STMicroelectronics STM32H725RGV3TR
- Part No.:
- STM32H725RGV3TR
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- 68-VFQFN Exposed Pad
- Datasheet:
-
STM32H725RGV3TR.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 68VFQFPN
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
STM32H725RGV3TR from STMicroelectronics is a high-performance Arm® Cortex®-M7 32-bit microcontroller operating at up to 550 MHz, featuring 1 MB flash with ECC, 564 KB SRAM (all with ECC), dual 16-bit ADCs (3.6 MSPS), Ethernet MAC, USB 2.0 HS/FS OTG, and three FD-CAN interfaces. It targets industrial HMI, motor control gateways, and real-time edge nodes requiring deterministic execution, graphics acceleration, and multi-protocol connectivity.
For engineers reviewing the STM32H725RGV3TR datasheet, STM32H725RGV3TR pinout, STM32H725RGV3TR application, or STM32H725RGV3TR equivalent, key selection considerations include its VFQFPN68 package, integrated DCDC regulator, dual TCM RAM architecture, and hardware accelerators (CORDIC, FMAC, Chrom-ART) for computationally intensive signal and graphics processing.
Technical Context
This MCU implements a dual-bank Arm Cortex-M7 core with 32-KB instruction and 32-KB data L1 caches, enabling zero-wait-state execution from flash or external memory. Its memory subsystem includes 128 KB data TCM RAM for time-critical variables and up to 256 KB instruction TCM RAM remapping capability - both with ECC protection.
The peripheral set integrates three FD-CAN controllers compliant with ISO 11898-1:2015, an Ethernet MAC with DMA, two SAI audio interfaces, and a 16-bit parallel slave synchronous interface (PSSI). Clock management supports multiple PLLs, including dedicated audio and USB PLLs, plus internal oscillators (64 MHz HSI, 48 MHz HSI48, 4 MHz CSI, 32 kHz LSI).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M7 with DP-FPU, 550 MHz max frequency, 1177 DMIPS performance |
| Flash Memory | 1 MB embedded flash with ECC - ensures integrity in safety-critical firmware storage |
| SRAM | 564 KB total SRAM with full ECC: 128 KB data TCM + 432 KB system RAM + 4 KB backup SRAM |
| Analog Peripherals | 2× 16-bit ADCs (3.6 MSPS), 1× 12-bit ADC (5 MSPS), 2× op-amps (8 MHz GBW), 2× DACs |
| Communication | 3× FD-CAN, Ethernet MAC, USB 2.0 HS/FS OTG, 5× USART/UART, 5× I²C, 6× SPI, 2× SAI, SPDIFRX |
| Graphics & Timing | Chrom-ART Accelerator (DMA2D), LCD-TFT controller (XGA), CORDIC/FMAC math accelerators |
| Package | VFQFPN68 (8 × 8 mm, 0.4 mm pitch) - compact footprint with exposed thermal pad for thermal management |
Pinout & Package
VFQFPN68 (8 × 8 mm, 0.4 mm pitch) with exposed thermal pad (EPAD); RoHS-compliant ECOPACK2 packaging optimized for thermal dissipation and board space efficiency in industrial and automotive-adjacent applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDIO2 | Power supply inputs | Dedicated domains: VDD (core/digital), VDDA (analog), VDDIO2 (I/O bank 2) - enable independent voltage scaling and noise isolation |
| VSS, VSSA, VSSIO2 | Ground returns | Separate analog/digital/IO ground paths minimize coupling noise in mixed-signal operation |
| NRST | Active-low reset input | Asynchronous reset with internal pull-up; supports external reset supervision and brown-out recovery |
| BOOT0 | Boot mode selection | Configures boot source (system memory, embedded flash, or FMC) at power-on reset |
| PA13/PA14 | SWD debug interface | Standard 2-pin Serial Wire Debug (SWD) for programming and real-time trace via embedded 2-KB ETB |
| PD0/PD1 | OSC_IN/OSC_OUT | Connects to external 4–50 MHz crystal for high-precision clock generation and jitter-sensitive peripherals |
| PC12 | ETH_MDC | Ethernet MAC management data clock - enables IEEE 802.3-compliant PHY configuration and status polling |
| PG13 | FDCAN3_RX | FD-CAN 3 receive channel - supports CAN FD frames up to 5 Mbit/s with flexible data length and error confinement |
Key Features
| Feature | Design Value |
|---|---|
| L1 cache + ECC memory | 32-KB instruction + 32-KB data cache + full ECC on all 564 KB SRAM - enables ASIL-B-capable deterministic execution and fault resilience |
| Hardware math acceleration | CORDIC coprocessor for real-time trigonometric computation and FMAC for FIR/IIR filter execution - offloads CPU in motor control and sensor fusion |
| Graphics acceleration | Chrom-ART Accelerator (DMA2D) - enables smooth 2D GUI rendering (blending, rotation, alpha blending) without CPU intervention |
| Dual TCM architecture | 128 KB data TCM + configurable instruction TCM - guarantees sub-microsecond access latency for real-time control loops and interrupt handlers |
| FD-CAN triple redundancy | Three independent FD-CAN controllers - supports multi-bus automotive diagnostics, gateway routing, and functional safety communication layers |
Applications
| Industrial HMI Gateway | Real-Time Motor Control Edge Node |
|---|---|
Use Scenario: Standalone panel PC controlling PLC I/O, displaying live process data, and bridging Modbus TCP to CANopen networks. IC Role / Device Role / Timing Role: Primary application processor managing GUI rendering, protocol translation, and real-time motion profiling via hardware-accelerated math units. Use Value: Dual TCM RAM and Chrom-ART enable 60 FPS UI updates while running 20 kHz PWM motor control loops concurrently - no frame drops or timing jitter. | Use Scenario: Compact servo drive performing field-oriented control (FOC), current sensing, and position feedback over EtherCAT and CAN FD. IC Role / Device Role / Timing Role: Real-time control unit executing FOC algorithms with sub-1 µs interrupt latency using data TCM and hardware CORDIC/FMAC. Use Value: Integrated 16-bit ADCs (3.6 MSPS) sample dual shunt currents simultaneously; FD-CAN handles safety-critical torque commands with guaranteed 50 µs end-to-end latency. |
| Smart Building HVAC Controller | Medical Imaging Front-End |
Use Scenario: Networked HVAC controller aggregating sensor data (temp, CO₂, humidity), running PID optimization, and communicating via BACnet/IP and LonWorks. IC Role / Device Role / Timing Role: System-on-chip integrating Ethernet MAC, USB device stack, and multi-protocol serial interfaces for legacy building system integration. Use Value: Embedded DCDC regulator reduces external BOM count; 564 KB ECC SRAM stores encrypted firmware images and runtime logs across power cycles. | Use Scenario: Portable ultrasound front-end digitizing RF echo signals, applying beamforming, and streaming processed image data to display subsystem. IC Role / Device Role / Timing Role: Signal processing hub interfacing with high-speed ADCs, running real-time DSP kernels via FMAC, and driving TFT display via LTDC. Use Value: Octo-SPI XiP allows direct code execution from external flash; Chrom-ART renders grayscale ultrasound frames at 30 fps with zero CPU load on display pipeline. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32H723ZGT6 | No Ethernet MAC; 1 MB flash, same 550 MHz M7 core, identical VFQFPN68 package | Suitable for CAN/USB-based edge nodes where Ethernet is not required | Select when eliminating Ethernet PHY reduces cost and PCB complexity without sacrificing compute or analog capability |
| STM32H735IGK6 | Higher 600 MHz CPU, 2 MB flash, 1 MB SRAM, adds TrustZone security; UFBGA176+25 package | Targeted at secure boot, encrypted OTA updates, and higher memory footprint applications | Choose when cryptographic acceleration, larger code space, and security certification (e.g., PSA Level 2) are mandatory |
Compared with STM32H723ZGT6, the STM32H725RGV3TR adds Ethernet MAC and retains identical FD-CAN count and analog performance; versus STM32H735IGK6, it trades TrustZone and extra memory for smaller VFQFPN68 footprint and lower power consumption in non-security-critical deployments.
Availability
STM32H725RGV3TR is available at Aetrix Electronics and suitable for industrial HMI, motor control gateways, and smart building controllers requiring stable component supply, long-term lifecycle support, and consistent ECOPACK2 compliance.
Supply support for STM32H725RGV3TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, sensors, and analog devices for industrial, automotive, and consumer markets.
The STM32H7 series targets high-end embedded applications demanding real-time determinism, rich connectivity, and hardware-accelerated signal processing - specifically engineered for industrial automation, medical devices, and advanced human-machine interfaces.
FAQ
Does STM32H725RGV3TR support TrustZone security?
No. STM32H725RGV3TR does not include Arm TrustZone technology. Security features are limited to ROP/PC-ROP, tamper detection, 96-bit unique ID, and hardware RNG. For TrustZone-enabled variants, consider the STM32H735 or STM32H745/755 families, which integrate secure execution environments and cryptographic accelerators.
What is the maximum operating temperature for this VFQFPN68 variant?
The STM32H725RGV3TR in VFQFPN68 package is rated for industrial temperature range: –40 °C to +85 °C ambient. Thermal performance is validated per JEDEC JESD51 standards with the exposed thermal pad soldered to PCB copper; junction temperature must remain ≤125 °C under worst-case power dissipation conditions.
Can the internal DCDC regulator power both core and I/O domains?
Yes. The embedded SMPS (step-down DCDC) supplies VDD_CORE and can be configured to also power VDDIO2 (I/O bank 2) in VFQFPN68 variants. This reduces external power components and improves efficiency - especially critical in battery-powered or thermally constrained designs where >85% conversion efficiency is required at 100–500 mA loads.
Is the 16-bit ADC capable of simultaneous sampling across all channels?
No. While the dual 16-bit ADCs support interleaved mode (7.2 MSPS aggregate), simultaneous sampling is limited to up to 22 channels across both converters - not all 22 channels sampled at identical timestamps. True simultaneous sampling requires external synchronization via ADCx_EXTSEL and precise trigger alignment, achievable only on selected channel pairs (e.g., ADC1_IN0/ADC2_IN0).
STM32H725RGV3TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 68-VFQFN Exposed Pad
- Series:
- STM32H7
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M7
- Core Size:
- 32-Bit
- Speed:
- 550MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, IrDA, LINbus, MDIO, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, SWPMI, UART/USART, USB OTG
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
- Number of I/O:
- 46
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 564K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 28x12/16b; D/A 2x12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
STM32H725RGV3TR FAQ
1.How can I place an order for STM32H725RGV3TR through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32H725RGV3TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32H725RGV3TR reliable?
The price and inventory of STM32H725RGV3TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32H725RGV3TR is usually 5 days.
3.What payment methods are accepted for STM32H725RGV3TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32H725RGV3TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STM32H725RGV3TR?
STM32H725RGV3TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32H725RGV3TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32H725RGV3TR?
For technical support, including STM32H725RGV3TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32H725RGV3TR requirements.
6.How does Aetrix verify that STM32H725RGV3TR is sourced from the original manufacturer or authorized distributors?
All STM32H725RGV3TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32H725RGV3TR meets industry standards.
7.What is the process for return or replacement of STM32H725RGV3TR?
All STM32H725RGV3TR units undergo pre-shipment inspection (PSI). If there is an issue with STM32H725RGV3TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32H725RGV3TR part is unused and in its original packaging.
Return procedure for STM32H725RGV3TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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