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STMicroelectronics STM32G473MBT3TR
- Part No.:
- STM32G473MBT3TR
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- -
- Datasheet:
-
STM32G473MBT3TR.pdf
- Description:
- IC MCU 32BIT 128KB FLASH 80LQFP
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Product details
Overview
STM32G473MBT3TR from STMicroelectronics is a 32-bit Arm® Cortex®-M4 microcontroller with FPU, 512 KB Flash (ECC-enabled), 128 KB SRAM (96 KB + 32 KB CCM), and operating frequency up to 170 MHz (213 DMIPS). It integrates dual-bank read-while-write Flash, CORDIC/FMAC math accelerators, and rich analog peripherals including five 12-bit ADCs (42-channel), seven 12-bit DACs, six rail-to-rail op-amps, and three FDCAN controllers - deployed in motor control and industrial power conversion systems.
For engineers reviewing the STM32G473MBT3TR datasheet, STM32G473MBT3TR pinout, STM32G473MBT3TR application, or STM32G473MBT3TR equivalent, key selection criteria include its 170 MHz real-time performance with ART Accelerator, integrated analog signal chain (ADC/DAC/OPAMP/COMP), FDCAN FD support, and LQFP48 package compatibility for space-constrained embedded control designs.
Technical Context
The STM32G473MBT3TR implements an Arm Cortex-M4 core with hardware FPU and Memory Protection Unit (MPU), enabling deterministic real-time execution and secure task isolation. Its Adaptive Real-Time (ART) Accelerator eliminates Flash wait states at 170 MHz, while the dual-bank Flash architecture supports seamless firmware updates without halting operation.
It features a dedicated interconnect matrix routing 16 DMA channels across multiple buses, ensuring concurrent high-bandwidth transfers between peripherals like ADCs, DACs, timers, and communication interfaces. The analog subsystem includes independent voltage reference buffer (VREFBUF) with selectable 2.048 V / 2.5 V / 2.9 V outputs and hardware oversampling up to 16-bit resolution on ADCs - critical for precision current/voltage sensing in closed-loop motor drives.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | Arm Cortex-M4 with FPU and MPU - enables deterministic real-time control and secure multitasking in safety-aware applications. |
| Max Clock Frequency | 170 MHz (213 DMIPS) with ART Accelerator - delivers zero-wait-state execution from Flash for time-critical ISR response. |
| Memory | 512 KB Flash (dual-bank, ECC, PCROP), 96 KB SRAM + 32 KB CCM SRAM - supports robust firmware updates and low-latency data buffering. |
| Analog Peripherals | 5 × 12-bit ADCs (42 ch, 0.25 µs), 7 × 12-bit DACs (3 buffered ext., 4 unbuffered int.), 6 op-amps, 7 comparators - enables full analog front-end integration for sensor conditioning and actuator feedback. |
| Timers | 14 timers including 3 × advanced motor control timers (TIM1/TIM8/TIM20) with dead-time generation and emergency stop - essential for 3-phase BLDC/PMSM drive control. |
| Communication | 3 × FDCAN FD controllers, 5 × USART, 4 × I²C, 4 × SPI, USB FS, UCPD - supports CAN FD-based fieldbus networks and USB-C PD negotiation in smart power systems. |
| Math Acceleration | CORDIC (trig/log/exp) + FMAC (filtering) - offloads CPU for real-time vector control (FOC) and digital filter computation. |
Pinout & Package
LQFP48 (7 × 7 mm, 0.5 mm pitch) package with exposed thermal pad - optimized for thermal dissipation in motor gate driver co-location and industrial PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA | Core & analog supply | 1.71–3.6 V operation; separate analog domain ensures stable ADC/DAC reference under digital switching noise. |
| VSS, VSSA | Digital & analog ground | Independent grounding reduces coupling between high-speed digital logic and sensitive analog circuits. |
| PA0–PA15, PB0–PB15, PC0–PC15, PD2, PF0–PF1 | General-purpose I/O | Up to 107 fast I/Os; many support 5 V tolerance and remappable EXTI - simplifies interface to legacy sensors and level-shifted peripherals. |
| PA1, PA2, PA3, PA4, PA5, PA6, PA7, PB0, PB1, PB10, PB11, PC0–PC5, PC10–PC15, PD2 | ADC input channels | 42-channel multiplexed analog inputs with hardware oversampling - enables high-resolution current sensing across 3-phase inverter legs. |
| PA4, PA5, PA6, PA7, PB0, PB1, PB10, PB11, PC0–PC5, PC10–PC15 | DAC output channels | 7 × 12-bit DACs: 3 buffered external outputs (1 MSPS) for analog setpoints; 4 unbuffered internal outputs (15 MSPS) for fast PWM dithering or waveform synthesis. |
| PA8–PA15, PB13–PB15, PC6–PC9, PD12–PD15 | FDCAN TX/RX | Three independent FDCAN FD transceivers with flexible data-rate support - enables multi-node diagnostics and high-throughput telemetry in industrial automation. |
| PA0, PA1, PA2, PA3, PA6, PA7, PB0, PB1, PB10, PB11, PC0–PC5, PC10–PC15 | Op-amp inputs/outputs | Six rail-to-rail op-amps with PGA mode; all terminals accessible - allows configurable gain stages for shunt-based current measurement without external components. |
Key Features
| Feature | Design Value |
|---|---|
| CORDIC + FMAC hardware accelerators | Reduces CPU load for trigonometric and FIR/IIR filtering operations - enables real-time Field-Oriented Control (FOC) at >20 kHz loop rates. |
| Dual-bank Flash with read-while-write | Allows background firmware update during runtime without interrupting motor control loops or safety monitoring tasks. |
| Advanced motor control timers (TIM1/TIM8/TIM20) | Integrated dead-time insertion, complementary PWM outputs, and emergency stop input - eliminates need for external gate driver protection logic. |
| VREFBUF with 3 programmable outputs | Provides stable 2.048 V / 2.5 V / 2.9 V references for ADC, DAC, and comparator thresholds - improves accuracy of analog measurements across temperature. |
| 3 × FDCAN FD controllers | Supports simultaneous CAN FD communication on multiple buses - ideal for modular inverters with distributed control and diagnostics. |
Applications
| Industrial Motor Drives | Smart Power Supplies |
|---|---|
Use Scenario: Closed-loop control of 3-phase BLDC/PMSM motors in HVAC compressors and industrial pumps. IC Role / Device Role / Timing Role: Main system controller executing Field-Oriented Control (FOC) algorithm, managing gate drivers via advanced timers, and sampling current/voltage via synchronized ADCs. Use Value: Integrated CORDIC/FMAC accelerates vector transformations; 170 MHz core ensures sub-1 µs current loop execution; dual-bank Flash enables safe over-the-air firmware updates. |
Use Scenario: Digital AC/DC and DC/DC power supplies with adaptive voltage regulation and fault logging. IC Role / Device Role / Timing Role: Primary digital controller handling PID voltage/current regulation, thermal management, and USB-C PD negotiation via UCPD peripheral. Use Value: Seven DAC outputs generate precise reference voltages; FDCAN FD enables remote monitoring of parallel PSUs; VREFBUF stabilizes feedback references across line/load transients. |
| Programmable Logic Controllers (PLCs) | Energy Metering Gateways |
Use Scenario: Compact DIN-rail mounted PLC modules requiring analog I/O expansion and deterministic real-time I/O scanning. IC Role / Device Role / Timing Role: Central processing unit managing discrete I/O, analog input conditioning (via op-amps/ADC), and fieldbus communication (FDCAN/I²C/USART). Use Value: 107 fast I/Os with EXTI mapping simplify wiring to sensors/actuators; hardware parity on SRAM ensures data integrity in mission-critical control cycles. |
Use Scenario: Smart electricity meters with harmonic analysis, tamper detection, and secure data upload via cellular or LoRaWAN. IC Role / Device Role / Timing Role: Secure metering engine performing RMS/harmonic calculations using FMAC, managing RTC-based billing intervals, and encrypting data with RNG+AES acceleration. Use Value: True RNG seeds cryptographic keys; calendar RTC with alarm enables scheduled meter reads; 512 KB Flash stores firmware + encrypted usage logs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance mixed-signal microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32G474RET6 | Same core/peripherals but 512 KB Flash + 256 KB SRAM; LQFP64 package (64-pin vs. 48-pin) | Requires larger PCB footprint; better suited for designs needing extra SRAM for complex GUI or protocol stacks | Select when additional RAM or more GPIOs are required; not pin-compatible with STM32G473MBT3TR. |
| STM32F303RET6 | Lower clock (72 MHz), no CORDIC/FMAC, only 1 × FDCAN, 256 KB Flash, 48 KB SRAM | Lacks math acceleration and dual-bank Flash - unsuitable for real-time FOC or safe firmware updates | Consider only for cost-sensitive, non-FD-CAN applications where 170 MHz performance and advanced analog features are unnecessary. |
Compared with STM32G474RET6, the STM32G473MBT3TR offers identical peripheral richness in a smaller LQFP48 package but less SRAM; versus STM32F303RET6, it delivers 2.4× higher compute throughput, integrated math acceleration, and FDCAN FD - making it uniquely suitable for next-generation motor control and smart power systems.
Availability
STM32G473MBT3TR is available at Aetrix Electronics and suitable for industrial motor drives, smart power supplies, programmable logic controllers, and energy metering gateways requiring stable component supply, long-term lifecycle assurance, and automotive-grade reliability.
Supply support for STM32G473MBT3TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for industrial, automotive, and consumer markets.
The STM32G4 series targets high-efficiency digital power conversion and real-time motor control, combining Arm Cortex-M4 performance with integrated analog peripherals and hardware math acceleration to replace discrete signal-chain components.
FAQ
What is the maximum operating temperature range for STM32G473MBT3TR?
The STM32G473MBT3TR is rated for industrial temperature range: –40 °C to +85 °C ambient. This is confirmed in Section 5.3.1 of DS12712 Rev 5, with thermal derating guidelines provided in Table 16 (Thermal Characteristics) and Section 6.11. Its LQFP48 package has θJA = 47.5 °C/W, supporting reliable operation in enclosed motor drive enclosures without forced airflow.
Does STM32G473MBT3TR support USB Type-C Power Delivery negotiation?
Yes - it integrates a dedicated USB Type-C™ / USB Power Delivery controller (UCPD) peripheral compliant with USB PD 3.0 specification. This enables native source/sink role negotiation, VCONN switching, and BMC physical layer signaling without external PD controllers, as detailed in Section 3.35 and electrical characteristics Table 5.3.29 of DS12712.
How many independent ADC instances does STM32G473MBT3TR have, and what is their maximum sampling rate?
It contains five independent 12-bit ADCs (ADC1–ADC5), each capable of 0.25 µs conversion time (4 MSPS). With hardware oversampling, effective resolution reaches 16 bits at reduced rates. All five support simultaneous sampling triggered by advanced timers - critical for synchronized current sensing in 3-phase motor control, per Section 3.18 and Table 2 of DS12712.
Is the STM32G473MBT3TR pin-compatible with other STM32G473 variants in LQFP48 package?
Yes - all STM32G473xB/C/E variants in LQFP48 (e.g., STM32G473CBT3, STM32G473RBT3) share identical pinout and footprint per Section 4.2 (LQFP48 pinout description) and Table 12 (pin definition) in DS12712. Differences are limited to Flash size (128/256/512 KB) and SRAM configuration - enabling scalable design reuse across product tiers.
STM32G473MBT3TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
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- Tape & Reel (TR)
- Product Status:
- Active
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STM32G473MBT3TR FAQ
1.How can I place an order for STM32G473MBT3TR through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32G473MBT3TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32G473MBT3TR reliable?
The price and inventory of STM32G473MBT3TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32G473MBT3TR is usually 5 days.
3.What payment methods are accepted for STM32G473MBT3TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32G473MBT3TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STM32G473MBT3TR?
STM32G473MBT3TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32G473MBT3TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32G473MBT3TR?
For technical support, including STM32G473MBT3TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32G473MBT3TR requirements.
6.How does Aetrix verify that STM32G473MBT3TR is sourced from the original manufacturer or authorized distributors?
All STM32G473MBT3TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32G473MBT3TR meets industry standards.
7.What is the process for return or replacement of STM32G473MBT3TR?
All STM32G473MBT3TR units undergo pre-shipment inspection (PSI). If there is an issue with STM32G473MBT3TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32G473MBT3TR part is unused and in its original packaging.
Return procedure for STM32G473MBT3TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
STM32G473MBT3TR Tags
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