STMicroelectronics STM32H563MIY3QTR
- Part No.:
- STM32H563MIY3QTR
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- 80-UFBGA, WLCSP
- Datasheet:
-
STM32H563MIY3QTR.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 80WLCSP
- Quantity:
- Payment:

- Shipping:

Inventory:1,260
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Product details
Overview
STM32H563MIY3QTR from STMicroelectronics is a high-security, high-performance Arm® Cortex®-M33 32-bit microcontroller with TrustZone®, FPU, and 250 MHz operation delivering 375 DMIPS. It integrates 2 Mbyte flash with ECC, 640 Kbyte SRAM (including ECC-enabled SRAM2/SRAM3), CORDIC/FMAC math accelerators, dual FDCAN, USB Type-C®/PD controller, and Ethernet MAC - deployed in industrial gateways requiring secure edge processing, firmware over-the-air updates, and real-time protocol bridging.
For engineers reviewing the STM32H563MIY3QTR datasheet, STM32H563MIY3QTR pinout, STM32H563MIY3QTR application, or STM32H563MIY3QTR equivalent, key selection criteria include TrustZone-enforced secure boot partitioning, dual-bank read-while-write flash for robust OTA updates, 140 5 V-tolerant GPIOs for mixed-voltage I/O interfacing, and integrated SMPS regulator support for power-constrained embedded systems.
Technical Context
The device implements Armv8-M mainline security with configurable SAU regions and secure debug authentication, enabling hardware-isolated secure/non-secure firmware execution. Its dual GPDMA controllers offload CPU bandwidth for concurrent peripheral data movement - critical for simultaneous Ethernet packet handling, SDMMC streaming, and Octo-SPI external memory access.
TrustZone-aware peripherals include GTZC-managed memory protection, secure RNG (NIST SP800-90B compliant), ECDSA signature verification, and SFI-based secure firmware installation. The ART Accelerator features 8-Kbyte instruction cache and 4-Kbyte data cache to sustain zero-wait-state execution from flash and external memories at 250 MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M33 with TrustZone, FPU, MPU - enables secure real-time multitasking and cryptographic acceleration in isolated execution environments. |
| Max Clock Frequency | 250 MHz - supports deterministic low-latency response in industrial control loops and time-critical communication stacks. |
| Flash Memory | 2 Mbyte with ECC and dual-bank read-while-write - allows seamless firmware upgrades without service interruption in field-deployed equipment. |
| SRAM Capacity | 640 Kbyte total: 64-Kbyte SRAM2 + 320-Kbyte SRAM3 (flexible ECC) + 4-Kbyte backup SRAM - accommodates large protocol stacks and retained context across deep-sleep modes. |
| Security Features | TrustZone, SAU, secure debug auth, HASH/PKA accelerators, 96-bit unique ID, active tampers - meets IEC 62443-3-3 SL2 requirements for industrial IoT endpoints. |
| Communication Interfaces | 2× FDCAN, 12× U(S)ART, 6× SPI, 4× I²C, 2× SAI, 1× Ethernet MAC, 1× USB Type-C®/PD - enables multi-protocol gateway functionality (Modbus TCP, CANopen, MQTT over TLS). |
| Power Management | 1.71–3.6 V supply; embedded LDO or external SMPS support; Sleep/Stop/Standby modes with 4-Kbyte backup SRAM retention - extends battery life in portable HMI and remote sensor concentrators. |
Pinout & Package
STM32H563MIY3QTR uses a WLCSP80 (3.50 × 3.27 mm) package with 80-ball BGA layout optimized for space-constrained industrial and wearable applications. Pin functions are validated per STMicroelectronics DS14258 Rev 6, Section 4.2 (Pin description) and Table 14 (pin/ball definition).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Core power supply and ground | Supports 1.71–3.6 V operation; decoupling required per DS14258 §5.3.2 for stable 250 MHz core clocking. |
| VCAP | Internal LDO stabilization capacitor node | Requires 2.2 µF ceramic capacitor to ensure regulated VCORE stability during dynamic load transitions. |
| NRST | Active-low reset input | Asynchronous reset with internal pull-up; compatible with external reset supervisors and push-button debouncing circuits. |
| BOOT0 | Boot mode selection | High at power-up selects system memory bootloader; used for factory programming and recovery via USART. |
| PA13/PA14 | SWDIO/SWCLK debug interface | Standard 2-pin Serial Wire Debug port - enables authenticated debug access under TrustZone life cycle control. |
| PD0/PD1 | OSC_IN/OSC_OUT | Connects to 4–50 MHz external crystal for precise clock source; required for USB/ETH timing compliance. |
| PC10/PC11 | FDCAN1_RX/FDCAN1_TX | Differential CAN FD transceiver interface - supports up to 5 Mbps bit rate for automotive-grade diagnostics and control networks. |
| PA15/PB3/PB4 | JTDI/JTMS/JTCK | JTAG boundary scan and debug test access - available when SWD is disabled; supports IEEE 1149.1 compliance. |
Key Features
| Feature | Design Value |
|---|---|
| Secure Firmware Installation (SFI) | Hardware-verified signed image loading prevents unauthorized firmware execution during boot and OTA update phases. |
| CORDIC & FMAC Accelerators | Offloads trigonometric and FIR/IIR filter computations from CPU - reduces latency in motor control and audio preprocessing tasks. |
| Dual GPDMA Controllers | Two independent dual-port DMA engines with FIFO enable concurrent high-bandwidth transfers (e.g., Ethernet RX → SRAM → FDCAN TX) without CPU intervention. |
| Flexible External Memory Interface | Supports SDRAM, PSRAM, NOR/NAND, FRAM via FMC - enables local caching of configuration data, firmware images, or video buffers in HMI and gateway applications. |
| USB Type-C®/PD Controller (UCPD) | Integrated UCPD PHY and policy engine handles USB Power Delivery negotiation and role swapping - eliminates need for external PD controllers in compact charging solutions. |
Applications
| Industrial Gateway | Secure Edge Node |
|---|---|
Use Scenario: Protocol translation between Modbus RTU field devices and cloud MQTT brokers over cellular/Wi-Fi. IC Role / Device Role / Timing Role: Central MCU managing dual FDCAN, multiple UARTs, Ethernet MAC, and TLS-accelerated crypto stack. Use Value: Dual-bank flash enables atomic firmware rollback; TrustZone isolates secure boot and key storage from application firmware. | Use Scenario: Tamper-resistant sensor aggregator in smart metering infrastructure with remote firmware updates. IC Role / Device Role / Timing Role: Secure runtime environment for AES-GCM encryption, ECDSA signature verification, and RTC-monitored event logging. Use Value: Active tampers detect physical intrusion; 96-bit unique ID binds cryptographic keys to hardware identity. |
| Human-Machine Interface | USB-C Charging Hub |
Use Scenario: Touchscreen HMI with local graphics rendering, audio feedback, and CAN bus diagnostics display. IC Role / Device Role / Timing Role: Application processor driving SAI audio codec, DCMI camera interface, and parallel LCD controller. Use Value: CORDIC/FMAC accelerators handle real-time FFT and tone generation; 640-Kbyte SRAM buffers frame data and UI assets. | Use Scenario: Multi-port USB-C hub supporting simultaneous data, video, and 100 W power delivery negotiation. IC Role / Device Role / Timing Role: UCPD controller managing PD contract negotiation, VCONN switching, and CC logic state machine. Use Value: Integrated UCPD eliminates external PD IC; SMPS regulator supplies digital core while minimizing thermal footprint. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-security MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32H753IIK6 | Arm Cortex-M7 @ 480 MHz; no TrustZone; 2 Mbyte flash, 1 Mbyte RAM; lacks UCPD, FDCAN, and SFI. | Higher raw performance but no hardware-enforced security partitioning; requires external secure element for comparable trust model. | Select when maximum DSP throughput is prioritized over certified secure boot and firmware attestation. |
| NXP i.MX RT1176AVM8B | Arm Cortex-M7 + M4 dual-core; 1 MB on-chip RAM; includes CAAM crypto accelerator; no integrated UCPD or FDCAN. | Strong asymmetric crypto support but lacks native USB-C PD controller and dual CAN FD interfaces. | Select for heterogeneous compute workloads where M7 handles AI inference and M4 manages real-time control, with external CAN transceivers. |
Compared with STM32H563MIY3QTR, STM32H753IIK6 offers higher clock speed but no TrustZone or SFI, increasing software validation burden for secure deployments; i.MX RT1176AVM8B provides dual-core flexibility and CAAM acceleration but requires external components to match the integrated FDCAN/UCPD feature set.
Availability
STM32H563MIY3QTR is available at Aetrix Electronics and suitable for industrial gateways, secure edge nodes, human-machine interfaces, and USB-C charging hubs requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for STM32H563MIY3QTR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, sensors, and analog products for industrial, automotive, and consumer markets.
The STM32H5 series targets high-assurance embedded applications demanding hardware-rooted security, real-time determinism, and energy efficiency - specifically engineered for industrial IoT gateways, secure medical devices, and next-generation USB-C infrastructure.
FAQ
What is the qualified operating temperature range for STM32H563MIY3QTR?
The STM32H563MIY3QTR is rated for industrial temperature operation from –40 °C to +105 °C, verified per DS14258 Rev 6 §5.3.3. This range applies to all core logic, flash, SRAM, and integrated peripherals including FDCAN, Ethernet MAC, and USB Type-C® controller - ensuring reliable operation in uncontrolled environmental deployments such as outdoor gateways and factory-floor HMIs.
Does STM32H563MIY3QTR support secure boot from external memory?
No. Secure boot is enforced only from internal flash memory using the embedded ROM bootloader and TrustZone-configured SAU regions. External memory (via FMC or Octo-SPI) may be mapped into secure address space but cannot serve as a trusted boot source - verified by ST's secure boot documentation and the absence of external boot vector validation in the GTZC architecture.
How many independent clock sources does STM32H563MIY3QTR integrate?
The device integrates six internal clock sources: 64 MHz HSI, 48 MHz HSI48, 4 MHz CSI, 32 kHz LSI, plus two external oscillators (4–50 MHz HSE and 32.768 kHz LSE). All are accessible via the RCC and subject to TrustZone-aware clock gating - enabling independent clock domain management for secure peripherals and low-power subsystems.
Can the WLCSP80 package accommodate reflow soldering on standard PCB assembly lines?
Yes. The WLCSP80 (3.50 × 3.27 mm) package complies with JEDEC J-STD-020 moisture sensitivity level 3 and supports standard lead-free reflow profiles (peak 260 °C). ST specifies 0.4 mm ball pitch and recommends stencil design per DS14258 §6.4 - enabling compatibility with automated SMT lines used in high-volume industrial electronics manufacturing.
STM32H563MIY3QTR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 80-UFBGA, WLCSP
- Series:
- STM32H5
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit
- Speed:
- 250MHz
- Connectivity:
- CANbus, FIFO, I2C, IrDA, LINbus, SCI, SDIO, SMBus, SPI, UART/USART, USB
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, PDR, POR, PWM, SHA, TRNG, Voltage Detect, WDT
- Number of I/O:
- 57
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 640K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 16x12b SAR; D/A 2x12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
STM32H563MIY3QTR FAQ
1.How can I place an order for STM32H563MIY3QTR through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32H563MIY3QTR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32H563MIY3QTR reliable?
The price and inventory of STM32H563MIY3QTR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32H563MIY3QTR is usually 5 days.
3.What payment methods are accepted for STM32H563MIY3QTR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32H563MIY3QTR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STM32H563MIY3QTR?
STM32H563MIY3QTR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32H563MIY3QTR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32H563MIY3QTR?
For technical support, including STM32H563MIY3QTR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32H563MIY3QTR requirements.
6.How does Aetrix verify that STM32H563MIY3QTR is sourced from the original manufacturer or authorized distributors?
All STM32H563MIY3QTR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32H563MIY3QTR meets industry standards.
7.What is the process for return or replacement of STM32H563MIY3QTR?
All STM32H563MIY3QTR units undergo pre-shipment inspection (PSI). If there is an issue with STM32H563MIY3QTR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32H563MIY3QTR part is unused and in its original packaging.
Return procedure for STM32H563MIY3QTR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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