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STMicroelectronics STM32H563IIT3Q

Part No.:
STM32H563IIT3Q
Manufacturer:
STMicroelectronics
Category:
Microcontrollers
Package:
176-LQFP
Datasheet:
AetrixSTM32H563IIT3Q.pdf
Description:
IC MCU 32BIT 1MB FLASH 100LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,343

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Product details

Overview

STM32H563IIT3Q from STMicroelectronics is a high-security, high-performance Arm® Cortex®-M33 32-bit microcontroller with TrustZone®, FPU, and 250 MHz operation delivering 375 DMIPS. It integrates 2 Mbyte flash with ECC, 640 Kbyte SRAM (including ECC-protected SRAM2/SRAM3), CORDIC/FMAC math accelerators, dual FDCAN, USB Type-C®/PD controller, and Ethernet MAC - deployed in secure industrial gateways requiring real-time control, encrypted firmware updates, and multi-protocol connectivity.

For engineers reviewing the STM32H563IIT3Q datasheet, STM32H563IIT3Q pinout, STM32H563IIT3Q application, or STM32H563IIT3Q equivalent, key selection criteria include TrustZone-enforced peripheral isolation, dual-bank flash for seamless OTA updates, 24 timers with six low-power variants, 34 communication interfaces (including I3C, Octo-SPI, and HDMI-CEC), and SMPS/LDO power architecture supporting 1.71–3.6 V operation.

Technical Context

The STM32H563IIT3Q implements Armv8-M mainline security with configurable SAU regions, enabling hardware-enforced separation of secure/non-secure firmware execution. Its dual-bank flash supports read-while-write and high-cycling data storage (100K cycles), while the ART Accelerator includes 8-Kbyte instruction cache and 4-Kbyte data cache for deterministic zero-wait-state execution from flash and external memories.

It features two independent DMA controllers with FIFOs, dual FDCAN interfaces compliant with ISO 11898-1:2015, and a dedicated UCPD controller for USB Power Delivery r3.1 negotiation. The analog subsystem integrates two 12-bit ADCs (5 Msps), one dual-channel 12-bit DAC, and NIST SP800-90B-compliant TRNG - all accessible under TrustZone-aware peripheral routing.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core Arm Cortex-M33 with TrustZone, FPU, MPU, up to 250 MHz - enables secure real-time task scheduling and cryptographic acceleration in isolated execution environments.
Flash Memory 2 Mbyte embedded flash with ECC and dual-bank architecture - supports concurrent code execution and firmware update without system interruption.
SRAM 640 Kbyte total: 64 Kbyte SRAM2 (ECC), 320 Kbyte SRAM3 (flexible ECC), 4 Kbyte backup SRAM - ensures data integrity and retention during ultra-low-power Stop/Standby modes.
Math Accelerators CORDIC for trigonometric computation and FMAC for digital filter operations - offloads CPU for motor control, sensor fusion, and audio processing.
Security Features TrustZone + GTZC, 8 SAU regions, SFI, HASH, PKA, ECDSA verification, active tampers, 96-bit UID - meets PSA Certified Level 3 and IEC 62443-3-3 requirements.
Communication Interfaces 2× FDCAN, 12× U(S)ART, 4× I²C, 1× I3C, 6× SPI, 2× SAI, 2× SDMMC, 1× Ethernet MAC, 1× USB FS, 1× UCPD - enables industrial edge node connectivity with protocol redundancy and time-sensitive networking support.
Power Management 1.71–3.6 V supply, embedded LDO or external SMPS, POR/PDR/PVD/BOR, VBAT RTC support - sustains operation across wide industrial temperature ranges with dynamic voltage scaling.

Pinout & Package

STM32H563IIT3Q uses a 176-pin UFBGA package (10 mm × 10 mm, 0.65 mm pitch) with 25 additional balls for enhanced thermal and signal integrity. Pin functions are validated per STMicroelectronics DS14258 Rev 6, Section 4.2 (Pin description) and Table 14 (pin/ball definition).

Pin/Terminal Circuit Role Design Meaning
VDD, VDDA, VDDIO2 Core, analog, and I/O power supplies Independent 1.71–3.6 V domains enable mixed-signal precision and 5 V-tolerant I/O operation with configurable voltage scaling.
VSS, VSSA, VSSIO2 Ground reference planes Dedicated analog/digital/I/O ground nets minimize noise coupling in high-resolution ADC/DAC and RF-adjacent applications.
NRST Active-low reset input Asynchronous reset with internal pull-up; compatible with external supervisory circuits for fail-safe boot initialization.
BOOT0 Boot mode selection Configures primary boot source (system memory, flash, or SRAM) at power-on; supports TrustZone-enabled secure boot flow.
PA0–PA15, PB0–PB15, etc. General-purpose I/Os Up to 140 fast GPIOs with interrupt capability; most 5 V-tolerant and support 10+ alternate functions including FDCAN, Octo-SPI, and UCPD.
PC13–PC15 RTC oscillator inputs Connects to 32.768 kHz LSE crystal for calendar/timekeeping with tamper detection and VBAT-backed operation.

Key Features

Feature Design Value
Secure Boot & Firmware Updates Hardware-enforced SFI and TF-M integration enable cryptographically signed, authenticated firmware installation and over-the-air updates with rollback protection.
Memory Protection Architecture MPU + TrustZone + GTZC provide three-layer isolation: privileged/unprivileged, secure/non-secure, and peripheral access control - critical for certified industrial safety stacks.
Low-Power Timer Suite Six independent low-power 16-bit timers retain functionality in Stop mode - ideal for periodic sensor sampling, RTC wake-up, and battery-backed event sequencing.
External Memory Flexibility FMC supports SRAM, PSRAM, SDRAM/LPSDR, FRAM, NOR/NAND; Octo-SPI handles hyperRAM/flash frame formats - extends code/data space beyond on-chip limits without performance penalty.
Analog Subsystem Precision Dual 12-bit ADCs achieve 5 Msps with hardware oversampling; integrated DTS and VREFINT enable self-calibration and temperature-compensated measurements.

Applications

Industrial Gateway Secure Edge Node

Use Scenario: Aggregating Modbus, CANopen, and MQTT traffic from field devices into cloud-connected infrastructure.

IC Role / Device Role / Timing Role: Central application processor managing protocol translation, TLS encryption, and time-synchronized data logging via Ethernet MAC and dual FDCAN.

Use Value: Dual-bank flash enables atomic firmware updates without service interruption; TrustZone isolates secure key storage from application logic.

Use Scenario: Battery-powered condition monitoring sensor with vibration, temperature, and acoustic analysis.

IC Role / Device Role / Timing Role: Real-time signal processor using CORDIC/FMAC for FFT-based spectral analysis and low-power timer-triggered wake-up from Stop mode.

Use Value: 640 Kbyte SRAM retains full inference model state during sleep; 4 Kbyte backup SRAM preserves RTC and calibration data on VBAT.

USB-C PD Controller HMI Controller

Use Scenario: Smart dock supporting simultaneous USB 2.0 host/device, DisplayPort Alt Mode, and 100 W power delivery negotiation.

IC Role / Device Role / Timing Role: Dedicated UCPD controller manages PD messaging, VCONN switching, and fault protection while offloading main CPU.

Use Value: Hardware-accelerated PD stack reduces BOM cost vs. discrete PD IC; integrated USB FS PHY eliminates external transceiver.

Use Scenario: Human-machine interface with capacitive touch, LCD display, and audio feedback in medical diagnostic equipment.

IC Role / Device Role / Timing Role: Graphics and audio co-processor driving parallel LCD interface and dual SAI channels for stereo playback and microphone array input.

Use Value: 24-bit parallel slave synchronous interface (PSSI) achieves >20 MHz pixel clock; dual SAI supports TDM/I²S with independent clocks for jitter-free audio.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-security MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
STM32H753IIK Lacks TrustZone, no UCPD or FDCAN; 1 Mbyte flash, 1 Mbyte RAM; Cortex-M7 @ 480 MHz Suitable for non-certified high-throughput compute tasks but cannot meet PSA Level 3 or IEC 62443-3-3 security mandates Select when raw DSP performance outweighs hardware-enforced security and USB-C PD integration.
NXP i.MX RT1176 Cortex-M7 + M4 dual-core; no TrustZone on M7; 2 Mbyte flash, 1 Mbyte RAM; lacks Octo-SPI and CORDIC Targets multimedia-rich HMI with GPU offload, but requires external secure element for comparable crypto assurance Prefer for Linux-capable edge AI inference where dual-core asymmetry and external DDR support are prioritized over on-chip security peripherals.

Compared with STM32H563IIT3Q, the STM32H753IIK trades hardware security for higher clock speed and larger RAM, while the i.MX RT1176 adds dual-core flexibility at the cost of integrated TrustZone and math accelerators - making the H563 optimal for certified secure industrial control with minimal external components.

Availability

STM32H563IIT3Q is available at Aetrix Electronics and suitable for industrial gateways, secure edge nodes, USB-C PD controllers, and HMI controllers requiring stable component supply, long-term lifecycle commitment, and traceable sourcing for safety-critical deployments.

Supply support for STM32H563IIT3Q includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in microcontrollers, power management, sensors, and automotive ICs with over 40 years of industrial-grade reliability.

The STM32H5 series targets next-generation secure IoT and industrial edge applications, combining Arm TrustZone with ST's proprietary security IP, math accelerators, and flexible power architectures to simplify certification and reduce system-level BOM count.

FAQ

What is the maximum operating frequency and corresponding DMIPS rating of the STM32H563IIT3Q?

The STM32H563IIT3Q operates at up to 250 MHz and delivers 375 DMIPS (Dhrystone 2.1). This performance is sustained with zero wait states thanks to the 8-Kbyte instruction cache (ART Accelerator), even when executing from embedded flash or external memory via FMC or Octo-SPI interfaces.

Does the STM32H563IIT3Q support secure firmware installation (SFI) and how is it implemented?

Yes, SFI is natively supported through hardware-accelerated signature verification using the PKA and HASH modules. It validates ECDSA-signed firmware images before loading into secure flash, enforces immutable root-of-trust, and integrates with TF-M for PSA Certified Level 3 compliance - all without external secure elements.

How many low-power timers remain active in Stop mode, and what are their key capabilities?

Six independent 16-bit low-power timers (LPTIM1–LPTIM6) retain full functionality in Stop mode. Each supports encoder input, pulse counting, and programmable clock sources (ULPCLK, LSE, or HSI16 divided), enabling precise wake-up timing, sensor sampling intervals, and RTC synchronization without CPU intervention.

What external memory types does the Flexible Memory Controller (FMC) support, and what is the maximum bus width?

The FMC supports SRAM, PSRAM, SDRAM/LPSDR, FRAM, and NOR/NAND memories with a maximum 16-bit data bus and configurable address/data multiplexing. It provides dedicated control signals for each memory type, including RAS/CAS for SDRAM and CE/RB for NAND, enabling direct attachment of up to 1 Gbyte of external storage.

STM32H563IIT3Q Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Package/Case:
176-LQFP
Series:
STM32H5
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
250MHz
Connectivity:
CANbus, Ethernet, FIFO, I2C, IrDA, LINbus, SCI, SDIO, SMBus, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, PDR, POR, PWM, SHA, TRNG, Voltage Detect, WDT
Number of I/O:
139
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
640K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 20x12b SAR; D/A 2x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

STM32H563IIT3Q FAQ

1.How can I place an order for STM32H563IIT3Q through Aetrix?

Please submit a Request for Quotation (RFQ) for STM32H563IIT3Q on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STM32H563IIT3Q reliable?

The price and inventory of STM32H563IIT3Q are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32H563IIT3Q is usually 5 days.

3.What payment methods are accepted for STM32H563IIT3Q?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32H563IIT3Q transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STM32H563IIT3Q?

STM32H563IIT3Q orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STM32H563IIT3Q order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STM32H563IIT3Q?

For technical support, including STM32H563IIT3Q datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32H563IIT3Q requirements.

6.How does Aetrix verify that STM32H563IIT3Q is sourced from the original manufacturer or authorized distributors?

All STM32H563IIT3Q products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32H563IIT3Q meets industry standards.

7.What is the process for return or replacement of STM32H563IIT3Q?

All STM32H563IIT3Q units undergo pre-shipment inspection (PSI). If there is an issue with STM32H563IIT3Q, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STM32H563IIT3Q part is unused and in its original packaging.

Return procedure for STM32H563IIT3Q:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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