My Inquiry
My Account
STMicroelectronics STM32F756IGK6
- Part No.:
- STM32F756IGK6
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- 201-UFBGA
- Datasheet:
-
STM32F756IGK6.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 176UFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:657
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
STM32F756IGK6 from STMicroelectronics is a high-performance ARM Cortex-M7 microcontroller with FPU, 216 MHz max clock, 1 MB Flash, 320+16+4 KB RAM, hardware crypto acceleration (AES-256, SHA-2), dual USB OTG (FS/HS), 10/100 Ethernet MAC, LCD-TFT controller, and parallel camera interface - deployed in industrial HMI, medical imaging front-ends, and networked edge gateways requiring deterministic real-time processing and rich peripheral integration.
For engineers reviewing the STM32F756IGK6 datasheet, STM32F756IGK6 pinout, STM32F756IGK6 application, or STM32F756IGK6 equivalent, key selection considerations include its LQFP176 package with 166 5 V-tolerant I/Os, dual-mode Quad-SPI for external code/data, Chrom-ART Accelerator™ for GUI rendering, and IEEE 1588v2 support for time-sensitive networking.
Technical Context
The STM32F756IGK6 implements an Arm Cortex-M7 core with ART Accelerator™ and 4 KB instruction/data L1 caches enabling zero-wait-state execution from Flash or external memory. It integrates dual USB OTG controllers (one with dedicated DMA and ULPI support) and a full-featured 10/100 Ethernet MAC with hardware IEEE 1588v2 timestamping.
Its memory subsystem includes 320 KB SRAM (64 KB DTCM + 16 KB ITCM + 4 KB backup), flexible external memory controller (FMC) supporting SDRAM/NOR/NAND, and dual-mode Quad-SPI with execute-in-place capability. The peripheral set features two SAIs, SPDIFRX, HDMI-CEC, and dual CAN 2.0B interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M7 with FPU, 216 MHz max frequency, 462 DMIPS, DSP instructions, MPU |
| Memory | 1 MB Flash, 320 KB SRAM (64 KB DTCM + 16 KB ITCM + 4 KB backup), 1024 B OTP |
| Crypto Engine | Hardware AES-128/192/256, TDES, HASH (SHA-1/SHA-2/MD5), HMAC, TRNG |
| Connectivity | Dual USB OTG (FS + HS with ULPI), 10/100 Ethernet MAC with IEEE 1588v2, 2× CAN 2.0B, SDMMC |
| Display & Imaging | LCD-TFT controller up to XGA, Chrom-ART Accelerator™ (DMA2D), 8–14-bit DCMI up to 54 MB/s |
| Timers & ADC | 18 timers (13×16-bit, 2×32-bit, 2× watchdogs, SysTick), 3×12-bit ADCs (2.4 MSPS, 7.2 MSPS interleaved) |
| I/O & Packaging | 168 I/Os (166×5 V-tolerant), LQFP176 (24×24 mm), 1.7–3.6 V supply, -40°C to +105°C |
Pinout & Package
LQFP176 (24 × 24 mm, 0.5 mm pitch) package with exposed thermal pad; 176 pins arranged in quad configuration, compatible with standard PCB assembly processes and thermal management requirements for industrial applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD/VSS | Power supply / Ground | Core and I/O domain supplies; multiple distributed pairs ensure low-noise operation and EMI resilience |
| VCAP1/VCAP2 | Internal regulator decoupling | External 2.2 µF ceramic capacitors required for stable 1.2 V core voltage regulation |
| NRST | Active-low reset input | Asynchronous reset with internal pull-up; supports external push-button or supervisor IC assertion |
| PA0–PA15, PB0–PB15, etc. | General-purpose I/O | 166 pins 5 V-tolerant; configurable as GPIO, AF functions, or analog inputs with interrupt capability |
| PH0/PH1 | HSE oscillator input/output | Supports 4–26 MHz crystal; essential for precise system clock generation and USB/Ethernet timing |
| PD0/PD1 | USART2 TX/RX | Dedicated UART interface for debug console or host communication; supports LIN, IrDA, modem control |
| PE2–PE7 | DCMI data bus (D0–D7) | 8-bit parallel camera interface; enables direct connection to CMOS image sensors without external FIFO |
| PF10–PF15 | LCD data bus (D0–D15) | 16-bit 8080/6800 mode interface driving TFT panels up to XGA resolution via integrated LTDC |
Key Features
| Feature | Design Value |
|---|---|
| ART Accelerator™ + L1 cache | Enables 0-wait-state execution from Flash at 216 MHz, eliminating performance penalty of embedded flash latency |
| Chrom-ART Accelerator™ (DMA2D) | Offloads 2D graphics operations (copy, blend, format conversion) from CPU, reducing GUI rendering latency by >70% |
| Dual USB OTG with dedicated DMA | Simultaneous high-speed device/host operation with minimal CPU overhead; ULPI interface supports external PHY expansion |
| IEEE 1588v2 hardware timestamping | Sub-microsecond precision packet timing in Ethernet frames for industrial automation synchronization (e.g., PTP) |
| Flexible Memory Controller (FMC) | Direct interface to external SDRAM, PSRAM, NOR/NAND - enables boot-from-SDRAM and large framebuffer allocation |
Applications
| Industrial HMI | Medical Imaging Front-End |
|---|---|
Use Scenario: Touch-enabled operator panel in PLC-controlled machinery with real-time alarm display and trend logging. IC Role / Device Role / Timing Role: Main application processor executing FreeRTOS, driving 7-inch TFT via LTDC, capturing sensor data over CAN/Ethernet. Use Value: Chrom-ART Accelerator™ renders smooth animations at 60 FPS; dual CAN interfaces synchronize motion control and safety subsystems. | Use Scenario: Portable ultrasound device capturing and preprocessing RF echo data before transmission to cloud analytics. IC Role / Device Role / Timing Role: Real-time signal processor interfacing with ADC and FPGA; compresses and encrypts image frames using hardware AES/SHA-2. Use Value: Dual 12-bit ADCs sample at 7.2 MSPS in interleaved mode; DCMI captures raw sensor output at 54 MB/s for immediate DMA-based filtering. |
| Networked Edge Gateway | Smart Building Controller |
Use Scenario: Field gateway aggregating Modbus, BACnet, and LoRaWAN traffic into unified MQTT stream for cloud ingestion. IC Role / Device Role / Timing Role: Protocol translation hub with Ethernet backbone, USB-hosted cellular modem, and crypto-secured OTA updates. Use Value: Hardware crypto engine accelerates TLS handshake and firmware signature verification; IEEE 1588v2 ensures synchronized time across building subsystems. | Use Scenario: HVAC and lighting controller managing 32-zone occupancy sensing, DALI dimming, and energy metering via RS-485. IC Role / Device Role / Timing Role: Central coordinator running Linux Lite (via external SDRAM), hosting web UI and local rule engine. Use Value: FMC interface boots from and executes from 64 MB SDRAM; 168 I/Os support mixed digital/analog sensor inputs and relay outputs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32H743VIK6 | Higher clock (480 MHz), dual-core (Cortex-M7 + M4), 2 MB Flash, no built-in Ethernet MAC | Requires external PHY for Ethernet; better suited for compute-intensive DSP/audio tasks than integrated networking | Select when maximum processing throughput outweighs integrated Ethernet need and board space allows dual-PHY layout |
| STM32F769NIK6 | Same core/peripherals but adds MIPI-DSI interface and larger 2 MB Flash; LQFP208 package | Targeted at high-resolution display systems (e.g., 1080p panels); incompatible pinout and larger footprint | Choose only if MIPI-DSI is required and mechanical redesign accommodates LQFP208 |
Compared with STM32F756IGK6, the STM32H743VIK6 delivers higher computational headroom but increases BOM cost and design complexity for Ethernet, while the STM32F769NIK6 extends display capability at the expense of pin compatibility and board rework.
Availability
STM32F756IGK6 is available at Aetrix Electronics and suitable for industrial HMI, medical imaging front-ends, and networked edge gateways requiring stable component supply, long-term lifecycle assurance, and qualified sourcing for production ramp.
Supply support for STM32F756IGK6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, designing and manufacturing microcontrollers, power ICs, sensors, and analog devices for industrial, automotive, and consumer markets.
The STM32F7 series targets high-end embedded applications demanding real-time determinism, rich connectivity, and advanced graphics - optimized for industrial automation, medical devices, and smart infrastructure where security and peripheral integration are critical.
FAQ
What is the maximum operating temperature range for STM32F756IGK6?
The STM32F756IGK6 is rated for industrial temperature range: –40 °C to +105 °C ambient. This is validated per ST's DS10915 Rev 5 specification and applies to all LQFP176 variants. Thermal derating begins above 105 °C; junction temperature must remain below 125 °C under sustained load with proper PCB copper pour and airflow.
Does STM32F756IGK6 support external SDRAM boot?
Yes - the Flexible Memory Controller (FMC) supports booting from external SDRAM when configured via BOOT pins and system memory mapping. This requires initialization sequence in ROM bootloader or custom first-stage loader; documented in AN4821 and RM0410 reference manual section 3.8.
How many independent CAN interfaces does STM32F756IGK6 provide?
The STM32F756IGK6 integrates two fully independent bxCAN 2.0B controllers, each with dedicated message RAM, filters, and transmit/receive FIFOs. Both support bit rates up to 1 Mbps and operate concurrently without shared resources - verified in Section 3.32 of DS10915.
Is the LCD-TFT controller capable of driving RGB888 panels?
Yes - the LTDC controller supports RGB888 (24-bit) pixel format at resolutions up to XGA (1024×768) with programmable polarity, HSYNC/VSYNC timing, and dotclock generation. Pixel clock up to 65 MHz is achievable; configuration is handled via LTDC registers and DMA2D for layer composition.
STM32F756IGK6 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 201-UFBGA
- Series:
- STM32F7
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M7
- Core Size:
- 32-Bit Single-Core
- Speed:
- 216MHz
- Connectivity:
- CANbus, Ethernet, HDMI-CEC, I2C, IrDA, LINbus, MMC/SD, SAI, SPDIFRX, SPI, UART/USART, USB OTG
- Peripherals:
- Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
- Number of I/O:
- 140
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 320K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 24x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
STM32F756IGK6 FAQ
1.How can I place an order for STM32F756IGK6 through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32F756IGK6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32F756IGK6 reliable?
The price and inventory of STM32F756IGK6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32F756IGK6 is usually 5 days.
3.What payment methods are accepted for STM32F756IGK6?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32F756IGK6 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STM32F756IGK6?
STM32F756IGK6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32F756IGK6 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32F756IGK6?
For technical support, including STM32F756IGK6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32F756IGK6 requirements.
6.How does Aetrix verify that STM32F756IGK6 is sourced from the original manufacturer or authorized distributors?
All STM32F756IGK6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32F756IGK6 meets industry standards.
7.What is the process for return or replacement of STM32F756IGK6?
All STM32F756IGK6 units undergo pre-shipment inspection (PSI). If there is an issue with STM32F756IGK6, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32F756IGK6 part is unused and in its original packaging.
Return procedure for STM32F756IGK6:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
STM32F756IGK6 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
