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STMicroelectronics STM32H562RGV6
- Part No.:
- STM32H562RGV6
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- 68-VFQFN Exposed Pad
- Datasheet:
-
STM32H562RGV6.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 68VFQFPN
- Quantity:
- Payment:
- Shipping:
Inventory:3,218
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Product details
Overview
STM32H562RGV6 from STMicroelectronics is a high-security, high-performance Arm® Cortex®-M33 microcontroller with TrustZone®, 250 MHz clock, 2-Mbyte ECC flash, 640-Kbyte SRAM, CORDIC/FMAC math accelerators, and dual FDCAN/USB Type-C® support - deployed in industrial gateways requiring secure firmware updates and real-time sensor fusion.
For engineers reviewing the STM32H562RGV6 datasheet, STM32H562RGV6 pinout, STM32H562RGV6 application, or STM32H562RGV6 equivalent, key selection criteria include TrustZone-enforced peripheral isolation, 250 MHz deterministic execution with ART cache, dual DMA controllers for offloading, and UFBGA100 (7 × 7 mm) package compatibility with high-density PCB layouts.
Technical Context
The device implements Armv8-M mainline security with configurable SAU regions and TrustZone-aware peripherals including GTZC-managed memory, flash, and SRAM partitions. Its dual-bank flash supports read-while-write with ECC, while SRAM3 offers flexible ECC configuration for safety-critical data buffers.
Math acceleration is hardware-accelerated via dedicated CORDIC (trigonometric functions) and FMAC (filtering), enabling real-time motor control and audio preprocessing without CPU load. The dual GPDMA controllers feature FIFOs and support concurrent transfers across multiple peripherals including Octo-SPI, SDMMC, and ADCs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M33 with TrustZone, FPU, MPU - enables secure, isolated execution of trusted and non-trusted firmware domains |
| Max Clock Speed | 250 MHz - delivers 375 DMIPS and 1023 CoreMark® for deterministic real-time control loops |
| Flash Memory | 2 Mbytes with ECC and two banks - supports seamless firmware upgrades via read-while-write operation |
| SRAM | 640 Kbytes total (64-Kbyte SRAM2 + 320-Kbyte SRAM3 + 4-Kbyte backup) - includes configurable ECC for ASIL-B functional safety compliance |
| Math Accelerators | CORDIC + FMAC - reduces CPU cycles for motor control algorithms and digital filter computation by >90% |
| Security Features | TrustZone, SFI, HASH, ECDSA, TRNG (NIST SP800-90B), active tampers - meets PSA Certified Level 3 and IEC 62443-3-3 requirements |
| Package | UFBGA100 (7 × 7 mm, 0.5 mm pitch) - compact footprint suitable for space-constrained industrial edge nodes |
Pinout & Package
STM32H562RGV6 is housed in a 100-ball Ultra Fine Pitch Ball Grid Array (UFBGA100) package with 0.5 mm ball pitch and 7 mm × 7 mm body size. This package supports high I/O density (up to 82 user GPIOs) and thermal performance suitable for extended industrial temperature operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDIO2 | Power supply inputs | Separate analog/digital/IO domains enable noise isolation and flexible power sequencing |
| VSS, VSSA, VSSIO2 | Ground returns | Dedicated ground planes per domain reduce coupling and improve ADC/DAC SNR |
| NRST | Active-low reset input | Asynchronous reset with internal pull-up; compatible with external supervisor ICs |
| BOOT0 | Boot mode selection | Configures system memory or embedded flash boot source at power-on |
| PA0–PA15, PB0–PB15, etc. | General-purpose I/Os | Up to 140 fast I/Os (most 5 V-tolerant); many support independent 1.08 V supply for low-voltage interfaces |
| PC13–PC15 | RTC/LSE pins | Support 32.768 kHz crystal or oscillator for calendar timekeeping and low-power wake-up |
| PF0–PF15 | Octo-SPI interface | Enables direct XIP execution from serial PSRAM/NOR/Flash with up to 8-line parallel transfer |
Key Features
| Feature | Design Value |
|---|---|
| ART Accelerator | 8-Kbyte instruction cache + 4-Kbyte data cache - eliminates wait states for flash execution and enables zero-latency access to external memories |
| Secure Firmware Installation | SFI with TF-M integration - ensures authenticated, encrypted firmware loading during field updates |
| Flexible Memory Controller | Supports SRAM, PSRAM, SDRAM, FRAM, NOR/NAND - enables scalable external memory architecture for HMI or data logging |
| Low-Power Timers | Six LPTIMs available in Stop mode - maintains precise timing for sensor polling or RTC alarm without waking CPU |
| Communication Peripherals | 12x USART, 4x I2C, 2x FDCAN, 2x SAI, USB Type-C®/PD - supports multi-protocol industrial connectivity (CAN FD, RS-485, audio, USB-C PD negotiation) |
Applications
| Industrial Gateway | Secure Edge Node |
|---|---|
Use Scenario: Aggregating Modbus RTU, CAN FD, and Ethernet data from PLCs and sensors into cloud-connected MQTT brokers. IC Role / Device Role / Timing Role: Central application processor managing protocol translation, TLS 1.3 encryption, and secure OTA updates via SFI. Use Value: TrustZone isolates network stack and crypto operations from application logic, preventing lateral movement during cyber intrusion. | Use Scenario: Battery-powered wireless sensor node performing vibration analysis using onboard ADC and CORDIC-based FFT preprocessing. IC Role / Device Role / Timing Role: Real-time signal processor executing low-latency FFT and anomaly detection before transmitting compressed results over LPUART. Use Value: FMAC and CORDIC offload eliminate need for external DSP, reducing BOM cost and power consumption by 42% vs. Cortex-M4F solution. |
| Smart Energy Meter | HMI Controller |
Use Scenario: DIN-rail mounted meter with tamper detection, secure billing data storage, and DLMS/COSEM communication stack. IC Role / Device Role / Timing Role: Secure metering controller with active tampers, TRNG, and hardware HASH for firmware signature verification. Use Value: 96-bit unique ID and ECDSA accelerator enable cryptographic binding of hardware identity to utility billing keys. | Use Scenario: Touch-enabled HMI panel driving 800×480 RGB LCD via parallel interface while running Qt Quick UI framework. IC Role / Device Role / Timing Role: Graphics-capable MCU with PSSI interface and 320-Kbyte SRAM3 for frame buffer management. Use Value: Dual-bank flash allows seamless UI firmware update without display flicker or interruption of touch response. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-security MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32H563RGV6 | Adds Ethernet MAC with DMA and HDMI-CEC interface; identical core, memory, and security features | Required for wired industrial networking or consumer electronics remote control integration | Select when Ethernet or CEC functionality is mandatory; otherwise identical migration path |
| NXP i.MX RT1187CVM8B | Arm Cortex-M7 + M33 dual-core; no TrustZone on M7; larger package (196-pin BGA); higher power draw | Better suited for asymmetric multiprocessing (e.g., Linux on M7, RTOS on M33), but lacks unified TrustZone enforcement | Choose only if dual-core heterogeneity outweighs STM32H562's tighter security model and lower power envelope |
Compared with STM32H562RGV6, the STM32H563RGV6 adds Ethernet and CEC with zero trade-off in security or math acceleration, while the i.MX RT1187 requires careful partitioning of trust boundaries across cores and increases thermal design complexity.
Availability
STM32H562RGV6 is available at Aetrix Electronics and suitable for industrial gateways, secure edge nodes, smart energy meters, and HMI controllers requiring stable component supply across long-lifecycle deployments.
Supply support for STM32H562RGV6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in microcontrollers, power management, and automotive-grade ICs with strong focus on industrial and IoT markets.
The STM32H5 series targets high-assurance embedded systems demanding PSA Certified Level 3 security, functional safety (IEC 61508 SIL2), and deterministic real-time performance - especially where firmware integrity and side-channel resistance are critical.
FAQ
What is the maximum operating temperature range for STM32H562RGV6?
The STM32H562RGV6 is rated for industrial temperature operation from –40 °C to +105 °C ambient, validated per JEDEC JESD22-A108. This range applies to all UFBGA100 variants and supports deployment in enclosed enclosures without forced air cooling.
Does STM32H562RGV6 support hardware-based AES encryption?
No - STM32H562RGV6 does not include a dedicated AES engine. Security acceleration is provided via HASH (SHA-256), PKA (ECDSA), and TRNG; AES must be implemented in software or via third-party IP blocks leveraging TrustZone-protected memory regions.
Can the CORDIC accelerator perform inverse trigonometric functions?
Yes - the CORDIC coprocessor supports both forward (sin/cos/tan) and inverse (asin/acos/atan) trigonometric functions, as well as hyperbolic and logarithmic operations, with single-cycle latency for fixed-point Q1.31 inputs per ST's RM0481 reference manual.
Is the UFBGA100 package RoHS and REACH compliant?
Yes - STM32H562RGV6 in UFBGA100 packaging meets RoHS Directive 2011/65/EU and REACH Regulation (EC) No. 1907/2006, and carries ECOPACK2 certification confirming lead-free terminations and halogen-free molding compounds.
STM32H562RGV6 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 68-VFQFN Exposed Pad
- Series:
- STM32H5
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit
- Speed:
- 250MHz
- Connectivity:
- CANbus, FIFO, I2C, IrDA, LINbus, SCI, SDIO, SMBus, SPI, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, PDR, POR, PWM, SHA, TRNG, Voltage Detect, WDT
- Number of I/O:
- 53
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 640K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 16x12b SAR; D/A 2x12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
STM32H562RGV6 FAQ
1.How can I place an order for STM32H562RGV6 through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32H562RGV6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32H562RGV6 reliable?
The price and inventory of STM32H562RGV6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32H562RGV6 is usually 5 days.
3.What payment methods are accepted for STM32H562RGV6?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32H562RGV6 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STM32H562RGV6?
STM32H562RGV6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32H562RGV6 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32H562RGV6?
For technical support, including STM32H562RGV6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32H562RGV6 requirements.
6.How does Aetrix verify that STM32H562RGV6 is sourced from the original manufacturer or authorized distributors?
All STM32H562RGV6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32H562RGV6 meets industry standards.
7.What is the process for return or replacement of STM32H562RGV6?
All STM32H562RGV6 units undergo pre-shipment inspection (PSI). If there is an issue with STM32H562RGV6, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32H562RGV6 part is unused and in its original packaging.
Return procedure for STM32H562RGV6:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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