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STMicroelectronics STM32H563IIK6

Part No.:
STM32H563IIK6
Manufacturer:
STMicroelectronics
Category:
Microcontrollers
Package:
201-UFBGA
Datasheet:
AetrixSTM32H563IIK6.pdf
Description:
IC MCU 32BIT 1MB FLASH 176UFBGA
Quantity:
Payment:
Payment
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Inventory:754

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Product details

Overview

STM32H563IIK6 from STMicroelectronics is a high-security, high-performance Arm® Cortex®-M33 32-bit microcontroller with TrustZone®, FPU, and math accelerators (CORDIC, FMAC), operating at up to 250 MHz (375 DMIPS), featuring 2 Mbyte flash with ECC, 640 Kbyte SRAM (including ECC-protected SRAM2/SRAM3), and dual DMA controllers. It targets secure industrial control, IoT edge nodes, and automotive body electronics requiring real-time processing, cryptographic integrity, and low-power operation.

For engineers reviewing the STM32H563IIK6 datasheet, STM32H563IIK6 pinout, STM32H563IIK6 application, or STM32H563IIK6 equivalent, key selection considerations include TrustZone-enforced peripheral isolation, 250 MHz deterministic execution with ART cache, dual 12-bit ADCs (5 Msps), FDCAN/USB Type-C®/Ethernet MAC interfaces, and UFBGA176+25 (10 × 10 mm) package compatibility with high I/O density and 5 V-tolerant GPIOs.

Technical Context

The STM32H563IIK6 implements Armv8-M mainline security with configurable SAU regions, enabling hardware-enforced separation of secure/non-secure firmware execution. Its dual-bank flash supports read-while-write with ECC, while SRAM3 offers flexible ECC configuration for critical data buffers.

It integrates two math accelerators: CORDIC for real-time trigonometric computation and FMAC for FIR/IIR filter acceleration-both accessible via dedicated instruction sets without CPU intervention. The dual GPDMA controllers support concurrent memory-to-peripheral transfers across 34 communication interfaces, including two FDCANs, six SPIs, and Octo-SPI for serial PSRAM/NOR.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core Arm Cortex-M33 with TrustZone®, FPU, MPU, 250 MHz max frequency (375 DMIPS @ Dhrystone 2.1)
Memory 2 Mbyte flash (ECC, dual-bank RWW), 640 Kbyte SRAM (64 Kbyte SRAM2 + 320 Kbyte SRAM3 + 4 Kbyte backup SRAM)
Analog Peripherals Two 12-bit ADCs (5 Msps total), one dual-channel 12-bit DAC, digital temperature sensor (NIST SP800-90B compliant)
Security Features TrustZone-aware peripherals, SFI, HASH/ECDSA/PKA accelerators, 96-bit unique ID, active tampers, secure debug authentication
Communication Two FDCAN, four I²C (Fm+), twelve USART/LPUART, six SPI/I²S, two SAI, Octo-SPI, SDMMC, USB 2.0 FS, USB Type-C®/PD r3.1, Ethernet MAC
Power & Timing 1.71–3.6 V supply, SMPS/LDO regulator, Sleep/Stop/Standby modes, 64 MHz HSI/48 MHz HSI48/4 MHz CSI internal oscillators
Package & I/O UFBGA176+25 (10 × 10 mm, 176 balls + 25 ground balls), up to 140 fast 5 V-tolerant GPIOs with interrupt capability

Pinout & Package

STM32H563IIK6 is housed in a UFBGA176+25 package (10 × 10 mm, 0.65 mm pitch), optimized for high-density PCB layouts with dedicated ground ball array for EMI suppression and signal integrity. The package supports 140 user I/Os, including 10 low-voltage I/Os (1.08 V min supply) and multiple power/ground pins distributed for stable core and analog domain decoupling.

Pin/Terminal Circuit Role Design Meaning
VDD/VSS (multiple) Core & I/O power/ground Dedicated VDD/VSS pairs per quadrant minimize IR drop; VDDA/VSSA isolated for ADC/DAC reference stability
VCAP1/VCAP2 Core voltage decoupling Connect 2.2 µF ceramic capacitors close to pins to stabilize SMPS/LDO output for 1.1 V VCORE rail
NRST Active-low reset input Asynchronous reset with internal pull-up; accepts external push-pull or open-drain assertion; monitored by independent watchdog
BOOT0 Boot mode selection High at power-up enables system memory boot; used with TrustZone configuration (TZEN = 0xB4) for secure bootloader entry
PA0–PA15, PB0–PB15, etc. General-purpose I/O Most pins support 5 V tolerance, multiple alternate functions (e.g., TIMx_CHy, USARTx_TX/RX, SPIx_SCK/MISO/MOSI), configurable pull-up/down
PC13–PC15 RTC & LSE interface PC13: RTC_OUT; PC14/PC15: 32.768 kHz LSE crystal connections with built-in load capacitance (12.5 pF)

Key Features

Feature Design Value
TrustZone-enabled peripheral isolation Eight configurable SAU regions enforce hardware-level access control between secure/non-secure firmware domains
Math acceleration engine CORDIC computes sin/cos/tan/arctan in ≤12 cycles; FMAC executes 32-bit MAC operations at 250 MHz for real-time filtering
Secure firmware installation (SFI) Hardware-verified signature validation using ECDSA-P256 ensures only authenticated firmware updates execute
Dual-bank flash with RWW Execute from Bank 1 while erasing/writing Bank 2-enables zero-downtime field upgrades in safety-critical applications
Flexible memory controller (FMC) Supports parallel NOR/NAND, PSRAM, SDRAM/LPSDR, FRAM with 16-bit data bus and configurable timing registers

Applications

Industrial PLC Controller Secure Edge Gateway

Use Scenario: Real-time motion control in servo drives with multi-axis coordination and safety monitoring.

IC Role / Device Role / Timing Role: Primary MCU executing deterministic control loops (via 250 MHz Cortex-M33 + FMAC), managing FDCAN fieldbus, and enforcing SIL-2 functional safety via TrustZone-isolated diagnostics.

Use Value: Dual 12-bit ADCs sample current/voltage at 5 Msps for closed-loop feedback; SRAM3 ECC prevents bit-flip-induced control faults.

Use Scenario: Aggregating sensor data from BLE/Zigbee subnets and forwarding via Ethernet/USB-C to cloud infrastructure.

IC Role / Device Role / Timing Role: Secure host processor running TF-M-based PSA Certified firmware, handling TLS 1.3 offload via HASH/PKA, and managing concurrent USB PD negotiation + Ethernet MAC.

Use Value: Octo-SPI interfaces external PSRAM for packet buffering; UFBGA176+25 enables compact dual-layer PCB with RF shielding integration.

Automotive Body Control Module Medical Diagnostic Handheld

Use Scenario: Centralized lighting, window lift, and door lock control with CAN FD communication and anti-theft encryption.

IC Role / Device Role / Timing Role: Safety-relevant MCU managing LIN/UART peripherals, driving LED drivers via PWM timers, and performing secure key exchange via ECDSA.

Use Value: 10 low-voltage I/Os interface 1.8 V sensors; 32 backup registers retain fault logs during battery disconnect (VBAT powered).

Use Scenario: Portable ultrasound or ECG device requiring low-noise analog acquisition and on-device FFT preprocessing.

IC Role / Device Role / Timing Role: High-precision signal processor using dual ADCs with synchronous sampling, CORDIC for real-time phase calculation, and DAC for reference waveform generation.

Use Value: Digital temperature sensor monitors thermal drift of analog front-end; 640 Kbyte SRAM stores raw waveform buffers for offline analysis.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-security MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
STM32H753IIK6 Same UFBGA176+25 package, Cortex-M7 (480 MHz), no TrustZone, single 12-bit ADC (3.6 Msps), no CORDIC/FMAC Lacks hardware security enforcement; suitable for non-certified real-time apps where raw speed > security Select when cryptographic acceleration and PSA compliance are unnecessary but higher clock rate is critical.
NXP i.MX RT1176AVM8B Arm Cortex-M7 + M4 dual-core, 1 GHz M7, 450 MHz M4, 2 Mbyte flash, no TrustZone (uses SECO secure enclave) Different security architecture (SECO vs TrustZone); requires separate secure boot ROM; larger footprint (289 BGA) Prefer for Linux-capable edge AI inference where M7 handles OS and M4 manages real-time I/O.

Compared with STM32H563IIK6, the STM32H753IIK6 trades TrustZone and math accelerators for higher clock speed and simpler security model, while the i.MX RT1176AVM8B offers asymmetric dual-core performance at the cost of increased complexity and package size-neither matches the integrated TrustZone+FPU+CORDIC+FMAC combination in a 10 × 10 mm UFBGA.

Availability

STM32H563IIK6 is available at Aetrix Electronics and suitable for industrial automation, secure IoT gateways, and automotive body electronics requiring stable component supply, long-term lifecycle assurance, and full traceability through ST's qualified manufacturing lines.

Supply support for STM32H563IIK6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in microcontrollers, power management, sensors, and automotive ICs with over 40 years of industrial-grade reliability.

The STM32H5 series is designed for applications demanding certified security (PSA Level 3), real-time determinism, and energy efficiency-targeting industrial control, smart infrastructure, and automotive subsystems where functional safety and firmware integrity are mandatory.

FAQ

What is the maximum operating frequency and associated DMIPS rating?

The STM32H563IIK6 operates at up to 250 MHz with an Arm Cortex-M33 core, achieving 375 DMIPS (Dhrystone 2.1) and 1023 CoreMark® (4.092 CoreMark®/MHz). This performance is sustained with zero-wait-state execution enabled by the 8-Kbyte instruction cache (ART Accelerator) and verified across industrial temperature ranges (-40°C to +105°C).

Does STM32H563IIK6 support secure firmware updates out-of-the-box?

Yes-it includes hardware-accelerated Secure Firmware Installation (SFI) with ECDSA-P256 signature verification, True Random Number Generator (NIST SP800-90B compliant), and immutable secure boot ROM. Updates must be signed with the manufacturer's private key or a customer-provisioned key stored in OTP memory.

Which package variant does STM32H563IIK6 use, and what are its board-level advantages?

STM32H563IIK6 uses the UFBGA176+25 package (10 × 10 mm, 0.65 mm pitch), featuring 176 signal balls plus 25 dedicated ground balls arranged in a perimeter-and-center grid. This layout reduces ground bounce, improves EMI immunity, and allows high-density routing with minimal vias-critical for mixed-signal designs with Ethernet and USB-C interfaces.

How does the dual-bank flash architecture enable robust field updates?

The 2 Mbyte flash is split into two independently erasable banks, supporting Read-While-Write (RWW) operation. While executing code from Bank 1, Bank 2 can be erased and reprogrammed-enabling seamless firmware updates without system interruption. Each bank supports ECC correction and write protection via option bytes, preventing corruption during power loss.

STM32H563IIK6 Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Package/Case:
201-UFBGA
Series:
STM32H5
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
250MHz
Connectivity:
CANbus, Ethernet, FIFO, I2C, IrDA, LINbus, SCI, SDIO, SMBus, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, PDR, POR, PWM, SHA, TRNG, Voltage Detect, WDT
Number of I/O:
140
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
640K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 20x12b SAR; D/A 2x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

STM32H563IIK6 FAQ

1.How can I place an order for STM32H563IIK6 through Aetrix?

Please submit a Request for Quotation (RFQ) for STM32H563IIK6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STM32H563IIK6 reliable?

The price and inventory of STM32H563IIK6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32H563IIK6 is usually 5 days.

3.What payment methods are accepted for STM32H563IIK6?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32H563IIK6 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STM32H563IIK6?

STM32H563IIK6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STM32H563IIK6 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STM32H563IIK6?

For technical support, including STM32H563IIK6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32H563IIK6 requirements.

6.How does Aetrix verify that STM32H563IIK6 is sourced from the original manufacturer or authorized distributors?

All STM32H563IIK6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32H563IIK6 meets industry standards.

7.What is the process for return or replacement of STM32H563IIK6?

All STM32H563IIK6 units undergo pre-shipment inspection (PSI). If there is an issue with STM32H563IIK6, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STM32H563IIK6 part is unused and in its original packaging.

Return procedure for STM32H563IIK6:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

STM32H563IIK6 Tags

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