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STMicroelectronics STM32H725IGK3TR

Part No.:
STM32H725IGK3TR
Manufacturer:
STMicroelectronics
Category:
Microcontrollers
Package:
201-UFBGA
Datasheet:
AetrixSTM32H725IGK3TR.pdf
Description:
IC MCU 32BIT 1MB FLASH 176UFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,793

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Product details

Overview

STM32H725IGK3TR from STMicroelectronics is a high-performance Arm® Cortex®-M7 32-bit microcontroller operating at up to 550 MHz, featuring 1 MB flash with ECC, 564 KB SRAM (all with ECC), dual 16-bit ADCs (3.6 MSPS), Ethernet MAC, USB 2.0 HS/FS OTG, and three FD-CAN interfaces. It targets graphics-rich industrial HMI, motor control gateways, and real-time edge nodes requiring deterministic low-latency execution and multi-interface connectivity.

For engineers reviewing the STM32H725IGK3TR datasheet, STM32H725IGK3TR pinout, STM32H725IGK3TR application, or STM32H725IGK3TR equivalent, key selection considerations include its VFQFPN68 package with 68 pins, integrated DCDC regulator, dual TCM RAM architecture for real-time code/data isolation, and hardware accelerators (CORDIC, FMAC, Chrom-ART) enabling efficient signal processing and GUI rendering without CPU overhead.

Technical Context

The device implements a dual-bank Arm Cortex-M7 core with 32-KB instruction and 32-KB data L1 caches, enabling zero-wait-state execution from flash or external memory. Its memory subsystem includes 128 KB data TCM RAM, 256 KB remappable instruction TCM RAM, and 4 KB backup SRAM - all protected by ECC for functional safety compliance.

Peripherals are orchestrated via a multi-layer AHB/APB bus matrix supporting concurrent high-bandwidth transfers: Ethernet MAC and USB OTG_HS each have dedicated DMAs; two Octo-SPI interfaces support XiP; and three FD-CAN controllers operate independently with time-triggered (TT-CAN) capability on FDCAN1.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm Cortex-M7 with DP-FPU, 550 MHz max frequency, 1177 DMIPS performance
Flash Memory1 MB embedded flash with ECC - enables ASIL-B compliant code storage and robust field updates
SRAM564 KB total SRAM with full ECC: 128 KB data TCM + 256 KB system RAM + 4 KB backup SRAM
Analog Peripherals2× 16-bit ADCs (3.6 MSPS), 1× 12-bit ADC (5 MSPS), 2× op-amps (8 MHz GBW), 2× DACs
Digital Interfaces3× FD-CAN, Ethernet MAC with DMA, USB 2.0 HS/FS OTG, 2× SAI, 2× Octo-SPI, 8–14-bit DCMI
Hardware AcceleratorsCORDIC (trig/log/exp), FMAC (filtering), Chrom-ART (2D graphics offload)
Power ArchitectureIntegrated SMPS DCDC regulator (VFQFPN68 variant), 1.62–3.6 V supply range, multiple low-power modes

Pinout & Package

STM32H725IGK3TR uses a 68-pin VFQFPN (8 × 8 mm, 0.4 mm pitch) package with exposed thermal pad. This compact, thermally enhanced package supports high-density PCB layouts while enabling efficient heat dissipation for sustained 550 MHz operation under industrial ambient conditions.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VDDA, VDDIO2Core, analog, and I/O power suppliesIndependent rails allow precise noise isolation between digital logic, ADC/DAC, and GPIO domains
VSS, VSSA, VSSIO2Ground return pathsDedicated analog and I/O ground planes minimize coupling into sensitive measurement circuits
PA0–PA15, PB0–PB15, etc.General-purpose I/O with alternate functionsUp to 128 GPIOs support configurable pull-up/down, Schmitt trigger, and 5 V-tolerant options on select banks
PH0/PH1HSE oscillator input/outputSupports 4–50 MHz crystal or external clock source for precise system timing and USB/Ethernet synchronization
PD0/PD1USART2 TX/RXDefault debug console interface; supports LIN, IrDA, and modem control protocols
PF12–PF15Ethernet RMII interfaceDirect connection to PHY without external glue logic; supports MII via alternate function remapping
PE2–PE7FDCAN1 TX/RX, FDCAN2 TX/RX, FDCAN3 TX/RXThree independent FD-CAN transceivers with ISO 11898-1:2015 compliance and bit rates up to 5 Mbps

Key Features

FeatureDesign Value
L1 cache + ECC memory32 KB instruction + 32 KB data cache + full ECC on 564 KB SRAM enables ASIL-B functional safety certification per IEC 61508
Dual TCM RAM architecture128 KB data TCM + up to 256 KB instruction TCM allows lockstep or split real-time task partitioning with zero cache coherency overhead
Hardware math accelerationCORDIC computes sin/cos/tan/log/exp in <10 cycles; FMAC executes FIR/IIR filters with 32-bit precision at 550 MHz
Chrom-ART AcceleratorOffloads 2D graphics operations (copy, blend, format conversion) from CPU - reduces GUI rendering latency by >70% vs software-only
FD-CAN triple controllerThree independent FD-CAN modules support mixed classical/FD networks, CAN FD data payloads up to 64 bytes, and flexible bit-rate switching

Applications

Industrial HMI PanelSmart Motor Drive Gateway

Use Scenario: 7-inch TFT display with capacitive touch, real-time PLC status visualization, and local parameter configuration.

IC Role / Device Role / Timing Role: Main application processor executing FreeRTOS, driving LCD-TFT controller at XGA resolution, and managing USB CDC/DFU firmware updates.

Use Value: Chrom-ART accelerator renders UI overlays at 60 fps with <15% CPU load; dual 16-bit ADCs sample current/voltage feedback at 3.6 MSPS for closed-loop control.

Use Scenario: Field-oriented control (FOC) of PMSM motors with dual encoder inputs, EtherCAT slave interface, and CAN FD diagnostics bus.

IC Role / Device Role / Timing Role: Real-time motion controller running FOC algorithm at 20 kHz PWM rate; Ethernet MAC handles EtherCAT frame processing; FD-CAN3 reports fault logs.

Use Value: Dual TCM RAM isolates control loop code (in ITCM) and sensor buffers (in DTCM); CORDIC computes Clarke/Park transforms in <2 µs per cycle.

Edge AI Sensor HubAutomotive Diagnostic Tool

Use Scenario: Multi-sensor node (IMU, temp, humidity, vibration) performing onboard FFT and anomaly detection before cloud upload via Ethernet or USB.

IC Role / Device Role / Timing Role: Edge inference host running TinyML models; DFSDM processes sigma-delta microphone inputs; FMAC executes spectral analysis filters.

Use Value: 8-channel DFSDM with decimation filtering captures audio/vibration at 192 ksps; FMAC performs real-time 1024-point FFT in <1.2 ms.

Use Scenario: Handheld OBD-II scanner supporting UDS, DoIP, and CAN FD diagnostics across legacy and next-gen vehicles.

IC Role / Device Role / Timing Role: Protocol gateway translating USB CDC commands to FD-CAN frames; LPUART interfaces with Bluetooth module; RTC maintains diagnostic timestamps.

Use Value: Three FD-CAN controllers enable simultaneous communication with engine ECU (CAN FD), body domain (classical CAN), and telematics unit (DoIP over CAN FD).

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance MCU applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STM32H735IGK6Same VFQFPN68 package; adds cryptographic accelerator (AES-256, PKA), higher flash (2 MB), no DCDC (LDO only)Better suited for secure boot, OTA encryption, and larger firmware images; lacks integrated DCDC efficiency for battery-powered toolsSelect when security features outweigh power-constrained operation
STM32H723ZGT6LQFP144 package (144 pins); same core/peripherals but reduced RAM (512 KB), no Ethernet MAC, single FD-CANTargeted at cost-sensitive motor drives without networking; larger footprint eases routing but limits board densitySelect when Ethernet and dual FD-CAN are unnecessary and PCB space permits LQFP144

Compared with STM32H725IGK3TR, the H735IGK6 prioritizes security over power efficiency, while the H723ZGT6 trades integration and density for lower BOM cost and simpler layout - making the IGK3TR optimal for space-constrained, networked industrial edge devices requiring balanced performance, power, and peripheral richness.

Availability

STM32H725IGK3TR is available at Aetrix Electronics and suitable for industrial HMI panels, smart motor drive gateways, and edge AI sensor hubs requiring stable component supply, long-term lifecycle assurance, and automotive-grade reliability under extended temperature ranges.

Supply support for STM32H725IGK3TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, specializing in microcontrollers, power management, sensors, and automotive ICs with strong focus on industrial and automotive markets.

The STM32H7 series delivers heterogeneous dual-core and hardware-accelerated MCUs targeting real-time edge intelligence, deterministic control, and rich human-machine interaction in resource-constrained environments.

FAQ

What is the maximum operating frequency and how is it achieved?

The STM32H725IGK3TR achieves 550 MHz via its Arm Cortex-M7 core with dual 32-KB L1 caches (instruction and data), allowing zero-wait-state execution from embedded flash or external memory. This requires proper VDD/VDDA regulation, thermal management within the VFQFPN68 package's 105°C junction limit, and correct clock tree configuration using the internal PLL with HSE or HSI as source.

Does this MCU support functional safety standards like IEC 61508?

Yes - the STM32H725IGK3TR includes hardware features required for ASIL-B compliance: ECC on all SRAM and flash, lock-step capable peripherals (via software configuration), memory protection unit (MPU), CRC calculation unit, and failure monitoring via independent watchdogs. ST provides certified safety packages including FMEDA reports and safety manuals aligned with IEC 61508 and ISO 26262.

Can the integrated DCDC regulator be used with all supply voltages?

No - the integrated SMPS DCDC regulator in the VFQFPN68 variant operates only with input voltage between 2.7 V and 3.6 V and outputs 1.2 V for the core. Below 2.7 V, the device automatically switches to LDO mode. The DCDC must be disabled if VDDA is below 2.4 V to prevent analog performance degradation, as specified in Section 6.3.3 of DS13311 Rev 5.

How many FD-CAN interfaces does STM32H725IGK3TR support and what are their key capabilities?

The STM32H725IGK3TR integrates three fully independent FD-CAN controllers (FDCAN1–FDCAN3), each supporting ISO 11898-1:2015, bit rates up to 5 Mbps, payload sizes up to 64 bytes, and flexible data-rate switching. FDCAN1 additionally supports time-triggered communication (TT-CAN) for deterministic scheduling in synchronized networks.

STM32H725IGK3TR Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Package/Case:
201-UFBGA
Series:
STM32H7
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit
Speed:
550MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MDIO, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, SWPMI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
128
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
564K x 8
Voltage - Supply (Vcc/Vdd):
1.62V ~ 3.6V
Data Converters:
A/D 55x12/16b; D/A 2x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

STM32H725IGK3TR FAQ

1.How can I place an order for STM32H725IGK3TR through Aetrix?

Please submit a Request for Quotation (RFQ) for STM32H725IGK3TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STM32H725IGK3TR reliable?

The price and inventory of STM32H725IGK3TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32H725IGK3TR is usually 5 days.

3.What payment methods are accepted for STM32H725IGK3TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32H725IGK3TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STM32H725IGK3TR?

STM32H725IGK3TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STM32H725IGK3TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STM32H725IGK3TR?

For technical support, including STM32H725IGK3TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32H725IGK3TR requirements.

6.How does Aetrix verify that STM32H725IGK3TR is sourced from the original manufacturer or authorized distributors?

All STM32H725IGK3TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32H725IGK3TR meets industry standards.

7.What is the process for return or replacement of STM32H725IGK3TR?

All STM32H725IGK3TR units undergo pre-shipment inspection (PSI). If there is an issue with STM32H725IGK3TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STM32H725IGK3TR part is unused and in its original packaging.

Return procedure for STM32H725IGK3TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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