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STMicroelectronics STM32H533VEI6

Part No.:
STM32H533VEI6
Manufacturer:
STMicroelectronics
Category:
Microcontrollers
Package:
100-UFBGA
Datasheet:
AetrixSTM32H533VEI6.pdf
Description:
IC MCU 32BIT 512KB FLSH 100UFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:200

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Product details

Overview

STM32H533VEI6 from STMicroelectronics is an Arm® Cortex®-M33 32-bit microcontroller with TrustZone® security, FPU, and 250 MHz max clock frequency. It integrates 512 Kbytes of ECC-protected flash (dual-bank read-while-write), 272 Kbytes of SRAM (80 Kbytes with ECC), dual 12-bit ADCs (5 Msps), two AES coprocessors (one DPA-resistant), and hardware-based secure boot via ST-iROT. It targets secure industrial edge nodes requiring real-time control, encrypted firmware updates, and tamper-aware operation.

For engineers reviewing the STM32H533VEI6 datasheet, STM32H533VEI6 pinout, STM32H533VEI6 application, or STM32H533VEI6 equivalent, key selection criteria include TrustZone-enforced peripheral isolation, Octo-SPI on-the-fly decryption support, PSA Level 3/SESIP3 certification, and dual DMA controllers for offloading cryptographic operations in low-power modes.

Technical Context

The STM32H533VEI6 implements a dual-domain Armv8-M architecture: Secure and Non-secure worlds are enforced by TrustZone®, with up to eight configurable SAU regions and securable peripherals including GPIO, timers, and communication interfaces. Its GTZC (Global TrustZone Controller) manages memory and peripheral access rights at runtime.

It features two independent DMA controllers supporting secure/non-secure channel arbitration, ART Accelerator with 8-Kbyte instruction cache and 4-Kbyte data cache for zero-wait-state execution, and hardware accelerators for AES, PKA, HASH (SHA-1/2/3), and true random number generation (NIST SP800-90B compliant).

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core Arm Cortex-M33 with TrustZone, FPU, MPU, 250 MHz max - enables deterministic real-time execution with hardware-enforced security partitioning.
Memory 512 Kbytes flash (ECC, dual-bank RWW), 272 Kbytes SRAM (80 Kbytes SRAM2 with ECC) - supports concurrent firmware update and execution with data integrity protection.
Analog Dual 12-bit ADCs (5 Msps total), 2-channel 12-bit DAC, digital temperature sensor - enables high-speed sensor fusion and closed-loop analog control without external converters.
Security PSA Level 3 & SESIP3 certified; ST-iROT root of trust; SFI; OTFDEC for Octo-SPI; HUK-based secure storage - meets IEC 62443-4-2 requirements for industrial IoT endpoints.
Peripherals 2× FDCAN, 6× U(S)ART, 3× I²C, 2× I³C, USB FS host/device (crystal-less), UCPD, HDMI-CEC, DCMI - supports multi-protocol industrial gateway and human-machine interface functions.
Power 1.71–3.6 V supply; Sleep/Stop/Standby modes; VBAT RTC + 32 backup registers - enables battery-backed operation and ultra-low-power sensing intervals down to sub-μA.
Package LQFP100 (14 × 14 mm, 0.5 mm pitch) - standard footprint compatible with automated assembly and thermal management for industrial PCBs.

Pinout & Package

LQFP100 package (14 × 14 mm, 0.5 mm pitch), 100-pin quad flat pack with exposed thermal pad; RoHS-compliant ECOPACK2 finish; operating junction temperature range: –40 °C to +125 °C.

Pin/Terminal Circuit Role Design Meaning
VDD, VDDA, VSS, VSSA Power supply and ground rails Separate analog/digital domains with dedicated decoupling paths; VDDA must be ≥ VDD for ADC/DAC accuracy and noise immunity.
NRST Active-low reset input Asynchronous reset with internal pull-up; supports external reset supervision and brown-out detection via PVD/BOR circuitry.
BOOT0 Boot mode selection High at power-up selects system memory bootloader; low selects user flash - enables field firmware recovery without debugger.
PA0–PA15, PB0–PB15, etc. General-purpose I/Os Up to 112 fast I/Os (most 5 V-tolerant); ten support independent 1.08 V supply - allows interfacing with mixed-voltage peripherals and low-power sensors.
PC13–PC15 RTC-related pins PC13 = RTC_OUT; PC14/PC15 = LSE crystal inputs - enables precision timekeeping and calendar functions with battery backup via VBAT.
PD0–PD1 OCTOSPI clock/data lines Octo-SPI interface supporting x8/x4/x1 modes; enables direct execution from encrypted external PSRAM/NOR/Flash via OTFDEC engine.

Key Features

Feature Design Value
TrustZone-aware peripherals All major peripherals (GPIO, UART, SPI, timers) configurable as Secure/Non-secure - enables hardware-isolated secure boot, crypto services, and OTA update verification.
On-the-fly decryption (OTFDEC) Hardware engine decrypting Octo-SPI memory contents in real time using AES-128/256 - eliminates software overhead and memory exposure during external code execution.
Secure Firmware Installation (SFI) Immutable ST-iROT validates signed firmware images before loading into flash - prevents unauthorized or corrupted firmware from executing.
Dual DMA controllers Two independent dual-port DMAs with FIFO - offloads CPU during simultaneous crypto processing, ADC sampling, and peripheral transfers without bus contention.
Low-power timer (LPTIM) Two 16-bit timers operational in Stop mode with sub-μA current draw - enables precise wake-up scheduling for sensor polling and event-driven tasks.

Applications

Industrial PLC Edge Node Secure Smart Meter

Use Scenario: Local logic execution, analog sensor acquisition, and encrypted telemetry upload in DIN-rail mounted controllers.

IC Role / Device Role / Timing Role: Main application MCU handling real-time I/O scanning, Modbus RTU over UART, and TLS-secured MQTT transmission via FDCAN-to-Ethernet bridge.

Use Value: Dual-bank flash enables seamless firmware updates without halting control loops; TrustZone isolates secure key storage from application firmware.

Use Scenario: Tamper-resistant energy meter with metrology-grade ADC sampling and remote firmware validation.

IC Role / Device Role / Timing Role: System-on-chip managing metrology ADC, pulse counting, secure time-stamping, and encrypted data logging to external NOR flash.

Use Value: Hardware RNG and PKA accelerate ECDSA signature verification; active tampers detect physical intrusion and erase keys automatically.

Medical Diagnostic Handheld Automotive Body Control Module (BCM)

Use Scenario: Portable ultrasound or ECG device requiring low-noise analog front-end and HIPAA-compliant data encryption.

IC Role / Device Role / Timing Role: Central controller acquiring 12-bit ADC data at 5 Msps, performing FFT preprocessing, and encrypting results before SD card storage.

Use Value: 80-Kbyte ECC SRAM2 ensures reliable buffer storage during power dips; VREFBUF stabilizes ADC reference under varying load conditions.

Use Scenario: In-vehicle lighting, window lift, and door lock control with functional safety awareness and cyber-resilience.

IC Role / Device Role / Timing Role: Safety-capable MCU running ASIL-B diagnostics, driving PWM outputs via advanced timers, and communicating via FDCAN and LIN.

Use Value: Two watchdogs (IWDG/WWDG) with independent clock sources meet ISO 26262 monitoring requirements; secure debug authentication prevents unauthorized reprogramming.

Equivalent & Alternatives

The following parts are listed as comparable options for similar secure MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
STM32H563VIT6 Same core, 1 Mbyte flash, 384 Kbytes SRAM, additional USB HS, Ethernet MAC - no LQFP100 option; only UFBGA144. Targets higher-bandwidth applications (e.g., video streaming gateways) requiring larger code space and wired connectivity. Select when >512 Kbytes flash or Ethernet is required; not drop-in due to package and pinout mismatch.
NXP i.MX RT685 Arm Cortex-M33, 1024 Kbytes on-chip RAM, no embedded flash, separate QSPI flash required - lacks integrated ECC flash and OTFDEC. Suitable for RAM-intensive DSP workloads but requires external secure storage and software-managed decryption. Choose for ultra-low-latency audio processing; avoid if flash-integrated security and minimal BOM count are critical.

Compared with STM32H533VEI6, the STM32H563VIT6 offers greater memory headroom but sacrifices LQFP100 availability and increases layout complexity, while the i.MX RT685 shifts security responsibility to external components and software layers - making the STM32H533VEI6 optimal for compact, self-contained, PSA-certified industrial endpoints.

Availability

STM32H533VEI6 is available at Aetrix Electronics and suitable for industrial PLC edge nodes, secure smart meters, medical handheld diagnostics, and automotive body control modules requiring stable component supply across extended product lifecycles.

Supply support for STM32H533VEI6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in microcontrollers, power management, sensors, and automotive ICs with strong focus on industrial and embedded security.

The STM32H5 series is designed for high-assurance embedded systems demanding PSA Level 3/SESIP3 certification, hardware-rooted trust, and real-time performance in harsh environments - targeting industrial automation, energy infrastructure, and medical devices.

FAQ

What is the maximum operating temperature for STM32H533VEI6 in LQFP100 package?

The STM32H533VEI6 in LQFP100 package is rated for junction temperature from –40 °C to +125 °C. Thermal performance depends on PCB copper area, airflow, and VDD/VDDA loading; ST recommends ≥ 4 cm² of 2-oz copper pour under the thermal pad for sustained 125 °C operation.

Does STM32H533VEI6 support secure boot from external Octo-SPI memory?

Yes - the on-the-fly decryption engine (OTFDEC) enables authenticated and decrypted code execution directly from external Octo-SPI NOR/PSRAM, using AES-128/256 keys stored in secure memory. Boot ROM verifies the initial image hash before enabling OTFDEC for subsequent fetches.

How many independent clock sources does STM32H533VEI6 integrate?

It integrates six internal oscillators (64 MHz HSI, 48 MHz HSI48, 4 MHz CSI, 32 kHz LSI, plus two programmable PLLs) and supports two external crystals (4–50 MHz HSE and 32.768 kHz LSE). All clock trees are TrustZone-aware with secure configuration registers.

Can the 12-bit ADCs operate simultaneously with full 5 Msps aggregate throughput?

No - each 12-bit ADC achieves up to 5 Msps individually, but simultaneous sampling on both ADCs reduces effective throughput per channel due to shared bus arbitration and conversion pipeline constraints. Maximum combined throughput is 7 Msps under interleaved mode with synchronized triggers.

STM32H533VEI6 Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Package/Case:
100-UFBGA
Series:
STM32H5
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
250MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, MMC/SD/SDIO, SMBus, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
80
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
272K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 16x10b SAR; D/A 2x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

STM32H533VEI6 FAQ

1.How can I place an order for STM32H533VEI6 through Aetrix?

Please submit a Request for Quotation (RFQ) for STM32H533VEI6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STM32H533VEI6 reliable?

The price and inventory of STM32H533VEI6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32H533VEI6 is usually 5 days.

3.What payment methods are accepted for STM32H533VEI6?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32H533VEI6 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STM32H533VEI6?

STM32H533VEI6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STM32H533VEI6 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STM32H533VEI6?

For technical support, including STM32H533VEI6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32H533VEI6 requirements.

6.How does Aetrix verify that STM32H533VEI6 is sourced from the original manufacturer or authorized distributors?

All STM32H533VEI6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32H533VEI6 meets industry standards.

7.What is the process for return or replacement of STM32H533VEI6?

All STM32H533VEI6 units undergo pre-shipment inspection (PSI). If there is an issue with STM32H533VEI6, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STM32H533VEI6 part is unused and in its original packaging.

Return procedure for STM32H533VEI6:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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