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STMicroelectronics STM32G081EBY3TR

Part No.:
STM32G081EBY3TR
Manufacturer:
STMicroelectronics
Category:
Microcontrollers
Package:
25-UFBGA, WLCSP
Datasheet:
AetrixSTM32G081EBY3TR.pdf
Description:
IC MCU 32BIT 128KB FLASH 25WLCSP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,671

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Product details

Overview

STM32G081EBY3TR from STMicroelectronics is a 32-bit Arm® Cortex®-M0+ microcontroller with 128 KB Flash, 36 KB SRAM, dual 12-bit DACs, 12-bit ADC (0.4 µs conversion), and AES-128/256 hardware encryption. It operates from 1.7–3.6 V across –40°C to 125°C and integrates USB Type-C™ Power Delivery controller, RTC with alarm, and four USARTs - deployed in industrial sensor nodes requiring secure, low-power edge processing.

For engineers reviewing the STM32G081EBY3TR datasheet, STM32G081EBY3TR pinout, STM32G081EBY3TR application, or STM32G081EBY3TR equivalent, key selection criteria include its 64 MHz max CPU frequency, 60 GPIOs (including 5 V-tolerant), dual DAC support for analog actuation, hardware RNG for cryptographic key generation, and LQFP64 package compatibility with legacy PCB layouts.

Technical Context

The STM32G081EBY3TR implements an Arm Cortex-M0+ core with Memory Protection Unit (MPU) and supports up to 64 MHz operation via internal 16 MHz RC + PLL or external 4–48 MHz crystal. Its clock system includes dual oscillators (HSE/LSE), programmable voltage detector (PVD), and brownout reset (BOR) for robust power management in fluctuating supply environments.

It features a 14-timer suite including two 128 MHz-capable advanced timers (TIM1/TIM17), one 32-bit general-purpose timer, five 16-bit GP timers, two low-power timers (LPTIM1/LPTIM2), and dual watchdogs - enabling precise motor control, real-time event scheduling, and ultra-low-power wake-up from Stop/Standby modes using LPUART or RTC.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm Cortex-M0+, 64 MHz max - enables deterministic real-time execution with MPU for task isolation in firmware updates.
Memory128 KB Flash (with securable area), 36 KB SRAM (32 KB with HW parity) - supports encrypted firmware storage and ECC-protected RAM for safety-critical data buffers.
Analog Peripherals12-bit ADC (16-channel, 0.4 µs), two 12-bit DACs, two rail-to-rail comparators - enables closed-loop analog sensing and actuation without external signal conditioning.
CommunicationFour USARTs (two ISO7816/LIN/IrDA), two I²C (Fast-mode Plus), two SPI (32 Mbit/s), HDMI CEC, USB Type-C PD controller - supports multi-protocol fieldbus integration and battery-powered peripheral negotiation.
Security & CryptoAES-128/256 hardware accelerator, True RNG, 96-bit unique ID - provides on-the-fly encryption for OTA firmware and entropy for TLS handshake key derivation.
Power Management1.7–3.6 V operation, Sleep/Stop/Standby/Shutdown modes, VBAT backup for RTC - achieves sub-µA standby current for battery-backed timekeeping in metering applications.
PackageLQFP64 (10 × 10 mm, 0.5 mm pitch) - compatible with standard reflow profiles and automated optical inspection (AOI) in high-volume manufacturing.

Pinout & Package

LQFP64 package (10 × 10 mm, 0.5 mm pitch), ECOPACK2-compliant, with exposed thermal pad for enhanced heat dissipation in continuous 64 MHz operation.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VDDA, VSS, VSSAPower supply and ground railsDual-domain power separation ensures analog accuracy (VDDA) remains stable during digital switching noise on VDD.
PA0–PA15, PB0–PB15, PC0–PC15, PD0–PD15, PF0–PF1General-purpose I/OsUp to 60 GPIOs, all mappable to EXTI; multiple pins are 5 V-tolerant - simplifies level-shifting in mixed-voltage systems.
NRSTActive-low reset inputAccepts external reset pulses or internal POR/PDR/BOR signals - enables synchronized recovery after brownout or watchdog timeout.
BOOT0Boot mode selectionHigh at power-up forces system memory boot (for DFU); low selects main Flash - critical for field firmware recovery sequences.
SWDIO / SWCLKSerial Wire Debug interfaceTwo-pin debug port supporting flash programming and real-time trace - eliminates need for JTAG header space on compact PCBs.

Key Features

FeatureDesign Value
USB Type-C Power Delivery controllerEnables bidirectional power negotiation and role swapping (source/sink) without external PD PHY - reduces BOM count in portable chargers and docking stations.
Hardware AES engineAccelerates encryption/decryption at >10 MB/s throughput - offloads CPU during secure bootloader verification or encrypted sensor log storage.
Low-power timers (LPTIM1/LPTIM2)Operate in Stop/Standby modes with 32 kHz LSE clock - allows precise periodic wake-up every 1–65535 seconds for sensor polling without full MCU restart.
Programmable voltage detector (PVD)Configurable threshold (2.2–2.9 V in steps) triggers interrupt before brownout - enables graceful shutdown of peripherals prior to system reset.
True random-number generator (RNG)Meets NIST SP800-90B entropy requirements - supplies cryptographically secure seeds for TLS handshakes and key derivation in IoT edge devices.

Applications

Industrial Sensor NodeSmart Energy Meter

Use Scenario: Battery-powered temperature/humidity node transmitting data via LoRaWAN every 15 minutes.

IC Role / Device Role / Timing Role: Main MCU executing sensor fusion, AES-encrypted payload generation, and LPUART wake-up from Stop mode.

Use Value: Sub-1 µA Standby current extends 10-year battery life; dual DACs drive analog calibration references for sensor offset compensation.

Use Scenario: DIN-rail mounted electricity meter with tamper detection and remote firmware update over PLC.

IC Role / Device Role / Timing Role: System controller managing metrology ADC interface, RTC-based billing intervals, and secure OTA update via AES-decrypted packets.

Use Value: Hardware RNG ensures unique session keys per update; 125°C rating supports operation inside sealed enclosures near transformers.

USB-C Charging DockMotor Control Gateway

Use Scenario: Multi-port dock negotiating power delivery profiles (5–20 V) while monitoring connected device status.

IC Role / Device Role / Timing Role: USB-C PD policy engine coordinating CC line signaling, VBUS monitoring, and power path FET control via GPIOs.

Use Value: Integrated USB-C PD controller eliminates external transceiver; 60 GPIOs route status LEDs, fan PWM, and thermal sensor inputs.

Use Scenario: BLDC motor gateway converting CAN commands to 3-phase PWM, with onboard current sensing and fault reporting.

IC Role / Device Role / Timing Role: Real-time motor controller using TIM1's complementary PWM outputs and ADC-triggered current sampling.

Use Value: Two 128 MHz-capable timers enable 20 kHz PWM carrier with dead-time insertion; CRC unit validates CAN frame integrity in software stack.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STM32G071CBT664 KB Flash, 20 KB SRAM, no USB-C PD controller, same LQFP48 packageLacks integrated USB-C PD logic; requires external PD PHY for charging negotiationSelect when USB-C PD is not required and cost reduction is prioritized over feature density.
STM32G0B1RET6512 KB Flash, 144 KB SRAM, same peripherals plus USB FS, LQFP64 packageHigher memory capacity and USB 2.0 FS support; identical pinout but larger die sizeChoose for future-proofing firmware scalability or adding USB HID/CDC functionality without PCB redesign.

Compared with STM32G071CBT6, the STM32G081EBY3TR adds 64 KB Flash, USB-C PD, and extended temperature range - justifying its use in secure, power-negotiating edge nodes. Against STM32G0B1RET6, it trades memory headroom for lower cost and proven qualification in high-volume industrial deployments.

Availability

STM32G081EBY3TR is available at Aetrix Electronics and suitable for industrial sensor nodes, smart energy meters, USB-C charging docks, and motor control gateways requiring stable component supply across automotive-grade temperature ranges and long-term production cycles.

Supply support for STM32G081EBY3TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power ICs, sensors, and analog components for industrial, automotive, and consumer markets.

The STM32G0 series targets cost-sensitive, low-power embedded applications demanding security, rich analog integration, and USB-C readiness - positioning the G081 as a mainstream entry into ST's scalable Cortex-M0+ portfolio.

FAQ

What is the maximum operating temperature specification for STM32G081EBY3TR?

The STM32G081EBY3TR is qualified for operation from –40°C to +125°C ambient temperature, verified per JEDEC JESD22-A104 and JESD22-A108 standards. This extended range supports deployment in enclosed industrial enclosures, automotive under-hood modules, and outdoor metering equipment without active cooling.

Does STM32G081EBY3TR support hardware-based secure boot?

Yes - it implements readout protection (RDP) levels with securable Flash area, boot lock bits, and hardware-enforced secure boot flow via system memory bootloader. The 96-bit unique ID and True RNG enable binding of firmware images to specific devices during manufacturing provisioning.

Can the dual DAC outputs be synchronized for simultaneous waveform generation?

Yes - both DAC channels (DAC1/DAC2) share a common trigger source (TIM6/TIM7 or software) and support synchronous update mode. This enables precise dual-channel analog output for differential signal generation, audio waveform synthesis, or coordinated actuator control without inter-channel skew.

Is the LQFP64 package of STM32G081EBY3TR RoHS and REACH compliant?

Yes - the LQFP64 package is ECOPACK2-compliant, meeting RoHS Directive 2011/65/EU and REACH Regulation (EC) No. 1907/2006. Lead-free matte tin finish, halogen-free molding compound, and fully traceable material declarations are provided in ST's official product change notifications (PCNs).

STM32G081EBY3TR Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Package/Case:
25-UFBGA, WLCSP
Series:
STM32G0
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
64MHz
Connectivity:
HDMI-CEC, I2C, IrDA, LINbus, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
23
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
36K x 8
Voltage - Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 12x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

STM32G081EBY3TR FAQ

1.How can I place an order for STM32G081EBY3TR through Aetrix?

Please submit a Request for Quotation (RFQ) for STM32G081EBY3TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STM32G081EBY3TR reliable?

The price and inventory of STM32G081EBY3TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32G081EBY3TR is usually 5 days.

3.What payment methods are accepted for STM32G081EBY3TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32G081EBY3TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STM32G081EBY3TR?

STM32G081EBY3TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STM32G081EBY3TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STM32G081EBY3TR?

For technical support, including STM32G081EBY3TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32G081EBY3TR requirements.

6.How does Aetrix verify that STM32G081EBY3TR is sourced from the original manufacturer or authorized distributors?

All STM32G081EBY3TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32G081EBY3TR meets industry standards.

7.What is the process for return or replacement of STM32G081EBY3TR?

All STM32G081EBY3TR units undergo pre-shipment inspection (PSI). If there is an issue with STM32G081EBY3TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STM32G081EBY3TR part is unused and in its original packaging.

Return procedure for STM32G081EBY3TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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