STMicroelectronics STM32F413MHY6TR

Overview

STM32F413MHY6TR from STMicroelectronics is an Arm® Cortex®-M4 32-bit microcontroller with FPU, 100 MHz max clock, 1.5 MB Flash, 320 KB SRAM, and integrated USB OTG FS, dual DACs, and DFSDM for audio/sensor processing. It operates from 1.7–3.6 V across –40 °C to 105 °C and targets embedded control with real-time analog interface in industrial HMI and smart sensor hubs.

For engineers reviewing the STM32F413MHY6TR datasheet, STM32F413MHY6TR pinout, STM32F413MHY6TR application, or STM32F413MHY6TR equivalent, key selection criteria include its WLCSP81 package footprint, 12-bit 2.4 MSPS ADC with 16 channels, dual 12-bit DACs, eBAM power efficiency mode, and support for PDM microphone arrays with sound source localization.

Technical Context

The device integrates an Adaptive Real-time Accelerator (ART Accelerator™) enabling zero-wait-state execution from Flash at 100 MHz, alongside a Dynamic Efficiency Line architecture supporting multiple low-power modes - including Stop mode with 15 µA typical current (Deep Power Down) and Standby mode at 1.1 µA (no RTC). Its memory subsystem includes flexible external static memory controller (FSMC) and Dual-mode Quad-SPI for expandable storage.

Peripherals are organized around a multi-AHB bus matrix with dedicated DMA streams: 16-stream general-purpose DMA, up to 18 timers (including two 32-bit advanced-control timers), three CAN 2.0B interfaces, SAI and I2S audio interfaces, and six digital filters for sigma-delta modulators (DFSDM) with stereo PDM input support - all coordinated via NVIC with 114 interrupt-capable I/Os.

Key Specifications

Pinout & Package

STM32F413MHY6TR uses the WLCSP81 (Wafer-Level Chip Scale Package) with 81 solder bumps in a 4.039 × 3.951 mm body, compliant with ECOPACK®2 environmental standards. Pin assignment follows ST's standardized ball map for high-density interconnect and minimal PCB footprint.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Arm Cortex-M4 microcontroller applications.

Compared with STM32F412ZGT6, STM32F413MHY6TR adds DFSDM and dual DACs for audio/sensor edge processing; versus STM32F429ZIT6, it trades display acceleration and Flash size for superior low-power analog acquisition and compact WLCSP packaging - making it optimal for space-constrained, sensor-rich industrial endpoints.

Availability

STM32F413MHY6TR is available at Aetrix Electronics and suitable for industrial HMI panels, smart sensor hubs, USB diagnostic tools, and energy meters requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for STM32F413MHY6TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power ICs, sensors, and automotive-grade components with emphasis on energy efficiency and industrial reliability.

The STM32F413 product line delivers high-performance Cortex-M4 MCUs optimized for real-time signal acquisition, low-power sensor fusion, and USB-connected edge devices - targeting industrial automation, building controls, and intelligent instrumentation.

FAQ

What is the maximum operating frequency and how is it achieved?

The STM32F413MHY6TR achieves 100 MHz maximum CPU frequency using its internal PLL with HSE or HSI as source, enabled by the ART Accelerator™ which eliminates Flash wait states. This requires proper VCAP capacitor placement (2.2 µF each on VCAP1/VCAP2) and stable 1.7–3.6 V supply within ±100 mV ripple limits per datasheet Section 6.3.2.

Does this MCU support USB device, host, and OTG functionality simultaneously?

Yes - the integrated USB 2.0 full-speed OTG controller supports device, host, and dual-role operation via software configuration. It includes an on-chip PHY, so no external transceiver is needed. The USB clock is derived from the 48 MHz PLL output, requiring either HSE or MSI as clock source per Section 3.33 of DS11581 Rev 7.

How many PDM microphones can be connected and processed concurrently?

Up to four PDM microphones can be connected and processed concurrently using the six-channel DFSDM peripheral: two stereo pairs (left/right) mapped to separate DFSDM channels, with dynamic delay tuning for sound source localization. Each channel supports programmable oversampling ratios and digital filtering - confirmed in Section 3.29 and Table 8 of the datasheet.

What are the key layout requirements for the WLCSP81 package?

WLCSP81 requires microvia-in-pad construction, 0.3 mm minimum solder mask defined pads, and strict thermal relief on VDD/VSS balls. ST recommends 8-mil trace width for high-current paths and symmetric fanout to minimize skew. Decoupling capacitors (100 nF ceramic) must be placed within 2 mm of each VDD/VDDA ball, with VCAP1/VCAP2 capacitors mounted directly adjacent to their respective pins per Section 7.2 of DS11581 Rev 7.