STMicroelectronics STM32F778AIY6TR

Overview

STM32F778AIY6TR from STMicroelectronics is a high-performance Arm® Cortex®-M7 32-bit microcontroller with FPU, delivering 462 DMIPS at 216 MHz, 2 MB flash (dual-bank), 512 KB SRAM (including 128 KB data TCM), hardware JPEG codec, MIPI DSI host controller, and cryptographic acceleration (AES-128/192/256, SHA-1/2, RNG). It targets advanced embedded graphics and connectivity applications such as industrial HMIs and medical imaging front-ends.

For engineers reviewing the STM32F778AIY6TR datasheet, STM32F778AIY6TR pinout, STM32F778AIY6TR application, or STM32F778AIY6TR equivalent, key selection considerations include dual-bank flash read-while-write capability, 168 I/Os with 5 V tolerance, MIPI DSI support up to 720p30, and integrated Ethernet MAC with IEEE 1588v2 hardware timestamping.

Technical Context

The device integrates an ART Accelerator™ and dual 16 KB L1 caches (I/D) enabling zero-wait-state execution from flash or external memory. Its AXI-AHB bus matrix supports concurrent high-bandwidth access across CPU, DMA, and peripherals including FMC, DSI, and Ethernet MAC.

It implements three independent CAN 2.0B controllers, dual USB OTG (FS + HS with dedicated DMA), and a flexible clock system with multiple PLLs (main, audio, SAI) for precise timing control across mixed-signal, video, and audio subsystems.

Key Specifications

Pinout & Package

STM32F778AIY6TR is packaged in UFBGA176 (10 × 10 mm, 0.8 mm pitch), a fine-pitch ball grid array optimized for compact, high-I/O-density designs requiring thermal and EMI performance. Pin functions are validated per ST's DS11243 Rev 8 datasheet Section 4 (Pinouts and pin description) and Table 11 (pin and ball definitions).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance MCU applications.

Compared with STM32F778AIY6TR, the STM32H743VIT6 offers higher compute throughput but sacrifices integrated DSI and JPEG acceleration, while the STM32F767ZIT6 reduces cost and complexity at the expense of display and multimedia capabilities essential for modern HMI and imaging systems.

Availability

STM32F778AIY6TR is available at Aetrix Electronics and suitable for industrial HMIs, medical imaging front-ends, smart grid gateways, and automated test equipment requiring stable component supply, long-term lifecycle assurance, and qualified automotive-grade traceability.

Supply support for STM32F778AIY6TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, sensors, and analog components for industrial, automotive, and consumer markets.

The STM32F7 series targets high-end embedded applications demanding real-time performance, rich graphics, and secure connectivity - specifically engineered for human-machine interfaces, medical devices, and industrial gateways where computational density and peripheral integration are critical.

FAQ

What is the maximum operating frequency and how is it achieved?

The STM32F778AIY6TR achieves 216 MHz maximum CPU frequency using its Arm Cortex-M7 core with ART Accelerator and dual 16 KB L1 caches. This configuration enables zero-wait-state execution from flash memory, verified per DS11243 Rev 8 Section 3.1. The frequency is sustained across temperature and voltage ranges specified in Section 6.3.1 (General operating conditions).

Does this MCU support MIPI DSI displays without external components?

Yes - the STM32F778AIY6TR integrates a full MIPI DSI host controller compliant with D-PHY v1.2, supporting 1- or 2-lane configurations up to 500 Mbps per lane. As confirmed in Section 3.48 and Table 6.3.13 of DS11243 Rev 8, it drives DSI displays directly using internal termination and clock recovery, eliminating the need for external bridge chips in most implementations.

How does the dual-bank flash architecture improve firmware update reliability?

Dual-bank flash allows one bank to execute code while the other is erased and reprogrammed - enabling true background firmware updates. As documented in Section 3.3, this architecture prevents system lockup during field upgrades and supports atomic swap operations, meeting IEC 62443 and ISO 26262 functional safety requirements for fail-safe over-the-air updates.

What are the key power management features for battery-operated applications?

The device supports Sleep, Stop, and Standby low-power modes with RTC and 4 KB backup SRAM retained on VBAT. Section 3.21 specifies wakeup from Stop mode in <5 µs, and Section 6.3.8 confirms typical current consumption of 20 µA in Stop mode with RTC and SRAM active. VBAT supply enables uninterrupted timekeeping and data retention during main power loss.