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STMicroelectronics STM32H562IGT6

Part No.:
STM32H562IGT6
Manufacturer:
STMicroelectronics
Category:
Microcontrollers
Package:
176-LQFP
Datasheet:
AetrixSTM32H562IGT6.pdf
Description:
IC MCU 32BIT 1MB FLASH 176LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,265

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Product details

Overview

STM32H562IGT6 from STMicroelectronics is a high-security, high-performance Arm® Cortex®-M33 32-bit microcontroller with TrustZone®, FPU, and 250 MHz operation delivering 375 DMIPS. It integrates 2-Mbyte ECC flash (dual-bank RWW), 640-Kbyte SRAM (with configurable ECC), CORDIC/FMAC math accelerators, dual FDCAN, USB Type-C®/PD controller, and 140 5 V-tolerant GPIOs. Used in secure industrial gateways requiring real-time control, encrypted firmware updates, and multi-interface connectivity.

For engineers reviewing the STM32H562IGT6 datasheet, STM32H562IGT6 pinout, STM32H562IGT6 application, or STM32H562IGT6 equivalent, key selection criteria include TrustZone-enabled peripheral isolation, dual-bank flash for seamless OTA updates, 250 MHz deterministic timing, 12-bit ADC at 5 Msps, and UFBGA176+25 package compatibility with high-density PCB layouts.

Technical Context

The STM32H562IGT6 implements Armv8-M security extensions via hardware-enforced TrustZone®, enabling strict separation of secure/non-secure code execution and peripheral access through up to eight SAU-configurable memory regions. Its dual GPDMA controllers offload CPU bandwidth for concurrent high-throughput transfers across FMC, Octo-SPI, and Ethernet MAC.

Core timing relies on a flexible RCC with multiple internal oscillators (64 MHz HSI, 48 MHz HSI48, 4 MHz CSI) and external support (4–50 MHz HSE, 32.768 kHz LSE), coupled with two PLLs for independent clock domains - one dedicated to the Cortex-M33 core and another for peripherals including USB, Ethernet, and audio interfaces.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core Arm Cortex-M33 with TrustZone®, FPU, MPU, 250 MHz max frequency → enables secure real-time deterministic execution with floating-point math and memory protection.
Flash Memory 2 Mbytes embedded flash with ECC and dual-bank read-while-write → supports zero-downtime firmware updates and robust data integrity in field-deployed systems.
SRAM 640 Kbytes total: 64-Kbyte SRAM2 (ECC), 320-Kbyte SRAM3 (flexible ECC), 4-Kbyte backup SRAM → provides scalable, fault-tolerant working memory with low-power retention capability.
Analog Peripherals Two 12-bit ADCs (5 Msps), one dual-channel 12-bit DAC, digital temperature sensor (NIST SP800-90B compliant) → enables high-fidelity sensor acquisition and closed-loop analog control without external ICs.
Security Accelerators ECDSA signature verification, HASH engine, PKA, True RNG, SFI support → delivers hardware-rooted trust for secure boot, firmware authentication, and cryptographic key generation.
Communication Interfaces Two FDCAN, four I²C (Fm+), twelve USART/LPUART, six SPI/I²S, two SAI, Octo-SPI, SDMMC, Ethernet MAC, USB FS + UCPD → supports full-stack industrial connectivity including CAN FD networks, audio streaming, and USB-C power negotiation.
Package & Pin Count UFBGA176+25 (10 × 10 mm, 201-ball layout) → provides high I/O density with thermal and electrical performance optimized for compact, fanless industrial modules.

Pinout & Package

STM32H562IGT6 uses the UFBGA176+25 package (10 × 10 mm, 201-ball layout), featuring 140 fast I/Os (most 5 V-tolerant), dedicated VCAP pins for SMPS stability, dual VDD/VSS power domains per bank, and ball-mapped TrustZone-aware debug (SWD/JTAG) and trace (ETM) interfaces.

Pin/Terminal Circuit Role Design Meaning
VDDA / VSSA Analog power supply / ground Independent 1.71–3.6 V domain for ADC/DAC/temperature sensor - decoupling critical for <1 LSB INL error at 5 Msps sampling.
VCAP_1 / VCAP_2 SMPS output filter capacitor terminals Connect external 2.2 µF X5R ceramic caps to stabilize internal SMPS regulator output; required for sub-1.2 V VCORE operation and dynamic voltage scaling.
NRST Active-low reset input Asynchronous reset with internal pull-up; accepts 1.65–5.5 V logic levels - compatible with both 3.3 V and 5 V system supervisors.
BOOT0 Boot mode selection High at power-up selects system memory bootloader; controlled by external resistor or MCU GPIO during production programming or recovery sequences.
PA13 / PA14 SWDIO / SWCLK Dedicated Serial Wire Debug interface - enables authenticated debug access only when life cycle is in development state; isolated by GTZC in secure mode.
PC10 / PC11 FDCAN1_RX / FDCAN1_TX Differential CAN FD transceiver interface supporting ISO 11898-1:2015 up to 5 Mbps - no external transceiver needed for node-level bus monitoring or gateway bridging.

Key Features

Feature Design Value
TrustZone® Peripheral Isolation GTZC enforces secure/non-secure access to all peripherals (GPIO, UART, FDCAN, etc.) - prevents unauthorized DMA or register access even under kernel-level compromise.
Math Acceleration Engine CORDIC computes sin/cos/tan/arctan in ≤12 cycles; FMAC executes 32-bit FIR/IIR filters at 250 MHz - eliminates software overhead in motor control and signal processing loops.
Secure Firmware Installation (SFI) Hardware-verified AES-256 decryption and SHA-256 signature check on OTA update payloads - ensures only cryptographically signed images execute in secure world.
Dual-Bank Flash with RWW Execute from Bank 1 while erasing/writing Bank 2 - enables background firmware upgrade without halting real-time control tasks or watchdog supervision.
Flexible Power Architecture Configurable SMPS or LDO supply with dynamic VCORE scaling (0.95–1.15 V); supports Stop2 mode with 1.3 µA RTC + 32 backup registers - extends battery life in edge nodes.

Applications

Industrial PLC Controller Secure IoT Gateway

Use Scenario: Programmable logic controller managing distributed I/O, motion control, and HMI communication in factory automation.

IC Role / Device Role / Timing Role: Real-time deterministic executor of ladder logic and motion profiles using 250 MHz Cortex-M33, with FDCAN and Ethernet MAC for fieldbus bridging.

Use Value: Dual-bank flash enables live firmware patching during runtime; TrustZone isolates safety-critical control code from non-secure HMI stack.

Use Scenario: Edge gateway aggregating BLE/Zigbee sensors, encrypting telemetry, and forwarding to cloud via TLS-secured Ethernet or cellular modem.

IC Role / Device Role / Timing Role: Secure root-of-trust host running TF-M, performing ECDSA key exchange, AES-GCM encryption, and secure boot validation before loading application firmware.

Use Value: Hardware RNG and PKA accelerate TLS handshake by >4× vs. software-only; UCPD interface manages USB-C PD negotiation for powered peripherals.

Medical Diagnostic Device Automotive Body Control Module

Use Scenario: Portable ultrasound or ECG device acquiring analog signals, applying real-time filtering, and rendering waveforms on local display.

IC Role / Device Role / Timing Role: High-speed ADC front-end controller with FMAC-accelerated digital filtering and SAI-driven audio feedback, synchronized via internal audio PLL.

Use Value: 5 Msps dual ADC captures high-fidelity bio-signals; CORDIC computes beamforming angles in <1 µs - critical for real-time imaging latency.

Use Scenario: Central body controller managing door locks, lighting, HVAC, and infotainment power sequencing in 12 V automotive systems.

IC Role / Device Role / Timing Role: Low-power domain manager using LPTIMs and Stop2 mode, interfacing with LIN transceivers and FDCAN for vehicle network integration.

Use Value: 1.3 µA Stop2 current with RTC active extends battery backup life beyond 10 years; 5 V-tolerant GPIOs interface directly with legacy automotive sensors.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-security MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
STM32H563IGT6 Same core, memory, and peripherals but adds HDMI-CEC and parallel camera interface (DCMI); identical UFBGA176+25 package. Required for consumer electronics remote control or vision-based HMI applications where CEC or DCMI are mandatory. Select STM32H563IGT6 only if HDMI-CEC or DCMI functionality is needed - otherwise STM32H562IGT6 offers lower cost and identical security/performance for industrial use cases.
NXP i.MX RT1189 Arm Cortex-M7 + M33 dual-core; higher 1 GHz M7 performance but lacks TrustZone-peripheral granularity and integrated UCPD. Suitable for asymmetric compute workloads (e.g., ML inference + real-time control), but requires external USB-C PD controller and separate secure element for comparable SFI. Choose i.MX RT1189 only when >1 GHz application processing is essential and external security co-processors are acceptable - STM32H562IGT6 provides tighter integration and lower BOM count for pure MCU-class designs.

Compared with STM32H563IGT6, the STM32H562IGT6 reduces cost and complexity by omitting HDMI-CEC/DCMI while retaining identical security architecture and real-time performance; versus i.MX RT1189, it delivers superior peripheral-level TrustZone enforcement and native USB-C PD control without external ICs.

Availability

STM32H562IGT6 is available at Aetrix Electronics and suitable for industrial PLCs, secure IoT gateways, medical diagnostic devices, and automotive body control modules requiring stable component supply, long-term lifecycle assurance, and full traceability.

Supply support for STM32H562IGT6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, specializing in microcontrollers, power management, sensors, and automotive ICs with over 40 years of industrial-grade reliability.

The STM32H5 series targets high-assurance embedded systems demanding hardware-enforced security, deterministic real-time response, and multi-protocol connectivity - designed specifically for industrial, medical, and automotive applications where functional safety and cyber-resilience are non-negotiable.

FAQ

What is the maximum operating frequency and DMIPS rating of the STM32H562IGT6?

The STM32H562IGT6 operates at up to 250 MHz and delivers 375 DMIPS (Dhrystone 2.1) with its Arm Cortex-M33 core. This performance is sustained across the full industrial temperature range (-40°C to +105°C) when powered by the internal SMPS regulator and using the ART Accelerator's 8-Kbyte instruction cache for zero-wait-state flash execution.

Does the STM32H562IGT6 support secure over-the-air (OTA) firmware updates?

Yes - it supports secure OTA updates via hardware-accelerated SFI (Secure Firmware Installation), which performs AES-256 decryption and SHA-256 signature verification on incoming firmware images. The dual-bank flash architecture allows background writing to Bank 2 while executing from Bank 1, ensuring uninterrupted real-time operation during updates.

What package type and ball count does the STM32H562IGT6 use?

The STM32H562IGT6 uses the UFBGA176+25 package: a 10 × 10 mm body with 201 solder balls (176 signal/power + 25 dedicated VSS/VDD). This package supports 140 fast I/Os (most 5 V-tolerant), dual VCAP inputs for SMPS stability, and optimized thermal dissipation for continuous 250 MHz operation in enclosed industrial enclosures.

How does TrustZone® implementation differ between STM32H562IGT6 and earlier STM32L5 or H7 series?

The STM32H562IGT6 implements Armv8-M mainline TrustZone with enhanced GTZC (Global TrustZone Controller) that enforces security at the peripheral level - not just memory. Unlike STM32L5 (which secures memory only), H5 applies configurable SAU regions to GPIOs, UARTs, FDCAN, and DMA channels, preventing non-secure code from accessing secure peripherals even via DMA transfers or interrupt handlers.

STM32H562IGT6 Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Package/Case:
176-LQFP
Series:
STM32H5
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
250MHz
Connectivity:
CANbus, FIFO, I2C, IrDA, LINbus, SCI, SDIO, SMBus, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, PDR, POR, PWM, SHA, TRNG, Voltage Detect, WDT
Number of I/O:
140
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
640K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 20x12b SAR; D/A 2x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

STM32H562IGT6 FAQ

1.How can I place an order for STM32H562IGT6 through Aetrix?

Please submit a Request for Quotation (RFQ) for STM32H562IGT6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STM32H562IGT6 reliable?

The price and inventory of STM32H562IGT6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32H562IGT6 is usually 5 days.

3.What payment methods are accepted for STM32H562IGT6?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32H562IGT6 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STM32H562IGT6?

STM32H562IGT6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STM32H562IGT6 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STM32H562IGT6?

For technical support, including STM32H562IGT6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32H562IGT6 requirements.

6.How does Aetrix verify that STM32H562IGT6 is sourced from the original manufacturer or authorized distributors?

All STM32H562IGT6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32H562IGT6 meets industry standards.

7.What is the process for return or replacement of STM32H562IGT6?

All STM32H562IGT6 units undergo pre-shipment inspection (PSI). If there is an issue with STM32H562IGT6, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STM32H562IGT6 part is unused and in its original packaging.

Return procedure for STM32H562IGT6:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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