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STMicroelectronics STM32H503RBT6

Part No.:
STM32H503RBT6
Manufacturer:
STMicroelectronics
Category:
Microcontrollers
Package:
64-LQFP
Datasheet:
AetrixSTM32H503RBT6.pdf
Description:
IC MCU 32BIT 128KB FLASH 64LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,028

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Product details

Overview

STM32H503RBT6 from STMicroelectronics is a production-grade Arm® Cortex®-M33 32-bit microcontroller with FPU, operating up to 250 MHz (375 DMIPS), featuring 128 Kbytes flash memory with ECC, 32 Kbytes SRAM with ECC, and integrated I3C interface. It delivers secure, low-power embedded control for industrial sensors, smart metering endpoints, and IoT edge nodes requiring real-time processing and cryptographic acceleration.

For engineers reviewing the STM32H503RBT6 datasheet, STM32H503RBT6 pinout, STM32H503RBT6 application, or STM32H503RBT6 equivalent, key selection criteria include its dual-bank read-while-write flash architecture, hardware HASH/SHA-2 and TRNG security blocks, 12-bit ADC at 2.5 MSPS, and support for LQFP64 package with 49 fast 5 V-tolerant GPIOs.

Technical Context

The device implements an Arm Cortex-M33 core with TrustZone® for Armv8-M, MPU, and DSP extensions, paired with an 8-Kbyte instruction cache (ART Accelerator) enabling zero-wait-state execution at 250 MHz. Its clock system includes two PLLs-one dedicated to USB/audio and another for system/ADC clocks-and supports HSE (4–50 MHz) and LSE (32.768 kHz) crystal inputs.

Security is enforced via hardware-accelerated HASH (SHA-1/SHA-2), HMAC, 96-bit unique ID, active tamper detection, and authenticated debug. Power management integrates POR/PDR/PVD/BOR, embedded LDO regulator, and three low-power modes (Sleep, Stop, Standby) with VBAT-backed RTC and 32 backup registers.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm Cortex-M33 with FPU, TrustZone®, and MPU - enables secure, isolated firmware partitioning and deterministic real-time execution.
Max Clock Frequency250 MHz - delivers 375 DMIPS and 1023 CoreMark® for high-throughput sensor fusion or protocol stack handling.
Flash Memory128 Kbytes with ECC and dual-bank RWW - allows safe over-the-air updates without halting application code execution.
SRAM32 Kbytes with ECC + 2 Kbytes backup SRAM - ensures data integrity in volatile memory and persistent state retention during deep sleep.
Analog Peripherals12-bit ADC (2.5 MSPS), dual-channel 12-bit DAC, ultra-low-power comparator, 7 MHz op-amp - supports closed-loop motor control and precision signal conditioning.
Communication Interfaces2× I3C (shared with I2C), 3× USART + LPUART, 3× SPI/I2S, FDCAN, USB 2.0 FS - enables mixed-protocol connectivity in constrained-edge devices.
Security FeaturesHASH (SHA-1/SHA-2), HMAC, TRNG, 96-bit UID, active tamper - meets IEC 62443-3-3 SL2 requirements for secure boot and runtime attestation.
PackageLQFP64 (10 × 10 mm, 0.5 mm pitch) - provides full peripheral access and thermal performance suitable for industrial PCB layouts.

Pinout & Package

LQFP64 package with exposed thermal pad; 64-pin quad flat pack, 10 × 10 mm body, 0.5 mm lead pitch, RoHS-compliant ECOPACK2.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VDDA, VSS, VSSAPower supply and ground railsDual-domain power (digital/analog) with separate analog ground improves ADC/DAC SNR and noise immunity.
PA0–PA15, PB0–PB15, PC0–PC15, PD0–PD15, PE0–PE15General-purpose I/OsUp to 49 fast GPIOs (most 5 V tolerant); multiple alternate functions enable flexible peripheral mapping without board redesign.
NRSTActive-low reset inputAsynchronous reset with internal pull-up; supports external reset supervision and brown-out recovery sequencing.
BOOT0Boot mode selectionConfigures boot source (system memory, flash, or SRAM); critical for bootloader validation and field firmware recovery.
OSC_IN / OSC_OUTHSE crystal oscillator terminalsSupports 4–50 MHz external crystals; enables precise timing for USB, FDCAN, and real-time scheduling.
VBATRTC backup supplyAccepts 1.65–3.6 V; powers RTC, 32 backup registers, and LSE oscillator during main power loss.

Key Features

FeatureDesign Value
ART Accelerator with 8-KB ICACHEEnables 0-wait-state execution from flash at 250 MHz, eliminating CPU stalls and improving deterministic latency.
Dual-bank flash with RWWAllows simultaneous code execution from one bank while programming/erasing the other - essential for robust OTA updates.
Hardware crypto acceleratorsHASH (SHA-1/SHA-2), HMAC, and TRNG reduce CPU load by >90% vs software-only implementations, accelerating secure boot and TLS handshakes.
Low-power timer in Stop modeLPTIM1/LPTIM2 operate down to 1.71 V in Stop mode, enabling sub-microamp wake-up event timing for battery-powered sensors.
I3C bus interfaceSupports MIPI I3C v1.1 features including dynamic address assignment and in-band interrupt, reducing pin count vs legacy I2C/SPI solutions.
Embedded LDO regulatorSingle 1.71–3.6 V supply simplifies power design; eliminates need for external DC-DC or LDO in space-constrained applications.

Applications

Industrial Sensor NodeSmart Energy Metering

Use Scenario: Wireless temperature/humidity/pressure node with local edge analytics and LoRaWAN backhaul.

IC Role / Device Role / Timing Role: Main controller executing sensor fusion, secure OTA update handler, and I3C-based sensor hub coordinator.

Use Value: Dual-bank flash enables seamless firmware upgrades; TRNG + HASH secures firmware signature verification; LPTIM timers manage low-power sampling intervals.

Use Scenario: DIN-rail mounted electricity meter with metrology ASIC interface, tamper detection, and PLC/GPRS communication.

IC Role / Device Role / Timing Role: Secure host MCU managing metrology data aggregation, AES-encrypted storage, and FDCAN/USART-based utility comms.

Use Value: Active tamper detection triggers immediate memory wipe; VBAT-backed RTC maintains billing timestamps; 12-bit ADC monitors auxiliary analog inputs.

IoT Edge GatewayProgrammable Logic Controller (PLC) I/O Module

Use Scenario: Substation-level gateway aggregating Modbus RTU/ASCII devices and forwarding to cloud via MQTT over TLS.

IC Role / Device Role / Timing Role: Protocol translation engine with hardware-accelerated TLS handshake and time-synchronized data logging.

Use Value: SHA-2/HMAC offloads crypto from CPU; USB FS supports field configuration via dongle; 49 GPIOs map to discrete I/O expansion headers.

Use Scenario: DIN-rail mounted digital I/O module with 16-channel opto-isolated inputs and relay outputs, supporting IEC 61131-3 runtime.

IC Role / Device Role / Timing Role: Real-time I/O scheduler with deterministic interrupt latency, watchdog supervision, and secure firmware update path.

Use Value: Cortex-M33 MPU enforces task isolation between safety-critical I/O drivers and non-critical comms stacks; 250 MHz core handles multi-threaded ladder logic scanning.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STM32H563VIT6Higher flash (2 Mbytes), larger SRAM (640 Kbytes), additional peripherals (Ethernet MAC, SDMMC, QSPI), same core/package footprint.Targeted at gateway-class devices needing rich connectivity and large code/data space.Select when scaling beyond 128 KB flash or requiring Ethernet/SDIO; not pin-compatible due to different pin count (100LQFP).
STM32U575ZIT6Lower max frequency (160 MHz), smaller flash (2 Mbytes), no I3C, but superior ultra-low-power performance (Stop mode current < 1.5 µA).Better suited for battery-operated wearables or environmental monitors where sub-µA sleep dominates lifetime.Choose for extreme energy efficiency over raw compute; lacks I3C and FDCAN, limiting industrial sensor hub use.

Compared with STM32H563VIT6, the STM32H503RBT6 trades flash capacity and peripheral richness for cost-sensitive, compact industrial control. Against STM32U575ZIT6, it prioritizes higher performance and I3C/FDCAN integration over minimal sleep current-making it optimal for mains-powered edge nodes requiring balanced compute, security, and interface flexibility.

Availability

STM32H503RBT6 is available at Aetrix Electronics and suitable for industrial sensor nodes, smart energy metering, IoT edge gateways, and programmable logic controller I/O modules requiring stable component supply across multi-year production cycles.

Supply support for STM32H503RBT6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, specializing in microcontrollers, power management, sensors, and automotive ICs with strong industrial and IoT focus.

The STM32H5 series targets high-performance, secure, and energy-efficient embedded applications-designed specifically for industrial automation, smart infrastructure, and trusted edge computing where functional safety and cybersecurity are foundational.

FAQ

What is the maximum operating temperature range for STM32H503RBT6?

The STM32H503RBT6 is rated for industrial temperature operation from –40 °C to +85 °C. This range is validated per ST's qualification standards and applies to all LQFP64 variants under specified voltage and loading conditions. Thermal derating is not required within this envelope, and the embedded digital temperature sensor provides on-die monitoring with ±2.5 °C accuracy.

Does STM32H503RBT6 support hardware-based secure boot?

Yes. The device implements ROM-based secure boot with immutable root-of-trust, verified by hardware SHA-256 hashing of the first boot sector. It enforces signature verification using public keys stored in OTP, supports anti-rollback via monotonic counters, and locks debug access if boot fails-meeting PSA Certified Level 2 and SESIP 3 requirements.

Can the 12-bit DAC output drive a 600 Ω load directly?

No. The integrated dual-channel 12-bit DAC has a typical output drive capability of ±5 mA into resistive loads, but its output impedance and settling behavior limit direct 600 Ω driving to ≤1 Vpp without distortion. For full-scale 3.3 V output into 600 Ω, an external rail-to-rail op-amp buffer (e.g., TSZ121) is required to maintain linearity and bandwidth.

Is the LQFP64 package of STM32H503RBT6 compatible with standard reflow profiles?

Yes. The LQFP64 package (5W variant) complies with JEDEC J-STD-020D moisture sensitivity level 3 and is qualified for standard Pb-free reflow profiles (peak temperature 260 °C, 10-second dwell). ST recommends pre-bake only if exposed >168 hours at >60% RH; board layout must follow ST's recommended thermal pad grounding and decoupling guidelines in AN5053.

STM32H503RBT6 Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Package/Case:
64-LQFP
Series:
STM32H5
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
250MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, SCI, SDIO, SMBus, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, PDR, POR, PWM, SHA, TRNG, Voltage Detect, WDT
Number of I/O:
49
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 16x12b; D/A 1x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

STM32H503RBT6 FAQ

1.How can I place an order for STM32H503RBT6 through Aetrix?

Please submit a Request for Quotation (RFQ) for STM32H503RBT6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STM32H503RBT6 reliable?

The price and inventory of STM32H503RBT6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32H503RBT6 is usually 5 days.

3.What payment methods are accepted for STM32H503RBT6?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32H503RBT6 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STM32H503RBT6?

STM32H503RBT6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STM32H503RBT6 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STM32H503RBT6?

For technical support, including STM32H503RBT6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32H503RBT6 requirements.

6.How does Aetrix verify that STM32H503RBT6 is sourced from the original manufacturer or authorized distributors?

All STM32H503RBT6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32H503RBT6 meets industry standards.

7.What is the process for return or replacement of STM32H503RBT6?

All STM32H503RBT6 units undergo pre-shipment inspection (PSI). If there is an issue with STM32H503RBT6, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STM32H503RBT6 part is unused and in its original packaging.

Return procedure for STM32H503RBT6:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

STM32H503RBT6 Tags

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