STMicroelectronics STM32F413VGT3
- Part No.:
- STM32F413VGT3
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
STM32F413VGT3.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 100LQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
STM32F413VGT3 from STMicroelectronics is an Arm® Cortex®-M4 32-bit microcontroller with FPU, 100 MHz max CPU frequency, 1.5 MB Flash, 320 KB SRAM, and integrated USB OTG FS, dual DACs, and DFSDM for audio/sensor processing. It targets embedded control systems requiring real-time signal acquisition, low-power operation, and rich peripheral integration - such as industrial HMI, portable medical devices, and smart sensor hubs.
For engineers reviewing the STM32F413VGT3 datasheet, STM32F413VGT3 pinout, STM32F413VGT3 application, or STM32F413VGT3 equivalent, key selection criteria include its 100 MHz ART-accelerated execution from Flash, -40°C to 105°C extended temperature grade, LQFP100 package with 82 GPIOs, and dual-mode Quad-SPI interface for external memory expansion.
Technical Context
The STM32F413VGT3 implements an Adaptive Real-time Accelerator (ART Accelerator™) enabling zero-wait-state execution from Flash at 100 MHz, paired with a Memory Protection Unit (MPU) for secure task isolation in RTOS environments. Its enhanced Batch Acquisition Mode (eBAM) optimizes ADC/DAC/DFSDM data throughput for synchronized multi-channel sensing.
It integrates two independent 12-bit DACs with configurable output buffers, one 12-bit 2.4 MSPS ADC with up to 16 channels, and six digital filters for sigma-delta modulators (DFSDM), supporting stereo PDM microphone input and sound source localization - all operating under dynamic voltage scaling (1.7–3.6 V).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M4 with FPU and DSP instructions, delivering 125 DMIPS @ 100 MHz for real-time math-intensive tasks. |
| Flash / RAM | 1.5 MB embedded Flash (with 512 B OTP) and 320 KB SRAM - sufficient for complex firmware with large buffers and OTA update staging. |
| ADC/DAC | 1×12-bit 2.4 MSPS ADC (16 channels); 2×12-bit DACs with output buffers - enables simultaneous analog stimulus generation and high-speed acquisition. |
| DFSDM | 6-channel digital filter for sigma-delta modulators with PDM input support - allows direct connection of MEMS microphones without external decimation hardware. |
| USB & Connectivity | USB 2.0 Full-Speed OTG controller with integrated PHY; 3×CAN 2.0B; 10×UART/USART; 5×SPI/I2S - supports mixed wired/wireless edge node communication stacks. |
| Power Efficiency | Run mode: 112 µA/MHz (peripheral off); Stop mode: 15 µA typ. (Deep power down); Standby: 1.1 µA typ. - suitable for battery-powered applications with aggressive duty cycling. |
| Temperature Range | -40°C to +105°C industrial grade - validated for operation in enclosed enclosures or ambient-temperature-variable environments. |
| Package | LQFP100 (14 × 14 mm, 0.5 mm pitch) with 82 user I/Os, 114 total pins including power/ground - compatible with standard PCB assembly and debug probe access. |
Pinout & Package
LQFP100 package with exposed thermal pad (ECOPACK®2 compliant), 14 × 14 mm body, 0.5 mm pitch, and 100 leads. Pin count includes 82 general-purpose I/Os (5 V-tolerant on most), 5 dedicated power/ground pins (VDD/VSS), 2 VCAP capacitors, NRST, BOOT0, and dedicated clock/reset/USB/RTC/DFSDM/SAI pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Main power supply and ground | 1.7–3.6 V core/io rail; requires local 100 nF + 4.7 µF decoupling per VDD pair. |
| VCAP_1, VCAP_2 | Internal regulator bypass | Must connect 2.2 µF ceramic capacitors to stabilize internal 1.2 V regulator; critical for startup stability. |
| NRST | Active-low reset input | Asynchronous reset with Schmitt trigger; supports external pull-up and debounced push-button reset. |
| BOOT0 | Boot mode selection | High at reset forces system memory boot (for ISP via USART); low enables user Flash boot. |
| PA0–PA15, PB0–PB15, etc. | General-purpose I/O | 82 pins support multiple alternate functions (AF0–AF15); most are 5 V-tolerant, enabling direct interfacing with legacy logic. |
| PA11/PA12 | USB OTG FS D+/D− | Dedicated full-speed USB transceiver pins with internal pull-ups; require 27 Ω series resistors and ESD protection per USB spec. |
| PD12–PD15 | DFSDM1_DATIN0–3 | Four dedicated PDM data inputs for sigma-delta microphone streams; support synchronous sampling across channels. |
| PA4–PA5 | DAC1_OUT1 / DAC2_OUT1 | Two buffered analog outputs with 12-bit resolution; each supports noise shaping and configurable settling time. |
Key Features
| Feature | Design Value |
|---|---|
| eBAM (Enhanced Batch Acquisition Mode) | Hardware-accelerated synchronized sampling across ADC, DAC, and DFSDM - reduces CPU load by >70% in continuous audio capture scenarios. |
| ART Accelerator™ | Zero-wait-state Flash execution at 100 MHz - eliminates instruction cache misses and ensures deterministic interrupt latency (<12 cycles). |
| Dual DAC with Output Buffers | Independent 12-bit outputs with programmable gain and noise-shaping filters - enables precise analog waveform generation without external op-amps. |
| DFSDM with PDM Support | Six digital filters accepting 1-bit PDM streams at up to 100 MHz clock rate - replaces external decimation ICs in voice-enabled edge devices. |
| Flexible External Memory Interface | FSMC supporting SRAM, PSRAM, NOR Flash with 16-bit data bus - enables expansion of code/data space beyond on-chip limits. |
| Low-Power Timer (LPTIM1) | Sub-microamp timer running from LSE/LSI during Stop/Standby modes - provides accurate wake-up intervals without waking the main CPU. |
Applications
| Industrial HMI Controller | Portable Medical Sensor Hub |
|---|---|
Use Scenario: Touchscreen-based control panel for PLC-connected machinery with real-time status visualization and alarm logging. IC Role / Device Role / Timing Role: Main application processor handling GUI rendering, CAN bus diagnostics, and USB host firmware updates. Use Value: 100 MHz ART-accelerated Flash execution ensures smooth 60 Hz UI refresh; dual DACs drive analog meter displays; DFSDM monitors acoustic bearing health. | Use Scenario: Battery-powered wearable device acquiring ECG, SpO₂, and respiration signals for remote patient monitoring. IC Role / Device Role / Timing Role: Central sensor fusion MCU managing ultra-low-power sleep cycles, PDM microphone array, and BLE-ready UART-to-host interface. Use Value: 15 µA Stop mode current extends battery life to >7 days; DFSDM processes stereo PDM mic inputs for cough detection; RTC maintains timestamp accuracy across power cycles. |
| Smart Building Environmental Node | Audio-Enabled Industrial Gateway |
Use Scenario: Wall-mounted air quality monitor integrating CO₂, VOC, temperature, and humidity sensors with LoRaWAN backhaul. IC Role / Device Role / Timing Role: Primary data aggregator and preprocessing unit performing sensor calibration, filtering, and packet formatting before RF transmission. Use Value: 320 KB SRAM buffers multi-sensor readings between transmissions; 1.7–3.6 V supply range accommodates wide-input DC-DC converters; 105°C rating supports attic/ceiling deployment. | Use Scenario: Factory-floor gateway collecting vibration, noise, and thermal data from rotating equipment and streaming to cloud analytics platforms. IC Role / Device Role / Timing Role: Real-time audio acquisition engine capturing broadband vibration spectra via MEMS microphones and performing FFT preprocessing. Use Value: Six DFSDM channels enable simultaneous 6-channel PDM acquisition; dual DACs generate reference test tones; USB OTG FS exports captured waveforms directly to PC tools. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance Cortex-M4 microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32F412ZGT6 | Same LQFP144 package; 1 MB Flash, 256 KB RAM; no DFSDM; single DAC; lower temperature grade (–40°C to 85°C). | Lacks PDM microphone support and dual DACs - unsuitable for audio-centric designs but adequate for motor control or display-only HMIs. | Select when DFSDM/audio features are unnecessary and higher I/O count (114) is preferred over extended temperature operation. |
| STM32F429ZIT6 | LQFP144; 2 MB Flash, 256 KB RAM; integrated LCD-TFT controller; no DFSDM; dual CAN; higher max frequency (180 MHz) but no eBAM. | Optimized for graphical display applications with built-in LTDC; lacks dedicated sigma-delta filtering - requires external decimation for PDM mics. | Choose for high-resolution color display systems where TFT interface and larger Flash outweigh need for embedded audio preprocessing. |
Compared with STM32F412ZGT6 and STM32F429ZIT6, the STM32F413VGT3 uniquely combines extended temperature operation, DFSDM-based PDM audio acquisition, and dual DACs in an LQFP100 footprint - making it the only option among the three for compact, battery-efficient, audio-aware edge nodes requiring industrial-grade reliability.
Availability
STM32F413VGT3 is available at Aetrix Electronics and suitable for industrial HMI, portable medical devices, smart building environmental nodes, and audio-enabled industrial gateways requiring stable component supply across long production lifecycles.
Supply support for STM32F413VGT3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in microcontrollers, power management, sensors, and automotive ICs with strong industrial and automotive qualifications.
The STM32F4 Series targets high-performance embedded applications demanding real-time processing, rich analog/peripheral integration, and energy efficiency - especially where DSP, audio, or sensor fusion capabilities are central to system architecture.
FAQ
What is the maximum operating frequency and how is it achieved?
The STM32F413VGT3 achieves 100 MHz CPU frequency using its Adaptive Real-time Accelerator (ART Accelerator™), which pre-fetches and caches instructions from Flash memory to eliminate wait states. This is validated across the full 1.7–3.6 V supply range and –40°C to +105°C temperature range, with no external clock multiplier required.
Does the STM32F413VGT3 support true hardware random number generation?
Yes - it integrates a certified True Random Number Generator (RNG) compliant with NIST SP800-90B and AIS-31 standards. The RNG uses analog entropy sources and includes built-in health tests, delivering cryptographically secure 32-bit words via dedicated register reads without software post-processing.
How many PDM microphone channels can be processed simultaneously?
The STM32F413VGT3 supports up to six concurrent PDM microphone inputs via its DFSDM peripheral, with dedicated data input pins (e.g., PD12–PD15, PE7–PE8). Each DFSDM channel performs real-time decimation and filtering, enabling stereo or multi-mic array processing without CPU intervention.
What are the mandatory external components for stable operation?
Mandatory components include two 2.2 µF X7R ceramic capacitors on VCAP_1 and VCAP_2 pins, 100 nF + 4.7 µF decoupling per VDD/VSS pair, a 4–26 MHz crystal for HSE (if used), and a 32.768 kHz crystal for RTC. NRST requires a 10 kΩ pull-up; BOOT0 needs a 10 kΩ pull-down for normal Flash boot.
STM32F413VGT3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 100-LQFP
- Series:
- STM32F4
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 100MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, IrDA, LINbus, MMC/SDIO, QSPI, SAI, SPI, UART/USART, USB OTG
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
- Number of I/O:
- 81
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 320K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 16x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
STM32F413VGT3 FAQ
1.How can I place an order for STM32F413VGT3 through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32F413VGT3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32F413VGT3 reliable?
The price and inventory of STM32F413VGT3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32F413VGT3 is usually 5 days.
3.What payment methods are accepted for STM32F413VGT3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32F413VGT3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STM32F413VGT3?
STM32F413VGT3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32F413VGT3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32F413VGT3?
For technical support, including STM32F413VGT3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32F413VGT3 requirements.
6.How does Aetrix verify that STM32F413VGT3 is sourced from the original manufacturer or authorized distributors?
All STM32F413VGT3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32F413VGT3 meets industry standards.
7.What is the process for return or replacement of STM32F413VGT3?
All STM32F413VGT3 units undergo pre-shipment inspection (PSI). If there is an issue with STM32F413VGT3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32F413VGT3 part is unused and in its original packaging.
Return procedure for STM32F413VGT3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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