via up to 114 GPIOs with interrupt capability and 5 V tolerance on 114 pins.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm Cortex-M4 with FPU and DSP extensions; enables real-time signal processing and floating-point math in motor control or audio applications.
Max Clock Frequency100 MHz; delivers 125 DMIPS (1.25 DMIPS/MHz) with ART Accelerator enabled - sufficient for closed-loop servo control or multi-channel sensor fusion.
Flash Memory1 MB embedded Flash; supports dual-bank operation for safe firmware updates without halting real-time tasks.
SRAM256 KB SRAM (including 64 KB CCM); CCM RAM is tightly coupled to CPU for deterministic ISR latency critical in real-time control.
ADC1×12-bit, 2.4 MSPS ADC with up to 16 channels; supports simultaneous sampling across multiple sensors in industrial monitoring systems.
Low-Power Stop Mode18 µA (typical, 25 °C, Flash in Deep power down); enables battery-backed operation for >1-year runtime in wireless sensor nodes.
Communication InterfacesUp to 17 interfaces including 2×CAN 2.0B, USB OTG FS, 4×I²C, 4×USART, 5×SPI/I²S, SDIO; meets connectivity demands of gateway-class edge devices.

Pinout & Package

LQFP144 (20 × 20 mm, 0.5 mm pitch) package with 114 user I/Os, 5 V-tolerant inputs, and dedicated power/ground pins for noise-sensitive analog and digital domains.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VDDA, VSS, VSSAPower supply and ground railsSeparate analog/digital supplies reduce coupling noise; VDDA must be ≥ VDD – 0.3 V for ADC accuracy.
PA0–PA15, PB0–PB15, etc.General-purpose I/Os114 total GPIOs; up to 109 support 100 MHz toggle rate; all support external interrupt and wake-up from low-power modes.
PA11/PA12USB OTG FS D+/D−Dedicated full-speed USB transceiver pins with internal pull-ups; require no external PHY for device/host/OTG operation.
PB8/PB9CAN1_RX/CAN1_TXFirst CAN interface with programmable bit timing; supports ISO 11898-1 compliant differential signaling up to 1 Mbps.
PD0/PD1CAN2_RX/CAN2_TXSecond independent CAN controller; enables dual-bus automotive diagnostics or industrial redundancy architectures.
PC10/PC11SDIO_D0/SDIO_D1Part of 4-bit SDIO interface; supports SD/MMC/eMMC cards up to 48 MHz clock for local data logging or firmware storage.

Key Features

FeatureDesign Value
ART Accelerator™Enables zero-wait-state execution from Flash at 100 MHz - eliminates cache misses and guarantees deterministic timing for hard real-time loops.
Batch Acquisition Mode (BAM)Allows autonomous peripheral-triggered ADC/DMA transfers while CPU sleeps - reduces active time by >70% in sensor hub applications.
Dual CAN 2.0B ControllersIndependent message filtering, FIFO buffering, and loopback self-test - supports J1939 or CANopen master/slave roles without software arbitration.
Flexible Static Memory Controller (FSMC)Supports 8-/16-bit parallel NOR/PSRAM with programmable timing - enables direct interface to external displays or FPGA co-processors.
True Random Number Generator (RNG)NIST SP800-90B compliant entropy source - provides cryptographically secure keys for TLS handshake or secure boot verification.

Applications

Motor Control SystemsIndustrial PLCs

Use Scenario: Closed-loop field-oriented control (FOC) of 3-phase BLDC motors in HVAC compressors or robotic joints.

IC Role / Device Role / Timing Role: Real-time computation engine executing FOC algorithm, PWM generation, and current sensing via ADC+DMA.

Use Value: 100 MHz Cortex-M4+FPU delivers <5 µs vector math latency; 2.4 MSPS ADC enables precise current sampling at 20 kHz switching frequency.

Use Scenario: Modular I/O expansion unit with analog input, digital output, and fieldbus connectivity in factory automation.

IC Role / Device Role / Timing Role: Central controller managing EtherCAT slave stack, CANopen master, and local HMI via FSMC-driven LCD.

Use Value: Dual CAN + USB OTG + FSMC allows concurrent fieldbus bridging, firmware update over USB, and local display - reducing BOM count by one IC.

Wearable Sensor HubsSmart Home Gateways

Use Scenario: Always-on motion and environmental sensing node aggregating data from IMU, barometer, and microphone before BLE transmission.

IC Role / Device Role / Timing Role: Low-power aggregator using BAM to trigger ADC/PDM captures only on motion threshold events.

Use Value: 18 µA Stop mode + BAM reduces average current to <100 µA - enabling 2-year coin-cell operation with daily BLE sync.

Use Scenario: Multi-protocol home hub connecting Zigbee, Thread, and Matter devices to Wi-Fi cloud infrastructure.

IC Role / Device Role / Timing Role: Protocol translation bridge with USB host for Wi-Fi module, SDIO for local OTA storage, and dual CAN for legacy HVAC control.

Use Value: Integrated USB OTG FS + SDIO + dual CAN eliminates need for external USB host controller or CAN transceivers - shrinking PCB area by 35%.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STM32F407VGT6Same LQFP100 package, but 1 MB Flash/192 KB SRAM, no BAM, no DFSDM, single CAN, no Quad-SPI.Lacks sensor hub features (BAM, PDM, DFSDM); suitable for cost-sensitive motor control without audio/mic support.Select when USB host or dual CAN is not required and BOM cost is prioritized over low-power sensor aggregation.
STM32F429ZIT6LQFP144, 2 MB Flash/256 KB SRAM, Chrom-ART accelerator, LCD-TFT controller, no BAM, higher max temp (105 °C).Includes built-in RGB LCD interface and larger Flash; targets high-resolution HMI rather than ultra-low-power edge sensing.Choose for graphics-intensive applications requiring TFT display driving - not for battery-powered sensor nodes.

Compared with STM32F407VGT6, STM32F412ZEJ6 adds BAM, dual CAN, and PDM for sensor hubs but trades off legacy USB host support; versus STM32F429ZIT6, it sacrifices LCD-TFT capability for lower active power and optimized peripheral set for connected objects.

Availability

STM32F412ZEJ6 is available at Aetrix Electronics and suitable for motor control systems, industrial PLCs, wearable sensor hubs, and smart home gateways requiring stable component supply across extended product lifecycles.

Supply support for STM32F412ZEJ6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, sensors, and analog products for industrial, automotive, and consumer markets.

The STM32F412xE series targets resource-constrained, power-aware edge devices - emphasizing low-power sensor aggregation, dual-CAN fieldbus bridging, and USB OTG connectivity without compromising real-time compute performance.

FAQ

What is the maximum operating temperature range for STM32F412ZEJ6?

The STM32F412ZEJ6 is rated for industrial temperature range: –40 °C to +85 °C. This is confirmed in Section 6.3.1 of DS11139 Rev 9, where all electrical characteristics (including Flash endurance, ADC accuracy, and oscillator stability) are guaranteed across this range under specified VDD conditions.

Does STM32F412ZEJ6 support external SDRAM via FSMC?

No. The Flexible Static Memory Controller (FSMC) in STM32F412ZEJ6 supports only SRAM, PSRAM, and NOR flash memory - not SDRAM. SDRAM support requires the more advanced FMC peripheral found in STM32F42xxx/F43xxx lines. This limitation is explicitly stated in Section 3.11 of the datasheet.

Can the USB OTG FS interface operate in host mode without an external PHY?

Yes. STM32F412ZEJ6 integrates a full-speed USB 2.0 OTG transceiver with internal PHY, enabling device, host, and OTG operation without external components. Section 3.32 confirms the presence of "USB_OTG_FS controller with PHY", and Table 2 lists "USB OTG FS" as a standard feature across the F412xE family.

Is the 96-bit unique ID accessible via standard debug interface?

Yes. The 96-bit unique device identifier is mapped to system memory at address 0x1FFF7A10 and readable via SWD/JTAG debug access or firmware using HAL_GetUID() API. This is documented in Section 3.39 and Table 12 (register boundary addresses) of DS11139 Rev 9, and verified in ST's RM0383 reference manual.

STM32F412ZEJ6 Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Package/Case:
144-UFBGA
Series:
STM32F4
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
114
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
256K x 8
Voltage - Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

STM32F412ZEJ6 FAQ

1.How can I place an order for STM32F412ZEJ6 through Aetrix?

Please submit a Request for Quotation (RFQ) for STM32F412ZEJ6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STM32F412ZEJ6 reliable?

The price and inventory of STM32F412ZEJ6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32F412ZEJ6 is usually 5 days.

3.What payment methods are accepted for STM32F412ZEJ6?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32F412ZEJ6 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STM32F412ZEJ6?

STM32F412ZEJ6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STM32F412ZEJ6 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STM32F412ZEJ6?

For technical support, including STM32F412ZEJ6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32F412ZEJ6 requirements.

6.How does Aetrix verify that STM32F412ZEJ6 is sourced from the original manufacturer or authorized distributors?

All STM32F412ZEJ6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32F412ZEJ6 meets industry standards.

7.What is the process for return or replacement of STM32F412ZEJ6?

All STM32F412ZEJ6 units undergo pre-shipment inspection (PSI). If there is an issue with STM32F412ZEJ6, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STM32F412ZEJ6 part is unused and in its original packaging.

Return procedure for STM32F412ZEJ6:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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