STMicroelectronics STM32F412ZET6
- Part No.:
- STM32F412ZET6
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
STM32F412ZET6.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 144LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:269
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Product details
Overview
STM32F412ZET6 from STMicroelectronics is a 32-bit Arm® Cortex®-M4 microcontroller with FPU, 100 MHz max clock, 1 MB Flash, 256 KB SRAM, and integrated USB OTG FS, dual CAN 2.0B, and 17 communication interfaces. It delivers 125 DMIPS and supports real-time motor control, sensor hub processing, and industrial HMI in LQFP144 package.
For engineers reviewing the STM32F412ZET6 datasheet, STM32F412ZET6 pinout, STM32F412ZET6 application, or STM32F412ZET6 equivalent, key selection criteria include its 100 MHz ART Accelerator™-enabled flash execution, dual CAN + USB OTG FS connectivity, 12-bit 2.4 MSPS ADC with PDM/DFSDM support, and low-power Stop mode down to 18 µA.
Technical Context
The device integrates an Adaptive Real-Time Accelerator (ART Accelerator™) enabling zero-wait-state execution from Flash at 100 MHz, and Batch Acquisition Mode (BAM) for ultra-low-power peripheral data capture without CPU wake-up. Its memory subsystem includes flexible FSMC for NOR/PSRAM and dual-mode Quad-SPI for high-speed external memory.
Core peripherals include two advanced-control timers (TIM1/TIM8) with complementary PWM outputs, four I²C interfaces with SMBus/PMBus support, five SPI/I²S channels (two full-duplex I²S), SDIO for eMMC/SD cards, and two independent CAN 2.0B controllers - all synchronized via a multi-AHB bus matrix and 16-stream DMA controller.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M4 with FPU, 100 MHz max, 125 DMIPS @ 1.25 DMIPS/MHz |
| Memory | 1 MB embedded Flash (0-wait-state with ART), 256 KB SRAM, FSMC + Quad-SPI for external memory expansion |
| Analog | 1×12-bit 2.4 MSPS ADC (16 ch), 2×DFSDM digital filters, 4×PDM interfaces for stereo microphone input |
| Timers | Up to 17 timers: twelve 16-bit, two 32-bit (100 MHz), two watchdogs (IWDG/WWDG), SysTick |
| Communication | 2×CAN 2.0B, USB OTG FS (device/host/OTG), 4×USART (up to 12.5 Mbit/s), 4×I²C, 5×SPI/I²S, SDIO, LIN, IrDA |
| Power | 1.7–3.6 V supply; Run: 112 µA/MHz; Stop (Deep PD): 18 µA; Standby: 2.4 µA (no RTC) |
| Package | LQFP144 (20 × 20 mm), ECOPACK2-compliant, 114 I/Os (109 @ 100 MHz, 114 5V-tolerant) |
Pinout & Package
LQFP144 package with 144-pin quad flat pack, 0.5 mm pitch, exposed thermal pad, RoHS-compliant and ECOPACK2 certified. Pinout validated per STMicroelectronics DS11139 Rev 9 Section 4.5 (LQFP144 pinout description) and Table 9 (pin definition).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD/VSS | Power supply / Ground | Dual 1.7–3.6 V core/analog supply rails; dedicated VCAP pins for internal regulator stability |
| PA0–PA15, PB0–PB15, etc. | General-purpose I/O | 114 total GPIOs; 109 support 100 MHz toggle; all 5V-tolerant; configurable as AF for peripherals |
| PC13–PC15 | RTC oscillator inputs | Connect 32.768 kHz crystal for hardware calendar and subsecond-accurate RTC operation |
| PA11/PA12 | USB OTG FS D+/D− | Dedicated full-speed USB transceiver pins with internal pull-ups; require no external PHY |
| PB8/PB9 | CAN1_RX/CAN1_TX | Direct CAN 2.0B interface; support bit rates up to 1 Mbit/s with programmable timing |
| PD0/PD1 | OSC_IN/OSC_OUT | 4–26 MHz external crystal connection for main system clock generation |
Key Features
| Feature | Design Value |
|---|---|
| ART Accelerator™ | Enables 0-wait-state 100 MHz execution from Flash, eliminating cache misses in deterministic real-time code |
| Batch Acquisition Mode (BAM) | Allows autonomous peripheral data capture (ADC, DFSDM, UART) during CPU sleep, reducing active power by >40% in sensor polling |
| Dual CAN 2.0B + USB OTG FS | Enables concurrent fieldbus communication and host/device USB connectivity without external bridge ICs |
| DFSDM + PDM interfaces | Supports direct stereo digital microphone input with hardware decimation, eliminating need for external audio codec |
| Flexible static memory controller (FSMC) | Drives parallel LCDs (8080/6800 modes), NOR flash, PSRAM, or SRAM up to 16-bit bus width with programmable timing |
Applications
| Motor Control System | Sensor Hub for Wearables |
|---|---|
Use Scenario: Closed-loop BLDC motor drive with field-oriented control (FOC) and real-time current sensing. IC Role / Device Role / Timing Role: Main controller executing FOC algorithm, managing PWM generation via TIM1/TIM8, sampling dual-shunt currents via 12-bit ADC at 2.4 MSPS. Use Value: ART Accelerator ensures jitter-free 100 MHz PWM timing; BAM enables background temperature/position sensor acquisition during motor commutation. | Use Scenario: Multi-sensor aggregation (accelerometer, gyroscope, HRM) in compact wearable with voice command support. IC Role / Device Role / Timing Role: Central sensor fusion node with PDM microphone input, I²C/SPI sensor interfaces, and BLE co-processor communication via USART. Use Value: Integrated DFSDM processes stereo PDM streams in hardware; low-power Stop mode (18 µA) extends battery life between motion-triggered wakeups. |
| Industrial PLC I/O Module | Smart HVAC Controller |
Use Scenario: DIN-rail mounted I/O expansion module with analog input, digital I/O, and CAN fieldbus interface. IC Role / Device Role / Timing Role: Real-time I/O manager handling 16-channel ADC sampling, isolated digital input debouncing, and CAN 2.0B messaging at 500 kbit/s. Use Value: 114 5V-tolerant GPIOs simplify level-shifting; FSMC supports optional local display or configuration EEPROM; dual CAN enables master/slave redundancy. | Use Scenario: Wall-mounted HVAC controller integrating environmental sensors, touch UI, and Wi-Fi module communication. IC Role / Device Role / Timing Role: Application processor running RTOS, driving capacitive touch via GPIO scan, communicating with Wi-Fi SoC over SDIO/USART, and managing RTC-based scheduling. Use Value: SDIO interface directly connects to Wi-Fi modules (e.g., ESP32-WROOM); RTC with subsecond accuracy enables precise heating/cooling cycle timing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32F407VGT6 | Same Cortex-M4 core, but 1 MB Flash/192 KB RAM, no DFSDM/PDM, no BAM, USB OTG HS (not FS-only) | Lacks stereo audio preprocessing; higher power in Stop mode (36 µA vs. 18 µA); targets general-purpose HMI over sensor/audio edge nodes | Select when USB high-speed host capability or larger SRAM is required; avoid for battery-powered audio/motor apps needing BAM/DFSDM |
| STM32F429ZIT6 | 180 MHz, 2 MB Flash/256 KB RAM, integrated LTDC RGB LCD controller, no BAM, higher active power | Optimized for high-res graphical displays; lacks low-power audio capture features; requires external SDRAM for full GUI performance | Choose for complex GUI with TFT-LCD; not suitable where sub-20 µA Stop mode or PDM microphone support is mandatory |
Compared with STM32F407VGT6 and STM32F429ZIT6, the STM32F412ZET6 uniquely balances 100 MHz real-time performance, ultra-low-power peripheral acquisition (BAM), and integrated audio preprocessing (DFSDM+PDM), making it optimal for battery-constrained industrial edge nodes and wearable sensor hubs.
Availability
STM32F412ZET6 is available at Aetrix Electronics and suitable for industrial PLCs, wearable sensor hubs, motor control systems, and smart HVAC controllers requiring stable component supply across long production lifecycles.
Supply support for STM32F412ZET6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for industrial, automotive, and consumer markets.
The STM32F412xE series is part of ST's mainstream Arm Cortex-M4 portfolio, engineered specifically for cost-sensitive, power-aware applications demanding rich connectivity (dual CAN, USB OTG FS), real-time analog acquisition, and extended low-power operation.
FAQ
Does STM32F412ZET6 support USB device, host, and OTG functionality simultaneously?
Yes - the integrated USB 2.0 full-speed OTG controller supports device, host, and on-the-go operation in a single silicon instance. It includes an internal PHY, session request protocol (SRP), and host negotiation protocol (HNP), enabling dynamic role switching without external components. Verified in ST AN4879 and RM0383 reference manual Section 33.
What is the maximum achievable ADC sampling rate with hardware oversampling enabled?
With the 12-bit ADC operating at 2.4 MSPS base rate and hardware oversampling (up to 256x), effective resolution increases to 16 bits at ~9.4 kSPS. Oversampling is performed in real time by the ADC's built-in digital filter, reducing CPU load and enabling precise DC measurements without external sigma-delta converters.
Can the STM32F412ZET6 drive a parallel RGB LCD without external controller?
Yes - the FSMC peripheral supports 8080/6800 parallel interface modes and can directly drive common 16-/18-bit RGB TFT panels up to 800×480 resolution. It provides dedicated address/data multiplexing, programmable timing registers, and NAND flash support, eliminating need for external display controllers in mid-range HMI designs.
How does Batch Acquisition Mode (BAM) reduce system power in sensor applications?
BAM allows peripherals like ADC, DFSDM, and USART to autonomously acquire and buffer data into memory via DMA while the CPU remains in Stop mode. This eliminates periodic wakeups for polling, cutting average current by up to 65% in intermittent sensor readout scenarios - confirmed in ST AN4740 Section 4.3 using STM32F412 Nucleo-144 measurements.
STM32F412ZET6 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 144-LQFP
- Series:
- STM32F4
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 100MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB OTG
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
- Number of I/O:
- 114
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
STM32F412ZET6 FAQ
1.How can I place an order for STM32F412ZET6 through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32F412ZET6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32F412ZET6 reliable?
The price and inventory of STM32F412ZET6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32F412ZET6 is usually 5 days.
3.What payment methods are accepted for STM32F412ZET6?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32F412ZET6 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STM32F412ZET6?
STM32F412ZET6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32F412ZET6 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32F412ZET6?
For technical support, including STM32F412ZET6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32F412ZET6 requirements.
6.How does Aetrix verify that STM32F412ZET6 is sourced from the original manufacturer or authorized distributors?
All STM32F412ZET6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32F412ZET6 meets industry standards.
7.What is the process for return or replacement of STM32F412ZET6?
All STM32F412ZET6 units undergo pre-shipment inspection (PSI). If there is an issue with STM32F412ZET6, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32F412ZET6 part is unused and in its original packaging.
Return procedure for STM32F412ZET6:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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