STMicroelectronics STM32F765IIT6

Overview

STM32F765IIT6 from STMicroelectronics is a high-performance Arm® Cortex®-M7 32-bit microcontroller with integrated FPU, delivering 462 DMIPS at 216 MHz, 2 MB dual-bank flash, 512 KB SRAM (including 128 KB data TCM), and full-featured USB OTG HS/FS, Ethernet MAC, LCD-TFT + DSI display interfaces, and triple CAN 2.0B controllers - deployed in industrial HMI, medical imaging front-ends, and real-time motor control systems.

For engineers reviewing the STM32F765IIT6 datasheet, STM32F765IIT6 pinout, STM32F765IIT6 application, or STM32F765IIT6 equivalent, key selection criteria include its 216 MHz Cortex-M7 core with L1 cache, dual-bank flash for seamless firmware updates, hardware JPEG codec and Chrom-ART accelerator for GUI rendering, MIPI DSI host supporting 720p30, and 168 I/Os with 5 V tolerance - all in a 176-pin LQFP package.

Technical Context

The STM32F765IIT6 implements a tightly coupled memory architecture with separate 16 KB I/D caches, ART Accelerator enabling zero-wait-state execution from flash, and dual-bank flash allowing concurrent read-while-write operations. Its AXI-AHB bus matrix supports parallel access to flash, SRAM, and peripherals without contention.

It integrates three independent clock domains: main system clock (up to 216 MHz), audio/LCD PLLs (PLLI2S/PLLSAI), and MIPI D-PHY PLL for DSI timing - each with dedicated voltage regulators and calibration circuits. The DSI host controller uses embedded MIPI D-PHY compliant with LP/HS modes and supports up to 4 lanes.

Key Specifications

Pinout & Package

LQFP176 (24 × 24 mm, 0.5 mm pitch) package with exposed thermal pad; 176 leads arranged in four sides, supporting 168 general-purpose I/Os, multiple power/ground pins (VDD/VSS/VCAP), and dedicated analog/digital supply domains.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance Cortex-M7 microcontroller applications.

Compared with STM32F765IIT6, the STM32F767ZIT6 sacrifices display capability and I/O count for compactness, while the STM32H743VIT6 delivers higher performance and memory but increases complexity and power - making the F765IIT6 optimal for display-rich, real-time embedded systems balancing capability, footprint, and thermal envelope.

Availability

STM32F765IIT6 is available at Aetrix Electronics and suitable for industrial HMI, medical imaging front-ends, and advanced motor control applications requiring stable component supply, long-term lifecycle assurance, and full traceability.

Supply support for STM32F765IIT6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, sensors, and automotive semiconductors since 1987.

The STM32F7 series targets high-end real-time embedded applications demanding both computational performance and rich peripheral integration - especially where graphics, connectivity, and deterministic control coexist in resource-constrained environments.

FAQ

What is the maximum operating frequency and how is it achieved?

The STM32F765IIT6 achieves 216 MHz via its Arm Cortex-M7 core with ART Accelerator and 16 KB I/D caches, enabling zero-wait-state execution from flash. It requires proper VCAP1/VCAP2 decoupling (2.2 µF each), stable 1.7–3.6 V supply, and correct PLL configuration using the internal 16 MHz RC or external 4–26 MHz crystal. Thermal derating begins above 85°C ambient.

Does STM32F765IIT6 support MIPI DSI panels natively?

Yes - it integrates a full MIPI DSI host controller with compliant D-PHY physical layer supporting 1–4 data lanes and clock lane, capable of 720p30 (1280×720 @ 30 Hz) video output. External level-shifting or termination resistors are not required, but PCB layout must meet MIPI impedance and skew requirements (≤5 ps/lane).

How does dual-bank flash enable safe firmware updates?

Dual-bank flash allows one bank to execute code while the other is erased and reprogrammed - enabling atomic, fail-safe OTA updates. The bootloader validates new firmware CRC before switching banks, and the NVIC remapping feature ensures vector table relocation without reset. This meets IEC 62443-3-3 SL2 requirements for secure update mechanisms.

What are the key thermal considerations for LQFP176 packaging?

The LQFP176 package has an exposed thermal pad requiring solder connection to a dedicated PCB copper pour (≥4 cm²) with ≥4 thermal vias (0.3 mm diameter) to inner ground planes. Junction-to-ambient thermal resistance (θ_JA) is 30°C/W; sustained 216 MHz operation with full peripheral activation requires ≤65°C ambient or active airflow to maintain <125°C junction temperature.