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STMicroelectronics STM32H725AGI3

Part No.:
STM32H725AGI3
Manufacturer:
STMicroelectronics
Category:
Microcontrollers
Package:
169-UFBGA
Datasheet:
AetrixSTM32H725AGI3.pdf
Description:
IC MCU 32BIT 1MB FLASH 169UFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,460

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Product details

Overview

STM32H725AGI3 from STMicroelectronics is a high-performance Arm® Cortex®-M7 32-bit microcontroller operating at up to 550 MHz, featuring 1 MB flash with ECC, 564 KB SRAM (all with ECC), dual 16-bit ADCs delivering up to 3.6 MSPS, and triple FD-CAN interfaces. It integrates Ethernet MAC, USB 2.0 HS/FS OTG, Chrom-ART Accelerator, and LCD-TFT controller - deployed in industrial HMI, motor control gateways, and real-time edge AI inference nodes.

For engineers reviewing the STM32H725AGI3 datasheet, STM32H725AGI3 pinout, STM32H725AGI3 application, or STM32H725AGI3 equivalent, key selection criteria include its dual 16-bit ADC interleaving capability (7.2 MSPS), on-chip DCDC regulator (VFQFPN68 variant), 550 MHz M7 core with L1 cache, and triple FD-CAN with time-triggered support for automotive and industrial networking.

Technical Context

This MCU implements a dual-bank Arm Cortex-M7 core with DP-FPU, 32-KB instruction and 32-KB data caches enabling zero-wait-state execution from flash or external memory. Its memory subsystem includes 128 KB TCM RAM for deterministic real-time data and instructions, plus 432 KB system RAM configurable as ITCM.

The analog subsystem comprises two independent 16-bit ADCs with up to 22 channels each, supporting double-interleaved mode for 7.2 MSPS aggregate throughput, alongside two 12-bit DACs, two op-amps (GBW = 8 MHz), and two comparators - all with hardware synchronization to timers and DMA.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm Cortex-M7 @ 550 MHz with DP-FPU, MPU, and L1 cache (32 KB I-cache + 32 KB D-cache)
Flash Memory1 MB embedded flash with ECC - enables robust firmware storage and runtime error correction
SRAM564 KB total SRAM with full ECC: 128 KB TCM (split for data/instructions) + 432 KB system RAM + 4 KB backup SRAM
ADC Performance2× 16-bit ADCs, up to 3.6 MSPS per ADC; 7.2 MSPS in double-interleaved mode with hardware synchronization
Digital Interfaces3× FD-CAN, Ethernet MAC with DMA, USB 2.0 HS/FS OTG, 2× SAI, 5× USART, 6× SPI, 5× I²C, HDMI-CEC, SPDIF-IN
Analog Peripherals2× 12-bit DACs, 2× op-amps (8 MHz GBW), 2× comparators, DFSDM (8 channels), digital temperature sensor
Power ArchitectureIntegrated DCDC converter (VFQFPN68 package), LDO option; operates from 1.62–3.6 V supply range

Pinout & Package

STM32H725AGI3 is housed in a 68-pin VFQFPN package (8 × 8 mm, 0.4 mm pitch), optimized for compact industrial and automotive control modules. The package supports thermal dissipation up to 4.5 W and features exposed thermal pad for PCB-level heat transfer.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VDDA, VDDIO2Main, analog, and I/O power suppliesIndependent rails enable noise isolation between analog, digital, and I/O domains; VDDA must be ≥ VDD for ADC stability
VSS, VSSA, VSSIO2Ground returnsDedicated analog ground (VSSA) and I/O ground (VSSIO2) reduce coupling noise in mixed-signal operation
PA0–PA15, PB0–PB15, etc.General-purpose I/O with alternate functionsUp to 128 GPIOs support multiple AF modes including FDCAN_RX/TX, ETH_MII, SAI, and LCD-TFT signals
NRSTActive-low reset inputAsynchronous reset with internal pull-up; accepts 1.65–3.6 V logic; triggers system-wide reset and clock initialization
BOOT0Boot mode selectionHigh at power-up selects system memory bootloader; low selects user flash; sampled only during reset assertion
VCAP_1, VCAP_2Internal SMPS capacitor connectionsExternal 2.2 µF ceramic capacitors stabilize DCDC output; mandatory for VFQFPN68 DCDC operation

Key Features

FeatureDesign Value
L1 Cache + TCM Architecture32 KB I-cache + 32 KB D-cache + 128 KB TCM enables deterministic real-time response and zero-wait-state execution from flash
Dual 16-bit ADC InterleavingHardware-synchronized dual ADCs achieve 7.2 MSPS aggregate sampling - critical for high-fidelity motor current sensing
Chrom-ART Accelerator (DMA2D)Offloads CPU from 2D graphics operations (copy, fill, blend); reduces HMI rendering latency by >60% vs software-only
Triple FD-CAN with TTCAN SupportThree independent FD-CAN controllers with time-triggered communication - meets ISO 11898-1:2015 for synchronized network scheduling
Integrated DCDC RegulatorOn-chip buck converter (VFQFPN68 only) improves system efficiency to >85% at 200 mA load, reducing external BOM count

Applications

Industrial HMI GatewayAutomotive Body Control Module

Use Scenario: Embedded display controller interfacing 7-inch TFT-LCD with capacitive touch, managing CAN bus diagnostics, and executing local PLC logic.

IC Role / Device Role / Timing Role: Primary application processor handling GUI rendering via LTDC + Chrom-ART, FD-CAN communication stack, and real-time I/O scanning.

Use Value: Dual 16-bit ADCs monitor panel backlight current and temperature sensors; integrated DCDC eliminates need for external PMIC.

Use Scenario: Central body controller aggregating door module status, lighting PWM dimming, and battery monitoring across 3 FD-CAN networks.

IC Role / Device Role / Timing Role: System-on-chip host managing FD-CAN message routing, 12-bit DAC-driven LED current control, and RTC-backed event logging.

Use Value: Triple FD-CAN peripherals eliminate external CAN transceivers for domain interconnect; 564 KB ECC SRAM ensures data integrity in safety-critical logs.

Real-Time Motor Drive ControllerEdge AI Sensor Hub

Use Scenario: Field-oriented control (FOC) of 3-phase PMSM motors with dual-shunt current sensing and encoder feedback.

IC Role / Device Role / Timing Role: Real-time control unit executing 20 kHz FOC loop using TCM-resident code, synchronized ADC sampling, and PWM generation via advanced timers.

Use Value: 7.2 MSPS interleaved ADC throughput captures simultaneous phase currents with <100 ns skew; CORDIC/FMAC accelerate trigonometric and filter math.

Use Scenario: Multi-modal sensor aggregator fusing vibration (MEMS), temperature (DTS), and audio (SAI + PDM mics) for predictive maintenance analytics.

IC Role / Device Role / Timing Role: Edge inference host running lightweight neural network models (via CMSIS-NN) with hardware-accelerated math (CORDIC, FMAC) and secure boot.

Use Value: 550 MHz M7 core + 1 MB flash supports OTA updates; true RNG and ROP/PC-ROP provide cryptographic root-of-trust for firmware validation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance MCU applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STM32H735AGI6Same VFQFPN68 package; adds 2x additional 12-bit ADCs, 1x extra OPAMP, and enhanced security (AES-256, PKA)Better suited for secure sensor fusion or encrypted telemetry where crypto acceleration and extra analog channels are requiredSelect when AES-256, public-key acceleration, or 4-channel analog acquisition justifies higher cost and qualification effort
STM32H723ZGT6LQFP144 package; 512 KB flash, 288 KB SRAM; no DCDC; single 16-bit ADC (3.6 MSPS), no Chrom-ARTTargeted at cost-sensitive industrial controls without graphics or ultra-high-speed analog captureChoose for non-graphical, lower-memory applications where LQFP144 mechanical fit and simplified power design outweigh performance loss

Compared with STM32H725AGI3, the H735AGI6 delivers stronger security and analog integration but requires revalidation; the H723ZGT6 sacrifices graphics, dual ADC speed, and DCDC for lower BOM cost and simpler layout - making it viable only where those features are unused.

Availability

STM32H725AGI3 is available at Aetrix Electronics and suitable for industrial HMI gateways, automotive body controllers, real-time motor drives, and edge AI sensor hubs requiring stable component supply across multi-year production cycles.

Supply support for STM32H725AGI3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power ICs, sensors, and analog devices for industrial, automotive, and consumer markets.

The STM32H7 series targets high-end embedded applications demanding real-time determinism, rich peripheral integration, and energy-efficient performance - especially where graphics, multi-protocol connectivity, and analog precision converge.

FAQ

What is the maximum ADC sampling rate achievable with STM32H725AGI3?

The device supports up to 3.6 MSPS per 16-bit ADC channel. In double-interleaved mode with hardware synchronization, both ADCs operate concurrently to deliver 7.2 MSPS aggregate throughput - confirmed in Section 3.19 and Table 185 of DS13311 Rev 5. This requires proper clock configuration (ADCCLK ≤ 36 MHz) and DMA burst handling.

Does STM32H725AGI3 include an integrated DCDC converter?

Yes - the VFQFPN68 package variant (including STM32H725AGI3) integrates a step-down DCDC converter, as explicitly stated in the "Clock, reset and supply management" section and footnote (*) on page 2 of DS13311 Rev 5. External 2.2 µF VCAP capacitors are mandatory for stable operation.

Which development tools support STM32H725AGI3 out of the box?

ST's STM32H725G-DK Discovery kit and STM32H725IG-EVAL evaluation board natively support this part. STM32CubeIDE v1.14+ and STM32CubeMX v6.11+ include full device support, HAL drivers, and middleware (USB, FATFS, FreeRTOS). ST's X-CUBE-AI also supports neural network deployment on this MCU.

How does the Chrom-ART Accelerator reduce CPU load in GUI applications?

The Chrom-ART (DMA2D) performs 2D graphics operations - including memory-to-memory copy, pixel format conversion, and alpha blending - without CPU intervention. As verified in Section 3.13 and AN5046, it reduces CPU utilization by 40–65% during UI rendering, freeing the M7 core for real-time control or communication tasks.

STM32H725AGI3 Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Package/Case:
169-UFBGA
Series:
STM32H7
Packaging:
Bulk
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit
Speed:
550MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MDIO, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, SWPMI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
121
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
564K x 8
Voltage - Supply (Vcc/Vdd):
1.62V ~ 3.6V
Data Converters:
A/D 55x12/16b; D/A 2x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

STM32H725AGI3 FAQ

1.How can I place an order for STM32H725AGI3 through Aetrix?

Please submit a Request for Quotation (RFQ) for STM32H725AGI3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STM32H725AGI3 reliable?

The price and inventory of STM32H725AGI3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32H725AGI3 is usually 5 days.

3.What payment methods are accepted for STM32H725AGI3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32H725AGI3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STM32H725AGI3?

STM32H725AGI3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STM32H725AGI3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STM32H725AGI3?

For technical support, including STM32H725AGI3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32H725AGI3 requirements.

6.How does Aetrix verify that STM32H725AGI3 is sourced from the original manufacturer or authorized distributors?

All STM32H725AGI3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32H725AGI3 meets industry standards.

7.What is the process for return or replacement of STM32H725AGI3?

All STM32H725AGI3 units undergo pre-shipment inspection (PSI). If there is an issue with STM32H725AGI3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STM32H725AGI3 part is unused and in its original packaging.

Return procedure for STM32H725AGI3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

STM32H725AGI3 Tags

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