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STMicroelectronics STM32F723ZEI6

Part No.:
STM32F723ZEI6
Manufacturer:
STMicroelectronics
Category:
Microcontrollers
Package:
144-UFBGA
Datasheet:
AetrixSTM32F723ZEI6.pdf
Description:
IC MCU 32BIT 512KB FLSH 144UFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,843

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Product details

Overview

STM32F723ZEI6 from STMicroelectronics is a high-performance Arm® Cortex®-M7 32-bit microcontroller with FPU, operating at up to 216 MHz (462 DMIPS), featuring 512 KB Flash, 256+16+4 KB SRAM, dual USB OTG (FS/HS), three 12-bit ADCs (2.4 MSPS), and 140 GPIOs - deployed in industrial HMI, motor control gateways, and real-time audio processing systems.

For engineers reviewing the STM32F723ZEI6 datasheet, STM32F723ZEI6 pinout, STM32F723ZEI6 application, or STM32F723ZEI6 equivalent, key selection criteria include Cortex-M7 real-time performance, integrated USB HS PHY, TCM RAM allocation for deterministic code execution, and LQFP144 package compatibility with legacy PCB footprints.

Technical Context

The STM32F723ZEI6 implements an adaptive real-time accelerator (ART Accelerator) with 8 KB instruction and 8 KB data caches, enabling zero-wait-state execution from Flash and external memories. Its memory subsystem includes 256 KB data TCM RAM, 16 KB instruction TCM RAM, and 4 KB backup SRAM - all accessible at full 216 MHz CPU frequency.

It integrates dual USB OTG controllers: one full-speed with on-chip PHY, and one high-speed/full-speed with dedicated DMA and dual on-chip PHYs (FS + HS), supporting simultaneous host/device roles. The bxCAN 2.0B interface operates independently of USB timing domains, enabling robust automotive diagnostics and gateway arbitration.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm Cortex-M7 with FPU, 216 MHz max, 462 DMIPS - enables real-time DSP and floating-point control loops without external coprocessors.
Flash Memory512 KB with PCROP and read/write protection - supports secure firmware updates and IP protection in field-deployed devices.
SRAM256 KB data TCM + 16 KB instruction TCM + 4 KB backup SRAM - guarantees deterministic latency for time-critical ISR and audio buffering.
ADC3×12-bit, 2.4 MSPS each; 7.2 MSPS triple interleaved - captures multi-channel sensor data (e.g., motor phase currents) with sub-microsecond sampling alignment.
USB InterfacesDual OTG: FS (on-chip PHY) + HS/FS (dual on-chip PHYs + ULPI option) - allows concurrent USB device (HID/class-compliant) and host (mass storage/peripheral) operation.
TimersUp to 18 timers including 2×32-bit and 13×16-bit, all running at 216 MHz - supports PWM generation, quadrature decoding, and precise time-stamping across multiple peripherals.
PackageLQFP144 (20 × 20 mm, 0.5 mm pitch) - provides 138 5 V-tolerant I/Os and thermal performance suitable for industrial ambient temperatures up to +105°C.

Pinout & Package

LQFP144 package: 144-pin low-profile quad flat package with exposed thermal pad, 0.5 mm pitch, 20 × 20 mm body size, JEDEC standard footprint, rated for industrial temperature range (–40°C to +105°C).

Pin/TerminalCircuit RoleDesign Meaning
VDD, VSSCore power supply / ground1.7–3.6 V main supply; separate analog/digital grounds required for ADC/DAC accuracy.
VCAP1, VCAP2Internal regulator decouplingMust connect 2.2 µF ceramic capacitors close to pins to stabilize 1.2 V core voltage under dynamic load.
PA13/PA14SWD debug interfaceSupports single-wire debug (SWDIO/SWCLK); no JTAG pins needed for basic programming and trace.
PA11/PA12USB FS D+/D−Dedicated full-speed USB transceiver with internal pull-ups; requires 27 Ω series resistors per line for ESD robustness.
OTG_HS_ULPIHigh-speed USB ULPI interface12-bit parallel bus (D0–D7, CLK, DIR, NXT, STP) for external HS PHY - optional when on-chip HS PHY is used.
PH0/PH1HSE oscillator input/outputSupports 4–26 MHz crystal; essential for USB HS clock derivation and RTC precision via PLL cascading.

Key Features

FeatureDesign Value
ART Accelerator + L1 cacheEnables 0-wait-state execution from Flash at 216 MHz, eliminating instruction fetch bottlenecks in interrupt-driven control applications.
Dual USB OTG with HS PHYOn-chip high-speed PHY eliminates need for external transceiver, reducing BOM cost and PCB area while maintaining USB 2.0 compliance.
TCM RAM architecture272 KB combined TCM (256 KB data + 16 KB instruction) ensures deterministic access latency for real-time tasks like motor commutation or audio sample processing.
Triple-interleaved ADC7.2 MSPS aggregate sampling rate across 3 ADCs with hardware-synchronized triggers - captures synchronized multi-axis sensor data without CPU overhead.
Flexible memory controller (FMC)Supports NOR/NAND/PSRAM/SDRAM up to 32-bit bus width - enables expansion of code/data space for HMI graphics buffers or firmware OTA staging areas.

Applications

Industrial Motor Control GatewayMedical Ultrasound Front-End

Use Scenario: Real-time acquisition of 3-phase current/voltage sensors and encoder feedback in servo drives, with CAN-based command interface and USB host for configuration logging.

IC Role / Device Role / Timing Role: Primary MCU executing field-oriented control (FOC) loops at 20 kHz, managing CAN 2.0B comms, and buffering USB mass-storage logs using TCM RAM.

Use Value: 216 MHz Cortex-M7 + triple-interleaved ADC delivers sub-50 ns current sampling jitter, meeting IEC 61800-5-2 functional safety timing constraints.

Use Scenario: Digitizing RF echo signals from phased-array transducers, applying beamforming algorithms, and streaming processed data over USB to host PC.

IC Role / Device Role / Timing Role: Signal processor handling 12-bit ADC streams at 40 MSPS aggregate (via interleaving), executing FIR filters in TCM RAM, and managing USB HS bulk transfers.

Use Value: On-chip USB HS PHY sustains >35 MB/s sustained throughput, eliminating external PHY latency and jitter in time-critical ultrasound frame delivery.

Smart Building HVAC ControllerAudio DSP Node for Pro AV Systems

Use Scenario: Multi-zone temperature/humidity monitoring, Modbus RTU over RS-485, and local web UI served via embedded HTTP server over Ethernet (via external MAC/PHY).

IC Role / Device Role / Timing Role: System controller interfacing with 24-channel ADC for sensor fusion, driving 4× UARTs (including ISO7816 for smart card readers), and managing SDMMC for firmware updates.

Use Value: 140 GPIOs with 138 5 V-tolerant inputs simplify direct connection to legacy HVAC sensors and actuators without level-shifting circuitry.

Use Scenario: Low-latency audio mixing, equalization, and effects processing for 8-channel Dante-compatible digital audio interfaces.

IC Role / Device Role / Timing Role: Audio co-processor using 2× SAI interfaces for I2S/TDM, 2× DACs for analog output, and audio PLLs (PLLI2S/PLLSAI) for sample-rate conversion.

Use Value: Dual SAI with independent FIFOs and clock generators support simultaneous 96 kHz/24-bit playback and capture with <1 µs inter-channel skew.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance Cortex-M7 microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STM32F767ZIT6Higher Flash (2 MB) and SRAM (512 KB), adds Ethernet MAC, no USB HS PHY - requires external PHY for HS operation.Better suited for networked edge nodes requiring TCP/IP stack and large OTA image storage.Select when Ethernet connectivity and >1 MB code space outweigh USB HS integration needs.
STM32H743VIT6Dual-core (Cortex-M7 + M4), 1 MB Flash, 1 MB SRAM, higher clock (480 MHz), no on-chip USB HS PHY.Targeted at asymmetric multiprocessing (AMP) use cases like Linux co-hosting or safety-critical dual-lockstep partitioning.Choose only if dual-core isolation or >300 MHz compute headroom is mandatory; adds complexity in toolchain and certification.

Compared with STM32F767ZIT6 and STM32H743VIT6, the STM32F723ZEI6 uniquely balances USB HS integration, TCM-optimized real-time latency, and LQFP144 footprint - making it optimal for cost-sensitive, latency-critical embedded systems where external PHYs or dual-core overhead are unacceptable.

Availability

STM32F723ZEI6 is available at Aetrix Electronics and suitable for industrial motor control gateways, medical ultrasound front-ends, smart building HVAC controllers, and pro-audio DSP nodes requiring stable component supply across extended product lifecycles.

Supply support for STM32F723ZEI6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power ICs, sensors, and analog components for industrial, automotive, and consumer markets.

The STM32F7-series targets high-end real-time embedded applications demanding both computational throughput and peripheral richness - specifically engineered for deterministic control, audio signal processing, and human-machine interface subsystems.

FAQ

What is the maximum operating temperature rating for STM32F723ZEI6?

The STM32F723ZEI6 is qualified for industrial temperature range: –40°C to +105°C ambient. This rating applies to the LQFP144 package variant and is validated per JEDEC JESD22-A108. Thermal derating begins above +85°C ambient when operating at full 216 MHz with all peripherals active; design margin must account for PCB copper area and airflow.

Does STM32F723ZEI6 support external SDRAM, and what is the maximum bus width?

Yes, the STM32F723ZEI6 supports external SDRAM via its Flexible Memory Controller (FMC) with up to 16-bit data bus width and 256 MB address space. It does not support 32-bit SDRAM buses - that capability is reserved for larger packages (e.g., UFBGA176) with additional address/control lines. LQFP144 limits SDRAM to x16 configuration.

How many USB interfaces does STM32F723ZEI6 integrate, and are both PHYs on-chip?

The STM32F723ZEI6 integrates two independent USB OTG interfaces: one full-speed (OTG_FS) with fully integrated PHY, and one high-speed/full-speed (OTG_HS) with dual on-chip PHYs (FS + HS). No external PHY is required for either interface, though ULPI mode remains available for HS if external PHY is preferred.

Is the 96-bit unique ID accessible via standard firmware APIs?

Yes, the factory-programmed 96-bit unique ID is mapped to memory address 0x1FF0F420 and readable via standard HAL functions (e.g., HAL_GetUID()) or direct memory access. It is guaranteed monotonic and globally unique per die, used for secure boot key binding, device licensing, and anti-cloning measures in production firmware.

STM32F723ZEI6 Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Package/Case:
144-UFBGA
Series:
STM32F7
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit Single-Core
Speed:
216MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, LINbus, MMC/SD, QSPI, SAI, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
112
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
256K x 8
Voltage - Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 24x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

STM32F723ZEI6 FAQ

1.How can I place an order for STM32F723ZEI6 through Aetrix?

Please submit a Request for Quotation (RFQ) for STM32F723ZEI6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STM32F723ZEI6 reliable?

The price and inventory of STM32F723ZEI6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32F723ZEI6 is usually 5 days.

3.What payment methods are accepted for STM32F723ZEI6?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32F723ZEI6 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STM32F723ZEI6?

STM32F723ZEI6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STM32F723ZEI6 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STM32F723ZEI6?

For technical support, including STM32F723ZEI6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32F723ZEI6 requirements.

6.How does Aetrix verify that STM32F723ZEI6 is sourced from the original manufacturer or authorized distributors?

All STM32F723ZEI6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32F723ZEI6 meets industry standards.

7.What is the process for return or replacement of STM32F723ZEI6?

All STM32F723ZEI6 units undergo pre-shipment inspection (PSI). If there is an issue with STM32F723ZEI6, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STM32F723ZEI6 part is unused and in its original packaging.

Return procedure for STM32F723ZEI6:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

STM32F723ZEI6 Tags

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