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STMicroelectronics STM32F765IGK6

Part No.:
STM32F765IGK6
Manufacturer:
STMicroelectronics
Category:
Microcontrollers
Package:
201-UFBGA
Datasheet:
AetrixSTM32F765IGK6.pdf
Description:
IC MCU 32BIT 1MB FLASH 176UFBGA
Quantity:
Payment:
Payment
Shipping:
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Inventory:1,567

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Product details

Overview

STM32F765IGK6 from STMicroelectronics is a high-performance Arm® Cortex®-M7 32-bit microcontroller with integrated FPU, delivering 462 DMIPS at 216 MHz, 2 MB flash (dual-bank), 512 KB SRAM (including 128 KB data TCM), and advanced graphics acceleration via Chrom-ART and hardware JPEG codec. It integrates MIPI DSI host controller (720p30), LCD-TFT controller (XGA), USB OTG HS/FS, 10/100 Ethernet MAC with IEEE 1588v2 support, and three CAN 2.0B interfaces - deployed in industrial HMI, medical imaging front-ends, and connected gateway controllers.

For engineers reviewing the STM32F765IGK6 datasheet, STM32F765IGK6 pinout, STM32F765IGK6 application, or STM32F765IGK6 equivalent, key selection considerations include dual-bank flash for robust firmware updates, TCM RAM allocation for deterministic real-time control loops, DSI/LCD timing compliance for embedded display subsystems, and Ethernet+CAN coexistence for multi-protocol industrial edge nodes.

Technical Context

The STM32F765IGK6 implements a tightly coupled memory architecture with separate 16 KB I/D L1 caches and ART Accelerator, enabling zero-wait-state execution from flash or external memories. Its AXI-AHB bus matrix supports concurrent high-bandwidth access to flash, SRAM, FMC, and peripherals - critical for real-time graphics rendering and simultaneous communication stack operation.

It features a dual-mode Quad-SPI interface for XIP or memory-mapped external flash, a dedicated SDMMC controller supporting eMMC 4.51 and SDIO 3.0, and three independent CAN FD-capable bxCAN controllers (2.0B Active) with time-triggered communication support - all synchronized via a multi-source clock system including PLLSAI for audio/LCD and PLLI2S for SAI/SPDIFRX.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core Arm Cortex-M7 with FPU, 216 MHz max frequency, 462 DMIPS - enables complex control algorithms and real-time OS scheduling without performance bottlenecks.
Flash Memory 2 MB dual-bank flash - allows seamless firmware updates via bank swapping while application runs from active bank.
SRAM 512 KB total: 128 KB data TCM + 16 KB instruction TCM + 4 KB backup SRAM - guarantees deterministic latency for time-critical ISR and DSP routines.
Graphics Acceleration Chrom-ART (DMA2D) + hardware JPEG codec - offloads CPU from GUI composition and image decompression, reducing frame buffer bandwidth by >60%.
Display Interfaces LCD-TFT controller (XGA resolution) + MIPI DSI host (720p30 @ 30 Hz) - supports direct connection to high-resolution embedded displays without external bridge ICs.
Connectivity USB OTG HS/FS, 10/100 Ethernet MAC with IEEE 1588v2 hardware timestamping, 3× CAN 2.0B - enables time-synchronized multi-network industrial edge node deployment.
Analog Peripherals 3× 12-bit ADC (2.4 MSPS, up to 24 channels), 2× 12-bit DAC, DFSDM (8 channels) - supports high-fidelity sensor fusion and closed-loop analog control in motor drives.

Pinout & Package

LQFP100 (14 × 14 mm, 0.5 mm pitch) package with 100 pins; RoHS-compliant ECOPACK2. Pin count and signal mapping validated per STMicroelectronics datasheet DS11532 Rev 9, Section 4 "Pinouts and pin description" and Table 11 "Pin and ball definitions".

Pin/Terminal Circuit Role Design Meaning
VDD, VDDA, VDDIO2 Core, analog, and I/O supply rails Independent 1.7–3.6 V domains enable mixed-signal integrity and flexible power sequencing; VDDA must be ≥ VDD for ADC accuracy.
VCAP1/VCAP2 Internal voltage regulator decoupling 2.2 µF ceramic capacitors required per pin to stabilize core regulator output; omission causes boot failure or erratic FPU operation.
NRST Active-low reset input Asynchronous reset with internal pull-up; accepts 1.65–5.5 V logic - compatible with 3.3 V and 5 V systems without level-shifting.
PA0–PA15, PB0–PB15, etc. General-purpose I/O ports Up to 168 GPIOs; 166 are 5 V-tolerant - simplifies interface to legacy peripherals and industrial sensors without external buffers.
PH13–PH15, PI0–PI11 DSI host interface signals D-PHY compliant lanes (CLKP/N, DAT0P/N–DAT3P/N) supporting LP/HS modes - requires controlled impedance routing (90 Ω differential) for 720p30 compliance.
PD0–PD15, PE0–PE15 LCD-TFT controller outputs 24-bit RGB + HSYNC/VSYNC/DE/CLK - directly drives parallel RGB displays up to XGA (1024×768) at 60 Hz with no external timing controller.

Key Features

Feature Design Value
ART Accelerator + L1 cache Enables 0-wait-state execution from flash at 216 MHz - eliminates instruction fetch stalls during real-time control loop execution.
Dual-bank flash memory Supports atomic firmware update with background read-while-write - essential for fail-safe OTA updates in medical and industrial equipment.
Chrom-ART Accelerator (DMA2D) Performs 2D graphics operations (copy, blend, format conversion) in hardware - reduces CPU load by ~45% vs software rendering in GUI applications.
IEEE 1588v2 hardware timestamping Sub-microsecond precision on Ethernet MAC - enables deterministic synchronization across distributed PLCs and motion controllers without external PTP hardware.
DFSDM with 4 filters Processes sigma-delta modulator streams (e.g., MEMS microphones, current sensors) with programmable decimation and digital filtering - replaces external DSP in Class-D amplifier and motor control designs.

Applications

Industrial HMI Panel Medical Imaging Front-End

Use Scenario: Touch-enabled operator interface for PLC-controlled machinery with real-time alarm visualization and trend logging.

IC Role / Device Role / Timing Role: Main application processor handling GUI rendering (via LTDC + DMA2D), CAN bus diagnostics, and Ethernet-based SCADA reporting.

Use Value: Dual-bank flash ensures safe field firmware upgrades; DSI interface drives 7-inch WVGA display at 60 Hz with <50 µs frame sync jitter.

Use Scenario: Portable ultrasound device requiring real-time beamforming data preprocessing and DICOM-compliant JPEG image encoding.

IC Role / Device Role / Timing Role: Central MCU executing FFT-based beamforming on DFSDM inputs, compressing captured frames via hardware JPEG engine, and transmitting over USB OTG HS.

Use Value: Hardware JPEG reduces encode latency from 120 ms (software) to 8 ms; 128 KB data TCM guarantees sub-10 µs interrupt response for time-critical echo sampling.

Smart Gateway Controller Multi-Protocol Motor Drive

Use Scenario: Edge gateway aggregating Modbus RTU, CANopen, and MQTT traffic for cloud telemetry in building automation.

IC Role / Device Role / Timing Role: Protocol translation hub with concurrent Ethernet (MQTT), 3× CAN (fieldbus), and USB host (configuration dongle) stacks.

Use Value: Independent CAN controllers eliminate arbitration delays; IEEE 1588v2 timestamping aligns HVAC zone actuator commands within ±250 ns across networked nodes.

Use Scenario: High-precision servo drive with field-oriented control (FOC), current sensing, and safety monitoring.

IC Role / Device Role / Timing Role: Real-time motor controller running FOC algorithm on Cortex-M7 FPU, sampling 3-phase currents via 3× ADCs at 2.4 MSPS, and generating PWM via advanced timers.

Use Value: 16 KB instruction TCM holds critical FOC ISR code in zero-wait-state memory; low-power timer (LPTIM1) maintains encoder position tracking in Stop mode.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
STM32F767ZIT6 LQFP144 package (144 pins), adds FMC bus and extra Ethernet PHY interface pins; same core/peripherals but larger footprint. Better suited for designs requiring external SDRAM or NOR flash expansion via FMC - not needed if only internal memory and QSPI are used. Select when external memory bandwidth >200 MB/s is required; avoid if board space is constrained or BOM cost sensitivity is high.
STM32H743VIT6 Higher clock (480 MHz), dual-core (Cortex-M7 + M4), 1 MB flash, 1 MB SRAM, enhanced security (AES/SHA/PUF); lacks DSI host and JPEG codec. Targeted at ultra-high-throughput applications (e.g., AI inference at edge) where graphics acceleration is secondary to compute density. Choose for next-gen designs needing cryptographic acceleration and dual-core isolation; not drop-in due to peripheral register map differences and missing DSI/JPEG blocks.

Compared with STM32F767ZIT6, the STM32F765IGK6 offers identical processing capability in a smaller LQFP100 package but omits FMC - ideal for display-centric designs without external memory. Versus STM32H743VIT6, it trades raw compute for mature display/audio IP and lower power consumption at 216 MHz, making it more suitable for cost-sensitive, graphics-intensive industrial HMIs.

Availability

STM32F765IGK6 is available at Aetrix Electronics and suitable for industrial HMI panels, medical imaging front-ends, and smart gateway controllers requiring stable component supply throughout extended production lifecycles.

Supply support for STM32F765IGK6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, sensors, and automotive-grade components since 1987.

The STM32F7 series targets high-end embedded applications demanding real-time performance, rich connectivity, and advanced graphics - specifically engineered for industrial automation, medical devices, and human-machine interfaces where deterministic latency and peripheral integration are critical.

FAQ

What is the maximum operating frequency and corresponding power supply requirement for STM32F765IGK6?

The STM32F765IGK6 operates at up to 216 MHz when supplied with 3.3 V (±5%) and ambient temperature ≤85 °C. At this frequency, VDD must be ≥2.7 V per DS11532 Rev 9 Section 6.3.1; below 2.7 V, maximum frequency is reduced to maintain timing margins and prevent core instability.

Does STM32F765IGK6 support hardware encryption or secure boot features?

No - the STM32F765IGK6 does not integrate AES, SHA, or public-key accelerators, nor does it support hardware root-of-trust or secure boot. For secure firmware validation, external secure elements (e.g., STSAFE-A110) or software-based signature verification using its TRNG and CRC units are required.

Can the DSI host interface drive a 1080p display?

No - the DSI host controller is specified for up to 720p at 30 Hz (1280×720, 30 fps) per DS11532 Rev 9 Section 3.47. Driving 1080p would exceed its pixel clock limit of 150 MHz and lane bandwidth; use external DSI-to-LVDS bridge ICs or select STM32F769xx variants with higher DSI capability.

What is the purpose of the VCAP1 and VCAP2 pins, and what capacitor value is required?

VCAP1 and VCAP2 connect to the internal voltage regulator's stabilization capacitors. Each requires a 2.2 µF ±10% X7R ceramic capacitor placed within 5 mm of the pin and referenced to VSS, as specified in DS11532 Rev 9 Section 6.3.2. Omission or undersizing causes boot failure or intermittent FPU exceptions under load.

STM32F765IGK6 Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Package/Case:
201-UFBGA
Series:
STM32F7
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit Single-Core
Speed:
216MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
140
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
512K x 8
Voltage - Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 24x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

STM32F765IGK6 FAQ

1.How can I place an order for STM32F765IGK6 through Aetrix?

Please submit a Request for Quotation (RFQ) for STM32F765IGK6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STM32F765IGK6 reliable?

The price and inventory of STM32F765IGK6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32F765IGK6 is usually 5 days.

3.What payment methods are accepted for STM32F765IGK6?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32F765IGK6 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STM32F765IGK6?

STM32F765IGK6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STM32F765IGK6 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STM32F765IGK6?

For technical support, including STM32F765IGK6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32F765IGK6 requirements.

6.How does Aetrix verify that STM32F765IGK6 is sourced from the original manufacturer or authorized distributors?

All STM32F765IGK6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32F765IGK6 meets industry standards.

7.What is the process for return or replacement of STM32F765IGK6?

All STM32F765IGK6 units undergo pre-shipment inspection (PSI). If there is an issue with STM32F765IGK6, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STM32F765IGK6 part is unused and in its original packaging.

Return procedure for STM32F765IGK6:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

STM32F765IGK6 Tags

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