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STMicroelectronics STM32F413VGT3TR

Part No.:
STM32F413VGT3TR
Manufacturer:
STMicroelectronics
Category:
Microcontrollers
Package:
100-LQFP
Datasheet:
AetrixSTM32F413VGT3TR.pdf
Description:
IC MCU 32BIT 1MB FLASH 100LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,095

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Product details

Overview

STM32F413VGT3TR from STMicroelectronics is a 32-bit Arm® Cortex®-M4 microcontroller with FPU, 100 MHz max CPU frequency, 1.5 MB Flash, 320 KB SRAM, and integrated USB OTG FS, dual DACs, and DFSDM for audio/sensor processing. It operates from 1.7–3.6 V across –40 °C to 105 °C and targets industrial HMI, sensor hubs, and USB-connected embedded control systems.

For engineers reviewing the STM32F413VGT3TR datasheet, STM32F413VGT3TR pinout, STM32F413VGT3TR application, or STM32F413VGT3TR equivalent, key selection criteria include its 100 MHz real-time performance with ART Accelerator™, dual 12-bit DACs for analog output generation, 2.4 MSPS 12-bit ADC for fast signal acquisition, and support for PDM microphone arrays via 6-channel DFSDM.

Technical Context

The device integrates an Adaptive Real-Time Accelerator (ART Accelerator™) enabling zero-wait-state execution from Flash at 100 MHz, and features eBAM for optimized batch data capture in sensor applications. Its memory subsystem includes flexible external static memory controller (FSMC) supporting NOR/PSRAM and Dual-mode Quad-SPI for high-speed serial flash.

It implements three CAN 2.0B controllers, one SAI interface, five SPI/I2S peripherals (two full-duplex I2S), and a dedicated low-power timer (LPTIM1) for precise timing in energy-constrained modes - all synchronized via a multi-source clock tree with PLL, audio PLL (PLLI2S), and RTC calibration.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm Cortex-M4 with FPU and DSP instructions; enables floating-point math and real-time signal processing without external coprocessor.
Max Clock Frequency100 MHz with ART Accelerator™; delivers 125 DMIPS and deterministic interrupt latency for hard real-time control loops.
Flash Memory1.5 MB embedded Flash; supports over-the-air firmware updates and dual-bank operation for safe in-field upgrades.
SRAM320 KB SRAM including 64 KB CCM (core-coupled memory); provides zero-wait-state access for critical code/data buffers.
Analog Peripherals1×12-bit 2.4 MSPS ADC (16 channels), 2×12-bit DACs, 6×DFSDM filters; enables simultaneous high-fidelity sensor sampling and analog waveform generation.
Connectivity3×CAN 2.0B, 10×UART/USART (2×12.5 Mbit/s), 4×I²C, 5×SPI/I²S, SDIO, USB OTG FS; supports industrial fieldbus, audio streaming, and secure peripheral expansion.
Power Efficiency112 µA/MHz run mode (peripheral off); 15 µA Stop mode (Deep power down); enables battery-backed operation for >1-year sensor node lifetime.

Pinout & Package

LQFP64 (10 × 10 mm, 0.5 mm pitch) package with ECOPACK®2 environmental compliance and 64-pin I/O mapping including 51 fast GPIOs (50 MHz), 16 ADC channels, and dedicated DFSDM/PDM pins.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VSSCore & I/O power supplySeparate 1.7–3.6 V domains enable noise isolation between analog/digital sections and flexible PCB routing.
VCAP_1 / VCAP_2Internal regulator decouplingRequires external 2.2 µF ceramic capacitors; critical for stable 1.2 V core voltage under dynamic load transitions.
PA0–PA15, PB0–PB15, etc.General-purpose I/O51 pins support 5 V-tolerant inputs; configurable as EXTI sources, timers, or communication interfaces with remappable alternate functions.
PA0–PA5, PB0–PB1ADC input channels16-channel 12-bit ADC with hardware oversampling and injected conversion sequencing for multi-sensor synchronization.
PA4–PA5, PA6–PA7DAC outputsTwo independent 12-bit DACs with buffer amplifiers; support continuous waveform generation and triangle/sawtooth synthesis.
PC1–PC7, PD0–PD7DFSDM data/clock lines6-channel sigma-delta filter interface with PDM microphone input support and dynamic delay tuning for sound source localization.

Key Features

FeatureDesign Value
eBAM (enhanced Batch Acquisition Mode)Reduces CPU overhead during burst sensor reads by automating DMA-triggered ADC/DAC sequences without software intervention.
ART Accelerator™Eliminates Flash wait states at 100 MHz, enabling deterministic execution of time-critical ISR and control algorithms directly from non-volatile memory.
DFSDM with PDM supportProcesses up to 6 PDM microphone streams simultaneously with hardware filtering and stereo source localization via dynamic delay compensation.
Flexible static memory controller (FSMC)Supports parallel NOR/PSRAM/NAND with 8-/16-bit data bus and programmable timing; enables direct connection to external displays or legacy peripherals.
Low-power timer (LPTIM1)Asynchronous 32-bit timer running from LSE/LSI; provides precise wake-up intervals in Stop/Standby modes with sub-millisecond accuracy.

Applications

Industrial Sensor HubUSB-Capable Embedded Controller

Use Scenario: Multi-sensor data aggregation (temperature, pressure, vibration) with local preprocessing and USB-based telemetry upload.

IC Role / Device Role / Timing Role: Central MCU executing sensor fusion algorithms, managing DFSDM-accelerated PDM microphone arrays, and acting as USB OTG FS device for host communication.

Use Value: On-chip DFSDM and dual DACs eliminate external audio codec ICs; USB OTG FS enables plug-and-play firmware updates and diagnostics without additional USB bridge chips.

Use Scenario: Field-deployable PLC I/O module requiring CAN bus integration, analog output control, and USB configuration interface.

IC Role / Device Role / Timing Role: Real-time controller handling 3×CAN 2.0B networks, generating analog setpoints via dual DACs, and serving as USB device for parameter programming.

Use Value: Integrated CAN transceivers (with external PHY) and dual 12-bit DACs reduce BOM count; 100 MHz Cortex-M4 ensures deterministic response to CAN message deadlines.

Smart Display ControllerAudio-Enabled Edge Node

Use Scenario: 4.3-inch TFT-LCD HMI with touch interface, local button logic, and real-time status visualization.

IC Role / Device Role / Timing Role: Graphics controller driving parallel LCD interface (8080/6800 modes), managing touch ADC scans, and rendering UI via DMA2D-assisted frame buffer updates.

Use Value: Built-in LCD parallel interface eliminates external display controller IC; FSMC allows direct connection to SRAM-based display memory for smooth animation.

Use Scenario: Voice-command-enabled IoT gateway using PDM microphones and local keyword spotting before cloud offload.

IC Role / Device Role / Timing Role: Audio front-end processor performing PDM-to-PCM conversion, noise suppression, and feature extraction using DFSDM + Cortex-M4 DSP instructions.

Use Value: Hardware-accelerated DFSDM filters reduce CPU load by >70% vs. software-only PDM demodulation; 320 KB SRAM accommodates large audio buffers and neural inference models.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STM32F412ZGT6Same LQFP144 package; 1 MB Flash, 256 KB SRAM, no DFSDM, single DAC, lower temperature grade (–40 to 85 °C).Lacks PDM microphone support and dual DAC capability; suitable for cost-sensitive motor control but not audio/sensor hub use cases.Select when DFSDM and extended temperature range are not required and BOM cost reduction is prioritized.
STM32F429ZIT6LQFP144; 2 MB Flash, 256 KB SRAM, Chrom-ART accelerator, LCD-TFT controller, no DFSDM, single DAC.Includes built-in TFT-LCD controller and higher Flash density; lacks DFSDM and second DAC, limiting audio preprocessing capability.Prefer for high-resolution display applications where graphics acceleration outweighs audio processing needs.

Compared with STM32F412ZGT6 and STM32F429ZIT6, the STM32F413VGT3TR uniquely combines DFSDM-based PDM processing, dual DACs, and 105 °C operation in LQFP64 - making it optimal for compact, thermally demanding audio-sensor edge nodes where space and thermal resilience are critical.

Availability

STM32F413VGT3TR is available at Aetrix Electronics and suitable for industrial sensor hubs, USB-connected embedded controllers, and smart display modules requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for STM32F413VGT3TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in microcontrollers, power management, sensors, and automotive ICs with strong R&D investment in ARM-based embedded solutions.

The STM32F4 Series targets high-performance real-time applications requiring DSP capability, rich connectivity, and advanced analog integration - designed specifically for industrial automation, medical devices, and audio/sensor edge computing.

FAQ

What is the maximum operating temperature rating for STM32F413VGT3TR?

The STM32F413VGT3TR is rated for operation from –40 °C to +105 °C ambient temperature. This extended temperature grade is validated per ST's production test specifications and supports deployment in industrial enclosures without active cooling, such as motor drives and outdoor sensor gateways.

Does STM32F413VGT3TR support USB device, host, and OTG functionality?

Yes - the part integrates a full-speed USB 2.0 OTG controller with on-chip PHY, supporting device, host, and OTG roles. It complies with USB 2.0 specification and includes dedicated endpoints, DMA support, and battery charging detection (BCD) for portable applications.

How many DFSDM channels does STM32F413VGT3TR provide, and what is their primary use case?

The STM32F413VGT3TR includes six digital filters for sigma-delta modulators (DFSDM), each supporting PDM microphone input with hardware decimation and dynamic delay tuning. These are primarily used for far-field voice capture, acoustic beamforming, and sound source localization in edge AI audio applications.

Is the LQFP64 package of STM32F413VGT3TR RoHS and REACH compliant?

Yes - the LQFP64 package carries STMicroelectronics' ECOPACK®2 certification, confirming full compliance with RoHS Directive 2011/65/EU and REACH Regulation (EC) No. 1907/2006, including restrictions on SVHC substances and lead-free solderability per J-STD-020.

STM32F413VGT3TR Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Package/Case:
100-LQFP
Series:
STM32F4
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, LINbus, MMC/SDIO, QSPI, SAI, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
81
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
320K x 8
Voltage - Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 16x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

STM32F413VGT3TR FAQ

1.How can I place an order for STM32F413VGT3TR through Aetrix?

Please submit a Request for Quotation (RFQ) for STM32F413VGT3TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STM32F413VGT3TR reliable?

The price and inventory of STM32F413VGT3TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32F413VGT3TR is usually 5 days.

3.What payment methods are accepted for STM32F413VGT3TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32F413VGT3TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STM32F413VGT3TR?

STM32F413VGT3TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STM32F413VGT3TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STM32F413VGT3TR?

For technical support, including STM32F413VGT3TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32F413VGT3TR requirements.

6.How does Aetrix verify that STM32F413VGT3TR is sourced from the original manufacturer or authorized distributors?

All STM32F413VGT3TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32F413VGT3TR meets industry standards.

7.What is the process for return or replacement of STM32F413VGT3TR?

All STM32F413VGT3TR units undergo pre-shipment inspection (PSI). If there is an issue with STM32F413VGT3TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STM32F413VGT3TR part is unused and in its original packaging.

Return procedure for STM32F413VGT3TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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