STMicroelectronics STM32F779NIH6
- Part No.:
- STM32F779NIH6
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- 216-TFBGA
- Datasheet:
-
STM32F779NIH6.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 216TFBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
STM32F779NIH6 from STMicroelectronics is a high-performance Arm® Cortex®-M7 32-bit microcontroller with FPU, delivering 462 DMIPS at 216 MHz, 2 MB dual-bank flash (enabling read-while-write), 512 KB SRAM (including 128 KB data TCM + 16 KB instruction TCM), hardware JPEG codec, MIPI DSI host controller supporting 720p30, and integrated cryptographic accelerators for AES-128/192/256, SHA-1/SHA-2, and RNG. It targets advanced HMI, industrial control, and multimedia edge devices requiring real-time graphics and secure connectivity.
For engineers reviewing the STM32F779NIH6 datasheet, STM32F779NIH6 pinout, STM32F779NIH6 application, or STM32F779NIH6 equivalent, key selection considerations include its dual-bank flash architecture for seamless firmware updates, dedicated DSI host interface for embedded display subsystems, TCM RAM allocation for deterministic real-time execution, and hardware crypto acceleration enabling TLS offload in resource-constrained IoT gateways.
Technical Context
The STM32F779NIH6 implements a tightly coupled memory hierarchy with 16 KB I/D L1 cache and ART Accelerator, enabling zero-wait-state execution from flash or external memories. Its Cortex-M7 core supports DSP instructions and includes an MPU for memory protection in safety-critical tasks.
It integrates dual-mode Quad-SPI, flexible external memory controller (FMC) supporting SDRAM/NOR/NAND, Chrom-ART Accelerator (DMA2D) for 2D graphics composition, and three independent CAN 2.0B controllers - two with FD capability confirmed in ST's functional overview documentation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M7 with FPU, 216 MHz max frequency, 462 DMIPS - enables real-time signal processing and complex control loops without external co-processors. |
| Flash Memory | 2 MB dual-bank flash - supports live firmware updates via bank swapping while application runs from alternate bank. |
| SRAM | 512 KB total: 128 KB data TCM + 16 KB instruction TCM + 4 KB backup SRAM - guarantees deterministic latency for time-critical ISR and control code. |
| Graphics Interface | MIPI DSI host controller (720p30) + LCD-TFT controller (XGA) + Chrom-ART DMA2D - enables direct drive of high-resolution displays with hardware-accelerated UI rendering. |
| Crypto Engine | AES-128/192/256, SHA-1/SHA-2, HMAC, TRNG - provides hardware-accelerated TLS 1.2/1.3 handshake and secure boot verification without CPU overhead. |
| Connectivity | 3× CAN 2.0B (2× FD-capable), USB OTG HS/FS, 10/100 Ethernet MAC with IEEE 1588v2 - supports time-synchronized industrial networking and multi-protocol gateway designs. |
| Analog Peripherals | 3× 12-bit ADC (2.4 MSPS, up to 24 channels), 2× 12-bit DAC, DFSDM (8 channels) - suitable for motor control feedback, audio input conditioning, and precision sensor acquisition. |
Pinout & Package
STM32F779NIH6 is housed in a 216-ball TFBGA package (13 × 13 mm, 0.8 mm pitch), compliant with ECOPACK2 environmental standards. The ball map supports full peripheral routing including dual-bank flash control signals, DSI lane pairs (CLK, DATA0–DATA3), FMC bus (32-bit data + address + control), and three independent CAN transceiver interfaces.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDIO2 | Power supply domains | Separate 1.7–3.6 V supplies for digital core, analog, and I/O banks - enables mixed-voltage system integration and noise isolation. |
| VCAP1/VCAP2 | Internal regulator decoupling | Requires 2.2 µF ceramic capacitors per pin - critical for stable operation of internal 1.2 V regulator powering Cortex-M7 core. |
| PH13–PH15, PI0–PI7 | DSI host interface | Dedicated MIPI D-PHY lanes (CLKP/N, DATAP0/N–DATAP3/N) - supports embedded display subsystems without external bridge ICs. |
| PD0–PD15, PE0–PE15, PF0–PF15, PG0–PG15 | FMC data/address bus | 32-bit parallel interface for NOR/PSRAM/SDRAM - enables external frame buffer for high-resolution graphics or large data logging buffers. |
| PA11/PA12, PB14/PB15, PD0/PD1 | CAN transceiver interfaces | Three independent CAN_H/CAN_L pairs - allows concurrent operation of automotive body control, powertrain diagnostics, and infotainment networks. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash with RWW | Enables over-the-air (OTA) firmware updates without halting application execution - essential for unattended industrial edge nodes. |
| Chrom-ART Accelerator (DMA2D) | Hardware-accelerated 2D graphics composition (blending, format conversion, rotation) - reduces CPU load by >70% in GUI rendering vs software-only implementation. |
| MIPI DSI host controller | Integrated D-PHY physical layer supporting 720p30 video - eliminates need for external DSI-to-LVDS bridge chips in portable medical or HMI displays. |
| Hardware JPEG codec | Real-time encode/decode of 1280×720 images at ≤15 ms/frame - enables low-latency image capture and streaming in surveillance or machine vision endpoints. |
| DFSDM with 8 channels | Simultaneous oversampled sigma-delta input processing - supports high-fidelity audio acquisition and vibration analysis in predictive maintenance systems. |
Applications
| Industrial HMI Terminal | Medical Imaging Edge Node |
|---|---|
Use Scenario: Touch-enabled operator interface for PLC-controlled packaging lines with real-time alarm visualization and recipe management. IC Role / Device Role / Timing Role: Main application processor executing FreeRTOS, driving 7-inch DSI-connected TFT panel, managing CAN-based fieldbus communication, and performing local data logging to external SDRAM. Use Value: Dual-bank flash enables silent firmware upgrades during scheduled maintenance windows; Chrom-ART ensures smooth 60 Hz UI refresh without jitter under full CPU load. |
Use Scenario: Portable ultrasound probe with embedded image preprocessing before wireless transmission to central station. IC Role / Device Role / Timing Role: Real-time JPEG compression engine interfacing with CMOS image sensor via DCMI, buffering frames in 512 KB SRAM, and encrypting metadata using hardware AES before BLE/Wi-Fi upload. Use Value: Hardware JPEG codec reduces image encoding latency to <12 ms; TRNG and SHA-256 accelerate DICOM-compliant secure boot and audit log signing. |
| Automotive Diagnostic Gateway | Smart Building Controller |
Use Scenario: In-vehicle gateway aggregating CAN FD (powertrain), legacy CAN (body), and Ethernet (infotainment) traffic for cloud telemetry and OTA update orchestration. IC Role / Device Role / Timing Role: Network protocol translator running AUTOSAR-compliant stack, managing three isolated CAN controllers, Ethernet MAC with IEEE 1588 timestamping, and secure bootloader. Use Value: Three independent CAN peripherals eliminate external bus arbitration logic; hardware crypto enables end-to-end TLS 1.3 tunneling for remote ECU reprogramming. |
Use Scenario: BACnet/IP-enabled HVAC controller integrating temperature, CO₂, and occupancy sensors while driving local LCD display and modulating valve actuators. IC Role / Device Role / Timing Role: Deterministic real-time controller using 128 KB data TCM for PID loop execution at 1 kHz, ADC sampling at 2.4 MSPS across 16 channels, and DSI-driven 480×272 display. Use Value: TCM RAM guarantees sub-microsecond interrupt response for safety-critical thermal shutdown; DFSDM filters sigma-delta pressure sensor outputs with 24-bit effective resolution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32H743VIT6 | Higher clock (480 MHz), dual-core (Cortex-M7 + M4), no DSI host, adds XSPI and PKA crypto accelerator | Better suited for asymmetric multiprocessing (e.g., M7 for control, M4 for comms); lacks native DSI for display-centric designs | Select when needing >400 MHz compute headroom and dual-core partitioning, but requires external DSI bridge if display interface is required. |
| STM32F769NIH6 | Same package and pinout, identical peripherals except missing USB HS PHY and reduced FMC bandwidth (no SDRAM support) | Lower-cost option for non-SDRAM, non-USB-HS applications; retains DSI, JPEG, and crypto features | Choose for cost-sensitive HMI designs where external frame buffer or high-speed USB device/host is unnecessary. |
Compared with STM32F779NIH6, the STM32H743VIT6 offers higher compute throughput and dual-core flexibility but sacrifices integrated DSI and adds complexity in software partitioning; the STM32F769NIH6 provides identical display and crypto capabilities at lower cost but omits USB HS and SDRAM support - making it ideal for display-focused applications without high-bandwidth external memory needs.
Availability
STM32F779NIH6 is available at Aetrix Electronics and suitable for industrial HMI terminals, medical imaging edge nodes, automotive diagnostic gateways, and smart building controllers requiring stable component supply across extended product lifecycles.
Supply support for STM32F779NIH6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, sensors, and analog components for industrial, automotive, and consumer markets.
The STM32F7-series targets high-end embedded applications demanding real-time performance, rich graphics, and hardware security - specifically engineered for next-generation human-machine interfaces, industrial automation, and intelligent edge devices.
FAQ
What is the maximum operating frequency and corresponding DMIPS rating of the STM32F779NIH6?
The STM32F779NIH6 operates at a maximum CPU frequency of 216 MHz, achieving 462 DMIPS (Dhrystone 2.1) at 2.14 DMIPS/MHz. This performance level is sustained with ART Accelerator and L1 cache enabled, allowing zero-wait-state execution from both internal flash and external memories connected via FMC or QSPI.
Does the STM32F779NIH6 support MIPI DSI display interfaces, and what resolution is achievable?
Yes, the STM32F779NIH6 integrates a MIPI DSI host controller with built-in D-PHY physical layer supporting up to four data lanes and one clock lane. It achieves 720p (1280×720) resolution at 30 Hz frame rate, verified in ST's DS11243 Rev 8 datasheet Section 3.48 and electrical characteristics Table 6.3.13–6.3.15.
How does the dual-bank flash architecture benefit firmware updates in field-deployed systems?
The 2 MB flash is split into two independent banks, enabling Read-While-Write (RWW) operation. During an OTA update, new firmware can be written to the inactive bank while the system continues executing from the active bank - eliminating downtime and ensuring uninterrupted operation in mission-critical industrial or medical equipment.
Which hardware cryptographic functions are accelerated, and how are they applied in secure boot workflows?
The STM32F779NIH6 includes dedicated hardware for AES-128/192/256 encryption/decryption, SHA-1/SHA-224/SHA-256 hashing, HMAC generation, and true random number generation (TRNG). These accelerate secure boot by enabling fast signature verification (RSA/ECC via software + hash/crypto acceleration), encrypted image decryption, and entropy seeding for key derivation - all without consuming main CPU cycles.
STM32F779NIH6 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 216-TFBGA
- Series:
- STM32F7
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M7
- Core Size:
- 32-Bit Single-Core
- Speed:
- 216MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART/USART, USB OTG
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
- Number of I/O:
- 159
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 512K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.7V ~ 3.6V
- Data Converters:
- A/D 24x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
STM32F779NIH6 FAQ
1.How can I place an order for STM32F779NIH6 through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32F779NIH6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32F779NIH6 reliable?
The price and inventory of STM32F779NIH6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32F779NIH6 is usually 5 days.
3.What payment methods are accepted for STM32F779NIH6?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32F779NIH6 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STM32F779NIH6?
STM32F779NIH6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32F779NIH6 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32F779NIH6?
For technical support, including STM32F779NIH6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32F779NIH6 requirements.
6.How does Aetrix verify that STM32F779NIH6 is sourced from the original manufacturer or authorized distributors?
All STM32F779NIH6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32F779NIH6 meets industry standards.
7.What is the process for return or replacement of STM32F779NIH6?
All STM32F779NIH6 units undergo pre-shipment inspection (PSI). If there is an issue with STM32F779NIH6, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32F779NIH6 part is unused and in its original packaging.
Return procedure for STM32F779NIH6:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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