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STMicroelectronics STM32F722IET6
- Part No.:
- STM32F722IET6
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- 176-LQFP
- Datasheet:
-
STM32F722IET6.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 176LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,956
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Product details
Overview
STM32F722IET6 from STMicroelectronics is a high-performance Arm® Cortex®-M7 32-bit microcontroller with FPU, delivering 462 DMIPS at 216 MHz, featuring 512 KB Flash, 256+16+4 KB SRAM (including TCM and backup), USB OTG HS/FS, three 12-bit ADCs (2.4 MSPS), two 12-bit DACs, and up to 18 timers - deployed in industrial motor control systems requiring deterministic real-time response and multi-interface connectivity.
For engineers reviewing the STM32F722IET6 datasheet, STM32F722IET6 pinout, STM32F722IET6 application, or STM32F722IET6 equivalent, key selection considerations include its dual-mode Quad-SPI interface for external memory expansion, 140 GPIOs with 108 MHz toggle rate and 138 5 V-tolerant pins, ART Accelerator-enabled zero-wait-state Flash execution, and integrated USB HS PHY with dedicated DMA - all critical for embedded HMI, edge gateway, and audio-accelerated IoT node designs.
Technical Context
The STM32F722IET6 implements an adaptive real-time accelerator (ART Accelerator) with 8 KB instruction and 8 KB data L1 cache, enabling deterministic 0-wait-state execution from Flash or external memories. Its AXI-AHB bus matrix supports concurrent high-bandwidth access between CPU, DMA, and peripherals including FMC, SAI, and USB OTG HS.
It integrates dual USB controllers: one full-speed OTG with on-chip PHY, and one high-speed/full-speed OTG with dedicated DMA, on-chip FS PHY, and selectable HS PHY or ULPI interface - enabling simultaneous host/device roles with minimal latency. The bxCAN 2.0B controller operates independently of USB timing domains, supporting automotive-grade diagnostics and firmware updates over CAN FD-capable networks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M7 with FPU, 216 MHz max frequency, 462 DMIPS performance - enables complex control algorithms and real-time signal processing without external coprocessors. |
| Memory | 512 KB Flash (with PCROP protection), 256 KB data TCM + 16 KB instruction TCM + 4 KB backup SRAM - supports secure firmware storage, time-critical ISR execution, and RTC-persistent data retention. |
| ADC/DAC | 3×12-bit ADCs (2.4 MSPS each, 7.2 MSPS interleaved), 2×12-bit DACs - sufficient for simultaneous sampling of motor phase currents and analog feedback loops in servo drives. |
| Timers | Up to 18 timers: 13×16-bit, 2×32-bit, plus SysTick, watchdogs, and low-power timer - provides independent PWM generation, encoder counting, and precise timebase for motion control and power conversion. |
| Connectivity | 1×CAN 2.0B, 3×I²C, 4×USART/UART, 5×SPI (54 Mbit/s), 2×SAI, USB OTG HS/FS - enables multi-protocol fieldbus integration, audio streaming, and high-throughput debug/data transfer. |
| I/O Capability | 140 I/Os: 136 fast I/Os (108 MHz), 138 5 V-tolerant - allows direct interfacing with legacy industrial sensors, level-shifter-free logic, and robust noise immunity in factory environments. |
| Package | LQFP100 (14 × 14 mm), 100-pin quad flat package - compatible with standard PCB assembly processes and offers balanced thermal performance for convection-cooled industrial modules. |
Pinout & Package
LQFP100 (14 × 14 mm) package with exposed thermal pad; 100-pin quad flat leaded configuration optimized for industrial temperature range (–40°C to +105°C) and reflow-compatible assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VSS, VSSA | Power supply and ground rails | Dual-domain 1.7–3.6 V core/analog supply with separate analog ground - ensures clean ADC/DAC reference and minimizes digital switching noise coupling. |
| PA0–PA15, PB0–PB15, etc. | General-purpose I/O banks | 140 total GPIOs grouped into 5 banks (A–E), each with configurable pull-up/down, alternate functions, and interrupt capability - supports flexible peripheral mapping and board-level routing optimization. |
| PC13–PC15 | RTC oscillator terminals | 32 kHz crystal input/output for hardware calendar and subsecond-accurate RTC - enables battery-backed timekeeping during Stop/Standby modes with 4 KB backup SRAM retention. |
| PA11/PA12 | USB FS DP/DM | Full-speed USB 2.0 differential pair with integrated transceiver - eliminates need for external PHY in device/host applications requiring HID, CDC, or MSC class compliance. |
| PA11/PA12 + PB14/PB15 | USB HS ULPI interface | High-speed USB 2.0 interface via ULPI (8-bit parallel) - enables 480 Mbit/s throughput with external HS PHY while retaining internal FS PHY for fallback operation. |
| PD0–PD15 | FMC address/data bus | Flexible Memory Controller interface supporting NOR/NAND/PSRAM/SDRAM - permits expansion of code/data space beyond internal Flash/SRAM for large GUI or firmware-over-the-air buffers. |
Key Features
| Feature | Design Value |
|---|---|
| ART Accelerator + L1 cache | Enables zero-wait-state execution from Flash memory at 216 MHz - eliminates instruction fetch stalls and guarantees deterministic interrupt latency for safety-critical control loops. |
| Dual USB OTG controllers | Independent FS and HS controllers with dedicated DMA channels - allows concurrent USB device enumeration and high-speed data streaming without CPU intervention or bandwidth contention. |
| TCM RAM allocation | 256 KB data TCM + 16 KB instruction TCM - reserves tightly coupled memory for time-critical ISR stacks, PID coefficients, and real-time task contexts with guaranteed sub-cycle access. |
| Quad-SPI dual-mode interface | Supports both standard and memory-mapped XIP operation on external flash - enables seamless boot-from-external-memory and dynamic code overlay for feature-rich firmware updates. |
| 138 5 V-tolerant I/Os | Eliminates external level shifters when interfacing with 5 V sensors, PLC I/O modules, or legacy industrial buses - reduces BOM cost and improves system reliability in mixed-voltage environments. |
Applications
| Industrial Motor Control | Human-Machine Interface (HMI) |
|---|---|
Use Scenario: Closed-loop vector control of 3-phase PMSM/BLDC motors in CNC spindles and robotic joints. IC Role / Device Role / Timing Role: Real-time execution of FOC algorithms, PWM generation, encoder position capture, and current sensing via triple interleaved ADCs. Use Value: 216 MHz Cortex-M7 with TCM RAM ensures <1 µs interrupt latency for current loop closure, while 512 KB Flash accommodates dual-bank firmware for safe OTA updates. | Use Scenario: Touch-enabled industrial panel with graphics rendering, audio alerts, and Ethernet/CAN diagnostics. IC Role / Device Role / Timing Role: Application processor managing TFT display via LTDC, audio playback via SAI, and multi-protocol communication via USART/CAN/USB. Use Value: Dual USB OTG (HS + FS) enables simultaneous firmware download and HID keyboard/mouse support; 2×SAI interfaces drive stereo audio with class-D amplifier control. |
| Edge Gateway Node | Audio-Enhanced IoT Sensor Hub |
Use Scenario: Field-deployed gateway aggregating Modbus RTU, CAN, and BLE sensor data for cloud upload via Ethernet or LTE. IC Role / Device Role / Timing Role: Protocol translation engine with hardware-accelerated CRC, crypto unit, and multi-interface concurrency management. Use Value: Flexible external memory controller supports NAND flash for local log buffering; 18 timers coordinate precise polling intervals across 7 serial interfaces without software overhead. | Use Scenario: Smart acoustic monitoring device detecting machine anomalies using FFT-based spectral analysis. IC Role / Device Role / Timing Role: Signal acquisition and preprocessing unit with 3×ADC synchronized sampling, DSP instructions, and audio PLL clocking for SAI. Use Value: 12-bit ADCs at 7.2 MSPS (interleaved) capture wideband vibration spectra; audio PLL (PLLI2S) delivers jitter-free 44.1/48 kHz sampling clocks to external codecs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32F767ZIT6 | Higher Flash (2 MB), adds Ethernet MAC, no USB HS PHY - requires external PHY for HS operation. | Better suited for networked industrial controllers needing TCP/IP stack offload and larger firmware images. | Select when Ethernet connectivity and >1 MB code space outweigh USB HS PHY integration. |
| STM32H743VIT6 | Dual-core (Cortex-M7 + M4), 1 MB Flash, 1 MB RAM, higher clock (480 MHz), no USB HS PHY - uses external ULPI PHY only. | Targeted at asymmetric multiprocessing: M7 for control, M4 for comms/audio; requires more complex toolchain and memory partitioning. | Choose for applications demanding parallel processing, advanced security (TrustZone), or higher compute density - not for USB HS PHY simplicity. |
Compared with STM32F767ZIT6 and STM32H743VIT6, the STM32F722IET6 uniquely balances USB HS PHY integration, deterministic real-time performance via ART Accelerator and TCM RAM, and industrial-grade I/O tolerance - making it optimal for cost-sensitive, USB-centric edge nodes where external PHY complexity and dual-core overhead are undesirable.
Availability
STM32F722IET6 is available at Aetrix Electronics and suitable for industrial motor control, human-machine interface (HMI), edge gateway nodes, and audio-enhanced IoT sensor hubs requiring stable component supply, long-term lifecycle assurance, and consistent parametric performance across production batches.
Supply support for STM32F722IET6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in microcontrollers, power management, sensors, and automotive ICs - serving industrial, automotive, and consumer markets with scalable, certified, and eco-designed silicon solutions.
The STM32F7 series targets high-end embedded applications demanding real-time determinism, rich connectivity, and advanced signal processing - designed specifically for industrial automation, medical devices, and smart infrastructure where performance-per-watt and functional safety readiness are essential.
FAQ
What is the maximum operating temperature range for the STM32F722IET6?
The STM32F722IET6 is qualified for industrial temperature range: –40°C to +105°C ambient. This rating is validated per JEDEC JESD47 and applies to all LQFP100 packages under specified voltage and load conditions. Thermal derating is not required within this range when PCB layout follows ST's AN4821 guidelines for copper pour and thermal vias.
Does the STM32F722IET6 support hardware encryption acceleration?
No, the STM32F722IET6 does not integrate a cryptographic accelerator (AES, SHA, PKA). It relies on software libraries (e.g., mbed TLS) or external secure elements for encryption. For hardware-accelerated crypto, consider STM32F76xxx or STM32H7xx variants which include AES-128/256, HASH, and PKA engines.
Can the STM32F722IET6 boot directly from external Quad-SPI flash?
Yes - the STM32F722IET6 supports XIP (execute-in-place) mode from Quad-SPI memory via its QUADSPI peripheral. Boot mode selection (BOOT0/BOOT1 pins) configures the device to execute initial code from external flash, provided the memory is properly initialized and mapped in the FMC address space per RM0410 Section 3.4.3.
Is the USB HS PHY integrated or external on the STM32F722IET6?
The STM32F722IET6 integrates a full-speed USB PHY but requires an external high-speed PHY for USB 2.0 HS operation. It provides ULPI (UTMI+ Low Pin Count) interface pins (PB14–PB15 and associated control lines) to connect industry-standard HS PHYs such as SMSC USB334x or Microchip USB5744 - confirmed in DS11853 Section 3.30 and Table 10 pin definitions.
STM32F722IET6 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 176-LQFP
- Series:
- STM32F7
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M7
- Core Size:
- 32-Bit Single-Core
- Speed:
- 216MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SAI, SPI, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
- Number of I/O:
- 140
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 24x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
STM32F722IET6 FAQ
1.How can I place an order for STM32F722IET6 through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32F722IET6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32F722IET6 reliable?
The price and inventory of STM32F722IET6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32F722IET6 is usually 5 days.
3.What payment methods are accepted for STM32F722IET6?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32F722IET6 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STM32F722IET6?
STM32F722IET6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32F722IET6 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32F722IET6?
For technical support, including STM32F722IET6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32F722IET6 requirements.
6.How does Aetrix verify that STM32F722IET6 is sourced from the original manufacturer or authorized distributors?
All STM32F722IET6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32F722IET6 meets industry standards.
7.What is the process for return or replacement of STM32F722IET6?
All STM32F722IET6 units undergo pre-shipment inspection (PSI). If there is an issue with STM32F722IET6, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32F722IET6 part is unused and in its original packaging.
Return procedure for STM32F722IET6:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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