STMicroelectronics STM32H503EBY6TR
- Part No.:
- STM32H503EBY6TR
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- 25-UFBGA, WLCSP
- Datasheet:
-
STM32H503EBY6TR.pdf
- Description:
- IC MCU 32BIT 128KB FLASH 25WLCSP
- Quantity:
- Payment:

- Shipping:

Inventory:4,730
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Product details
Overview
STM32H503EBY6TR from STMicroelectronics is an Arm® Cortex®-M33 32-bit microcontroller with FPU, operating up to 250 MHz (375 DMIPS), featuring 128 Kbytes flash memory with ECC, 32 Kbytes SRAM with ECC, and integrated I3C interface. It delivers secure, low-power operation for industrial edge nodes, smart sensors, and battery-powered IoT endpoints requiring real-time control and cryptographic acceleration.
For engineers reviewing the STM32H503EBY6TR datasheet, STM32H503EBY6TR pinout, STM32H503EBY6TR application, or STM32H503EBY6TR equivalent, key selection criteria include its dual-bank read-while-write flash architecture, hardware HASH/SHA-2 and TRNG security blocks, 12-bit ADC at 2.5 MSPS, ultra-low-power comparator, and support for Stop mode with LPTIM wake-up - all in a WLCSP25 package (2.33 × 2.24 mm).
Technical Context
The device implements a TrustZone-enabled Arm Cortex-M33 core with Memory Protection Unit (MPU) and optional secure firmware isolation. Its ART Accelerator includes an 8-Kbyte 2-way set-associative instruction cache enabling zero-wait-state execution from flash at 250 MHz.
Power management integrates dual PLLs (system/USB/audio), embedded LDO regulator, and three low-power modes (Sleep, Stop, Standby) with VBAT-backed RTC and 32 backup registers. Analog subsystem comprises one 12-bit ADC, dual-channel 12-bit DAC, one op-amp (7 MHz GBW), and one ultra-low-power comparator.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M33 with FPU, MPU, DSP extensions - enables deterministic real-time control with secure partitioning via TrustZone. |
| Max Clock Frequency | 250 MHz - supports high-throughput signal processing and multi-threaded RTOS workloads. |
| Flash Memory | 128 Kbytes with ECC and dual-bank RWW - allows seamless firmware updates without halting execution. |
| SRAM | 32 Kbytes with ECC + 2 Kbytes OTP + 2 Kbytes backup SRAM - ensures data integrity and retention during power loss. |
| Analog Peripherals | 1× 12-bit ADC (2.5 MSPS), 1× dual-channel 12-bit DAC, 1× op-amp (7 MHz), 1× ultra-low-power comparator - supports sensor signal conditioning and closed-loop control. |
| Security Features | HASH (SHA-1/SHA-2), HMAC, TRNG, 96-bit unique ID, active tamper detection - meets IEC 62443-3-3 SL2 requirements for secure boot and firmware validation. |
| Communication | I3C (shared with I2C), 3× USART/LPUART, 3× SPI/I2S, FDCAN, USB 2.0 FS host/device - enables mixed-protocol connectivity in constrained-edge systems. |
Pinout & Package
STM32H503EBY6TR uses the WLCSP25 (B0GN) package: 25-ball, 0.4 mm pitch, 2.33 × 2.24 mm footprint, suitable for space-constrained PCBs. Ballout follows JEDEC MO-255 standard with 5 × 5 array (corner balls missing).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Core & I/O supply | 1.71–3.6 V main power input; decoupled via external VCAP capacitor for stable core regulation. |
| VSS | Ground reference | Dedicated analog/digital ground pins ensure noise separation for mixed-signal operation. |
| PA0 | GPIO / ADC1_IN0 / TIM2_CH1 | Multi-function pin supporting analog sensing, timer capture, or general I/O with 5 V tolerance. |
| PC13 | RTC oscillator input (LSE) | Connects to 32.768 kHz crystal for calendar-accurate timekeeping in Standby mode. |
| NRST | Active-low reset input | Asynchronous reset with internal pull-up; accepts external push-button or supervisor IC assertion. |
| BOOT0 | Boot mode selection | High at power-up selects system memory bootloader; tied low for normal flash execution. |
Key Features
| Feature | Design Value |
|---|---|
| ART Accelerator with 8-Kbyte ICACHE | Enables 0-wait-state flash execution at 250 MHz, eliminating performance penalty of on-chip code storage. |
| Dual-bank flash with RWW | Allows background firmware update while application runs - critical for OTA reliability in field-deployed devices. |
| Hardware crypto accelerators (HASH/TRNG) | Offloads SHA-256 signing and secure key generation from CPU, reducing latency and power in TLS handshakes. |
| Ultra-low-power comparator | Consumes <100 nA in standby with wake-up capability - ideal for battery voltage monitoring or threshold-triggered events. |
| Flexible clock system with two PLLs | Separates system, USB, audio, and ADC clocks - prevents jitter coupling and simplifies EMI compliance. |
Applications
| Industrial Sensor Node | Smart Metering Endpoint |
|---|---|
Use Scenario: Compact, battery-operated temperature/humidity node with wireless telemetry. IC Role / Device Role / Timing Role: Main controller executing sensor fusion, secure OTA updates, and low-power scheduling via LPTIM. Use Value: Dual-bank flash enables safe firmware patching; TRNG + HASH secures firmware signature verification; Stop mode current <1.5 µA extends 10-year battery life. | Use Scenario: Electricity meter with tamper detection, metrology ADC interface, and PLC/RF communication. IC Role / Device Role / Timing Role: Secure host MCU managing metrology data, encryption, and real-time clock with calendar backup. Use Value: Active tamper detection triggers erase of sensitive keys; VBAT-backed RTC maintains billing timestamps during mains outage; 12-bit ADC supports Class 0.5 accuracy sampling. |
| IoT Edge Gateway | Medical Wearable Controller |
Use Scenario: BLE/Wi-Fi gateway aggregating data from multiple BLE sensors and forwarding via MQTT. IC Role / Device Role / Timing Role: Protocol bridge with concurrent I3C (sensor hub), USART (BLE module), and USB (debug/config). Use Value: I3C bus reduces wiring vs I2C, lowering BOM cost; hardware crypto accelerates TLS 1.2 handshake; 49 GPIOs support flexible peripheral expansion. | Use Scenario: ECG patch with analog front-end, motion sensing, and Bluetooth LE radio. IC Role / Device Role / Timing Role: Signal processor running real-time QRS detection, HRV analysis, and secure health data packaging. Use Value: Op-amp and comparator condition biopotential signals; DAC generates calibration references; TrustZone isolates PII data from application firmware. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32H563VIT6 | Higher flash (2 Mbytes), larger LQFP100 package, added Ethernet MAC and Octo-SPI - no WLCSP option. | Suitable for gateway-class devices needing network stack offload and external memory expansion. | Select when >512 Kbytes flash, Ethernet, or external PSRAM/XIP Flash are required; not pin-compatible. |
| STM32U575ZIT6 | Lower max frequency (160 MHz), smaller flash (2 Mbytes), same WLCSP25 option but lacks I3C and FDCAN. | Better suited for ultra-low-power sensor hubs where I3C bandwidth and CAN bus are unnecessary. | Choose for sub-1 µA Stop mode current and longer battery life where 250 MHz performance and I3C are not needed. |
Compared with STM32H563VIT6, the STM32H503EBY6TR trades flash capacity and interface count for minimal footprint and I3C-native sensor integration; versus STM32U575ZIT6, it delivers higher compute density and next-gen serial bus support at slightly higher active power.
Availability
STM32H503EBY6TR is available at Aetrix Electronics and suitable for industrial sensor nodes, smart metering endpoints, IoT edge gateways, and medical wearable controllers requiring stable component supply across long-lifecycle deployments.
Supply support for STM32H503EBY6TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, MEMS, and automotive-grade components.
The STM32H5 series targets secure, high-performance edge computing with hardware-enforced TrustZone, cryptographic accelerators, and advanced low-power modes - optimized for industrial IoT and certified medical devices.
FAQ
What is the maximum operating temperature range for STM32H503EBY6TR?
The STM32H503EBY6TR is rated for industrial temperature range: –40 °C to +85 °C ambient. This is validated per DS14053 Rev 4 Section 5.3.1, with thermal derating applied above 70 °C for sustained 250 MHz operation. The WLCSP25 package's θJA is 190 °C/W (JEDEC JESD51-2), requiring careful PCB copper pour design for thermal management.
Does STM32H503EBY6TR support debug authentication out of the box?
Yes - authenticated debug is enabled by default via the Secure Boot ROM. Debug access requires valid cryptographic credentials (e.g., signed debug certificate) provisioned during manufacturing or via ST's Secure Manager tool. SWD/JTAG ports remain locked until authentication succeeds, preventing unauthorized firmware extraction or modification.
Can the internal 48 MHz HSI48 oscillator be used as the system clock source?
Yes - the HSI48 can directly drive the system clock via RCC configuration. It is factory-trimmed to ±0.5% accuracy over temperature and voltage, making it suitable for USB full-speed timing without external crystal. However, for FDCAN or precise RTC calibration, HSE or LSE is recommended per Section 3.10 and Table 39 of DS14053 Rev 4.
How many independent power domains does STM32H503EBY6TR have?
The device has three independent power domains: VDD (core/I/O), VDDA (analog), and VBAT (backup). VDDA is internally regulated from VDD and must be decoupled separately to ensure ADC/DAC accuracy. VBAT powers RTC and backup registers during main supply loss, with dedicated diode-OR circuitry per Section 3.8.5 and Figure 14 in DS14053 Rev 4.
STM32H503EBY6TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 25-UFBGA, WLCSP
- Series:
- STM32H5
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit
- Speed:
- 250MHz
- Connectivity:
- CANbus, FIFO, I2C, IrDA, LINbus, SCI, SDIO, SMBus, SPI, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, PDR, POR, PWM, SHA, TRNG, Voltage Detect, WDT
- Number of I/O:
- 19
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 10x12b SAR; D/A 1x12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
STM32H503EBY6TR FAQ
1.How can I place an order for STM32H503EBY6TR through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32H503EBY6TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32H503EBY6TR reliable?
The price and inventory of STM32H503EBY6TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32H503EBY6TR is usually 5 days.
3.What payment methods are accepted for STM32H503EBY6TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32H503EBY6TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STM32H503EBY6TR?
STM32H503EBY6TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32H503EBY6TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32H503EBY6TR?
For technical support, including STM32H503EBY6TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32H503EBY6TR requirements.
6.How does Aetrix verify that STM32H503EBY6TR is sourced from the original manufacturer or authorized distributors?
All STM32H503EBY6TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32H503EBY6TR meets industry standards.
7.What is the process for return or replacement of STM32H503EBY6TR?
All STM32H503EBY6TR units undergo pre-shipment inspection (PSI). If there is an issue with STM32H503EBY6TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32H503EBY6TR part is unused and in its original packaging.
Return procedure for STM32H503EBY6TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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