STMicroelectronics STM32H563VGT6TR
- Part No.:
- STM32H563VGT6TR
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- -
- Datasheet:
-
STM32H563VGT6TR.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 100LQFP
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Inventory:1,108
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Product details
Overview
STM32H563VGT6TR from STMicroelectronics is a high-security, high-performance Arm® Cortex®-M33 32-bit microcontroller with TrustZone®, FPU, and 250 MHz operation. It integrates 2 Mbyte flash with ECC, 640 Kbyte SRAM (including ECC-protected SRAM2/SRAM3), dual DMA controllers, CORDIC/FMAC math accelerators, and dual FDCAN interfaces. It targets secure industrial control, IoT edge nodes, and automotive body electronics requiring real-time deterministic execution and firmware integrity.
For engineers reviewing the STM32H563VGT6TR datasheet, STM32H563VGT6TR pinout, STM32H563VGT6TR application, or STM32H563VGT6TR equivalent, key selection criteria include TrustZone-enforced peripheral isolation, 250 MHz clock stability under voltage scaling, dual-bank flash for seamless OTA updates, 140 I/Os with 5 V tolerance, and hardware-accelerated ECDSA/SHA for secure boot verification.
Technical Context
The device implements Armv8-M mainline security with configurable SAU regions and GTZC-managed memory/peripheral partitioning. Its dual-core debug architecture supports authenticated SWD/JTAG access, while the secure life cycle scheme enforces mandatory debug authentication in production mode.
Power management integrates an SMPS step-down converter with scalable output (0.8–1.2 V) and LDO fallback, enabling dynamic voltage/frequency scaling across Sleep/Stop/Standby modes. The ART Accelerator includes 8-Kbyte instruction cache and 4-Kbyte data cache to eliminate flash wait states at full 250 MHz operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M33 with TrustZone, FPU, MPU - enables secure real-time task isolation and floating-point-intensive control loops without software emulation. |
| Max Clock Frequency | 250 MHz - delivers 375 DMIPS (Dhrystone 2.1) and 1023 CoreMark®, supporting deterministic response in motor control and digital power applications. |
| Flash Memory | 2 Mbyte with ECC and read-while-write dual banks - allows concurrent firmware update and execution, critical for fail-safe field upgrades. |
| SRAM | 640 Kbyte total: 64-Kbyte SRAM2 (ECC), 320-Kbyte SRAM3 (flexible ECC), 4-Kbyte backup SRAM - ensures data retention and tamper-resilient state storage during low-power modes. |
| Security Features | TrustZone + SAU + SFI + HASH + PKA + RNG (NIST SP800-90B) - provides hardware-rooted secure boot, firmware attestation, and cryptographic key generation for TLS/OTA. |
| Analog Peripherals | Two 12-bit ADCs (5 Msps), one dual-channel 12-bit DAC, digital temperature sensor - supports closed-loop analog sensing and actuation in industrial HMI and power conversion. |
| Communication Interfaces | 2× FDCAN, 12× U(S)ART, 4× I²C, 2× SAI, 2× SDMMC, Octo-SPI, USB FS host/device, UCPD - enables multi-protocol connectivity for gateway and edge node architectures. |
Pinout & Package
LQFP100 (14 × 14 mm, 0.5 mm pitch) package with 100 leads. Pinout validated per STMicroelectronics DS14258 Rev 6, Section 4.2 (Pin description) and Table 14 (pin/ball definition). All pins support 5 V-tolerant inputs except analog and supply domains.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD/VSS | Core power supply / ground | 1.71–3.6 V application supply; dedicated VCAP pins required for SMPS stability; decoupling essential for 250 MHz noise immunity. |
| PA0–PA15, PB0–PB15, etc. | General-purpose I/O | Up to 140 fast GPIOs; most 5 V-tolerant; support multiple alternate functions including FDCAN_RX/TX, USART_TX/RX, SPI_MOSI/MISO, and ADC_INx. |
| NRST | Active-low reset input | Asynchronous reset with internal pull-up; compatible with external reset supervisors; supports tamper-triggered secure reset via TAMP peripheral. |
| BOOT0 | Boot mode selection | High at power-up selects system memory boot; used with BOOT1 to configure TrustZone-enabled vs. legacy boot sequences per Tables 3–4. |
| OSC_IN/OSC_OUT | External crystal oscillator interface | Supports 4–50 MHz HSE crystal; required for precise timing in Ethernet MAC, USB, and FDCAN; optional for internal 64 MHz HSI calibration. |
Key Features
| Feature | Design Value |
|---|---|
| TrustZone-aware peripherals | All major peripherals (GPIO, UART, SPI, ADC, timers) are configurable as Secure/Non-secure - enables hardware-enforced separation of safety-critical and user-facing firmware modules. |
| CORDIC coprocessor | Hardware-accelerated sin/cos/tan/arctan/log/exp - reduces CPU load by >90% in motor FOC algorithms and sensor fusion calculations. |
| FMAC filter accelerator | Dedicated 32-bit MAC unit with 128-word RAM - executes FIR/IIR filters at full speed without DMA overhead, ideal for real-time audio and vibration analysis. |
| Octo-SPI interface | Single 8-line interface supporting x8/x4/x1 protocols for HyperRAM, PSRAM, NOR/NAND - replaces parallel memory buses, saving PCB layers and I/O count in space-constrained designs. |
| Secure firmware installation (SFI) | Hardware-verified signature check on firmware images using ECDSA-P256 - prevents unauthorized code execution even if flash is physically accessed. |
Applications
| Industrial PLC Controller | Secure IoT Gateway |
|---|---|
Use Scenario: Programmable logic controller executing ladder logic and motion control in factory automation with remote diagnostics. IC Role / Device Role / Timing Role: Main application processor managing I/O scanning, EtherCAT/PROFINET stack, and secure firmware updates over TLS. Use Value: Dual-bank flash enables zero-downtime firmware patching; TrustZone isolates real-time control tasks from network stack; FDCAN supports distributed I/O communication. |
Use Scenario: Edge gateway aggregating BLE/Zigbee sensor data and forwarding to cloud via Ethernet or cellular modem. IC Role / Device Role / Timing Role: Central secure hub performing protocol translation, encrypted data buffering, and OTA update orchestration. Use Value: Hardware PKA accelerates TLS handshake; Octo-SPI expands local storage for offline caching; 12× UARTs support multi-sensor serial bridging. |
| Automotive Body Control Module | Medical Diagnostic Device |
Use Scenario: Central body controller managing lighting, door locks, HVAC, and CAN FD communication in passenger vehicles. IC Role / Device Role / Timing Role: Safety-compliant MCU handling ASIL-B functional safety tasks via lockstep timer monitoring and ECC memory scrubbing. Use Value: Dual FDCAN interfaces enable redundant vehicle bus communication; 640-Kbyte SRAM supports large diagnostic log buffers; tamper detection triggers secure erase on intrusion. |
Use Scenario: Portable ultrasound or ECG device requiring low-noise analog acquisition, real-time signal processing, and HIPAA-compliant data encryption. IC Role / Device Role / Timing Role: Signal acquisition and processing engine driving ADC sampling, beamforming, and AES-256 encryption before wireless transmission. Use Value: 12-bit ADC with 5 Msps captures high-fidelity bio-signals; CORDIC/FMAC accelerate Doppler shift calculation; RNG and HASH ensure cryptographically sound key derivation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-security MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32H753VI | No TrustZone; Cortex-M7 core; 480 MHz; 2 Mbyte flash but no dual-bank RWW; lacks PKA/ECDSA hardware. | Suitable for non-security-critical high-performance compute, but cannot meet PSA Level 3 or Common Criteria EAL4+ requirements. | Select when maximum raw throughput is prioritized over hardware-enforced security partitioning and secure boot attestation. |
| NXP i.MX RT1176 | Cortex-M7 + Cortex-M4 dual-core; 1 GHz M7; no TrustZone on M4; separate secure element (SECO); different peripheral set (no Octo-SPI, no FMAC). | Targets multimedia-rich edge devices; relies on external SE for root-of-trust rather than integrated TrustZone. | Select when heterogeneous dual-core processing (e.g., GUI + control) is needed, and external secure element integration is acceptable. |
Compared with STM32H563VGT6TR, the STM32H753VI trades hardware security for higher clock speed and simpler certification paths, while the i.MX RT1176 shifts security responsibility to an external component-making the H563 the only option offering integrated, TrustZone-native, PSA-certifiable security at 250 MHz with math acceleration.
Availability
STM32H563VGT6TR is available at Aetrix Electronics and suitable for industrial PLC controllers, secure IoT gateways, automotive body control modules, and medical diagnostic devices requiring stable component supply across extended product lifecycles.
Supply support for STM32H563VGT6TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in microcontrollers, power management, sensors, and automotive ICs with strong emphasis on industrial and automotive reliability.
The STM32H5 series is ST's flagship high-security MCU line designed specifically for PSA Certified Level 3 and Common Criteria EAL4+ applications-integrating TrustZone, cryptographic accelerators, and secure firmware lifecycle management into a single die.
FAQ
What is the maximum operating temperature range for STM32H563VGT6TR?
The STM32H563VGT6TR is rated for industrial temperature range: –40 °C to +105 °C ambient. This is confirmed in Section 5.3.1 of DS14258 Rev 6, where operating conditions specify junction temperature limits up to +125 °C and thermal derating curves for sustained 250 MHz operation under worst-case ambient conditions.
Does STM32H563VGT6TR support JTAG debugging in production mode?
No-JTAG is disabled by default in production life cycle state. Only Serial Wire Debug (SWD) is available, and it requires authenticated debug access using a valid certificate provisioned via the secure debug authentication mechanism defined in Section 3.46.1 of the datasheet.
Can the internal SMPS be used without external components?
No-the SMPS requires external components: a 1 µH inductor, 22 µF output capacitor, and feedback resistors for voltage setting. Section 5.3.3 details mandatory external component values and layout constraints to ensure stability and EMI compliance at full 250 MHz operation.
How many independent clock sources does STM32H563VGT6TR provide?
It provides six independent clock sources: 64 MHz HSI, 48 MHz HSI48, 4 MHz CSI, 32 kHz LSI, 4–50 MHz HSE, and 32.768 kHz LSE. These are documented in Section 3.12 and electrically characterized in Section 5.3.9 (internal) and 5.3.8 (external) of DS14258 Rev 6.
STM32H563VGT6TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
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- Tape & Reel (TR)
- Product Status:
- Active
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STM32H563VGT6TR FAQ
1.How can I place an order for STM32H563VGT6TR through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32H563VGT6TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32H563VGT6TR reliable?
The price and inventory of STM32H563VGT6TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32H563VGT6TR is usually 5 days.
3.What payment methods are accepted for STM32H563VGT6TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32H563VGT6TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STM32H563VGT6TR?
STM32H563VGT6TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32H563VGT6TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32H563VGT6TR?
For technical support, including STM32H563VGT6TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32H563VGT6TR requirements.
6.How does Aetrix verify that STM32H563VGT6TR is sourced from the original manufacturer or authorized distributors?
All STM32H563VGT6TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32H563VGT6TR meets industry standards.
7.What is the process for return or replacement of STM32H563VGT6TR?
All STM32H563VGT6TR units undergo pre-shipment inspection (PSI). If there is an issue with STM32H563VGT6TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32H563VGT6TR part is unused and in its original packaging.
Return procedure for STM32H563VGT6TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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