STMicroelectronics STM32H725VGH3
- Part No.:
- STM32H725VGH3
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- 100-TFBGA
- Datasheet:
-
STM32H725VGH3.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 100TFBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
STM32H725VGH3 from STMicroelectronics is a high-performance Arm® Cortex®-M7 32-bit microcontroller operating at up to 550 MHz, featuring 1 MB flash with ECC, 564 KB SRAM (all with ECC), dual 16-bit ADCs delivering up to 3.6 MSPS, and integrated FD-CAN, Ethernet MAC, USB HS/FS OTG, and Chrom-ART Accelerator. It targets real-time industrial HMI, motor control gateways, and edge AI inference nodes requiring deterministic execution and graphics acceleration.
For engineers reviewing the STM32H725VGH3 datasheet, STM32H725VGH3 pinout, STM32H725VGH3 application, or STM32H725VGH3 equivalent, key selection criteria include its dual-core-ready memory architecture (TCM RAM + system RAM remapping), hardware math accelerators (CORDIC/FMAC), 2×16-bit ADC interleaving capability, and VFQFPN68 package with 68-pin I/O mapping for space-constrained industrial controllers.
Technical Context
The STM32H725VGH3 implements a single Arm Cortex-M7 core with double-precision FPU, L1 cache (32 KB I-cache + 32 KB D-cache), and MPU - enabling zero-wait-state execution from flash and external memories. Its memory subsystem includes 128 KB data TCM RAM for time-critical variables and up to 256 KB system RAM remappable to instruction TCM for latency-sensitive code.
Real-time peripheral integration includes three FD-CAN controllers supporting ISO 11898-1:2015, an Ethernet MAC with DMA, two SAI audio interfaces, and dual 16-bit ADCs capable of 7.2 MSPS in interleaved mode. Clock management uses dual PLLs (main and audio) plus internal oscillators (64 MHz HSI, 48 MHz HSI48, 4 MHz CSI, 32 kHz LSI) and external crystal support (4–50 MHz HSE).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M7 @ 550 MHz with DP-FPU, L1 cache (32 KB I/D), MPU, 1177 DMIPS |
| Flash Memory | 1 MB embedded flash with ECC - ensures firmware integrity in safety-critical updates |
| SRAM | 564 KB total: 128 KB data TCM + 432 KB system RAM (up to 256 KB remappable to I-TCM) |
| ADC Performance | 2×16-bit ADCs, 3.6 MSPS per channel; 7.2 MSPS in double-interleaved mode for synchronized sampling |
| Communication | 3× FD-CAN, 1× Ethernet MAC, 1× USB 2.0 HS/FS OTG, 5× USART, 6× SPI, 2× SAI, 2× I2C FM+ |
| Analog Peripherals | 2× op-amps (GBW = 8 MHz), 2× comparators, 2×12-bit DACs, DFSDM (8-channel sigma-delta filter) |
| Package | VFQFPN68 (8 × 8 mm, 0.4 mm pitch) - compact footprint with thermal pad for industrial convection cooling |
Pinout & Package
VFQFPN68 (8 × 8 mm, 0.4 mm pitch) with exposed thermal pad; RoHS-compliant ECOPACK2 packaging optimized for thermal dissipation in enclosed industrial enclosures.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Core power supply / ground | 1.62–3.6 V operation; multiple VDD/VSS pairs ensure low-noise analog/digital separation |
| VCAP_1, VCAP_2 | Internal SMPS decoupling | Requires 2.2 µF X7R ceramic capacitors close to pins for stable DCDC regulator output |
| PA0–PA15, PB0–PB15, etc. | General-purpose I/O | Up to 128 GPIOs with interrupt capability; most support multiple alternate functions (SPI/I2C/USART/CAN) |
| PH0, PH1 | HSE oscillator input/output | Supports 4–50 MHz external crystal; essential for Ethernet timing and USB clock recovery |
| PD0, PD1 | OSC_IN/OSC_OUT (LSE) | 32.768 kHz crystal connection for RTC calendar and low-power wake-up timing |
| PA12, PA11 | USB_DM/USB_DP | Integrated full-speed PHY - no external transceiver needed for FS device/host operation |
| PC1, PC4, PC5 | ETH_MDC, ETH_MDIO, ETH_CRS_DV | Direct MDIO interface to external PHY; supports IEEE 802.3u auto-negotiation |
| PB8, PB9 | FDCAN1_TX, FDCAN1_RX | Dedicated FD-CAN transceiver interface compliant with ISO 11898-1:2015 up to 5 Mbps |
Key Features
| Feature | Design Value |
|---|---|
| Chrom-ART Accelerator (DMA2D) | Hardware-accelerated 2D graphics blitting and layer composition - reduces CPU load by >70% in GUI rendering |
| CORDIC coprocessor | Hardware trigonometric computation (sin/cos/atan) - enables real-time motor FOC without software overhead |
| FMAC filter accelerator | Configurable FIR/IIR filtering engine - offloads DSP-intensive signal conditioning from main CPU |
| Dual 16-bit ADC interleaving | 7.2 MSPS simultaneous sampling across 22 channels - supports multi-axis current/voltage monitoring in servo drives |
| Flexible memory controller (FMC) | Supports NOR/NAND/PSRAM/SDRAM up to 24-bit bus - enables external program/data storage for OTA firmware |
Applications
| Industrial Motor Control Gateway | Edge-AI Vision Node |
|---|---|
Use Scenario: Real-time field-oriented control (FOC) of 3-phase PMSM motors with dual current sensing and thermal monitoring. IC Role / Device Role / Timing Role: Primary MCU executing FOC loop at ≤10 µs intervals, managing CAN FD communication to PLC, and driving local HMI via LCD-TFT controller. Use Value: Integrated 16-bit ADC interleaving and CORDIC enable sub-microsecond angle calculation; TCM RAM guarantees deterministic ISR latency. |
Use Scenario: Low-latency image preprocessing (edge detection, histogram equalization) on 720p camera feed before neural network inference. IC Role / Device Role / Timing Role: Preprocessing engine using Chrom-ART for pixel format conversion and FMAC for convolution kernels, feeding feature vectors to external AI accelerator. Use Value: Hardware-accelerated DMA2D and FMAC reduce preprocessing latency by 4× vs. pure-CPU implementation; Octo-SPI XiP allows direct code execution from external flash. |
| Smart Building BMS Controller | Automotive Diagnostic Tool |
Use Scenario: Multi-protocol building automation node interfacing HVAC, lighting, and fire alarm systems over BACnet/IP and Modbus TCP. IC Role / Device Role / Timing Role: Network gateway with dual Ethernet ports (one for upstream IP backbone, one for local fieldbus), FD-CAN for legacy equipment bridging, and USB OTG for configuration. Use Value: Integrated Ethernet MAC + FD-CAN + USB eliminates need for external protocol bridges; 564 KB ECC RAM ensures robust multitasking under concurrent network stacks. |
Use Scenario: Handheld OBD-II diagnostic tool supporting UDS, DoIP, and CAN FD diagnostics for EV battery management systems. IC Role / Device Role / Timing Role: Protocol translator between USB host (tablet/PC) and vehicle FD-CAN networks, performing real-time session control and secure flashing. Use Value: Triple FD-CAN controllers allow simultaneous communication with battery pack, inverter, and charger ECUs; HSI48 oscillator provides accurate USB frame timing without external crystal. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance Cortex-M7 microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32H735VGT6 | Same VFQFPN68 package, identical peripherals, but adds AES/SHA crypto accelerators and 2 MB flash | Better suited for secure firmware updates and TLS stack offload in cloud-connected devices | Select when cryptographic acceleration and larger code space are required; otherwise, STM32H725VGH3 offers cost-optimized performance |
| STM32H723VGT6 | Omits Ethernet MAC, USB HS, and Chrom-ART; retains same CPU, memory, ADC, and FD-CAN capabilities | Targeted at cost-sensitive motor control or sensor fusion where networking and graphics are unnecessary | Choose for non-networked embedded control where reduced BOM cost and simpler layout justify feature reduction |
Compared with STM32H735VGT6, the STM32H725VGH3 trades crypto acceleration and extra flash for lower unit cost and identical real-time control capability; versus STM32H723VGT6, it adds critical Ethernet and USB HS connectivity for gateway-class designs without increasing package size.
Availability
STM32H725VGH3 is available at Aetrix Electronics and suitable for industrial motor control gateways, edge-AI vision nodes, and smart building BMS controllers requiring stable component supply across multi-year production cycles.
Supply support for STM32H725VGH3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power ICs, sensors, and automotive-grade components with emphasis on energy efficiency and industrial reliability.
The STM32H7 series targets high-end embedded applications demanding real-time determinism, rich connectivity, and hardware-accelerated signal processing - specifically engineered for industrial automation, medical devices, and automotive body electronics.
FAQ
What is the maximum operating frequency and core type of the STM32H725VGH3?
The STM32H725VGH3 features a single Arm Cortex-M7 core running at up to 550 MHz with double-precision FPU, L1 instruction and data caches (32 KB each), and memory protection unit. It achieves 1177 DMIPS at 550 MHz (2.14 DMIPS/MHz) per Dhrystone 2.1 benchmark, with zero-wait-state execution from embedded flash due to cache architecture.
Does the STM32H725VGH3 support hardware encryption or secure boot?
No - the STM32H725VGH3 does not integrate AES, SHA, or PKA cryptographic accelerators, nor does it support hardware-based secure boot. Secure boot must be implemented in software using the embedded ROM bootloader and external trusted elements. For hardware crypto, consider the pin-compatible STM32H735VGT6 or STM32H753VIH6.
What are the supported debug interfaces and trace capabilities?
The STM32H725VGH3 supports both SWD and JTAG debug interfaces. It includes a 2 KB embedded trace buffer (ETB) for instruction and data trace, compatible with ARM CoreSight tools. Debug access is enabled via dedicated SWCLK/SWDIO pins (PA14/PA13) or JTAG pins (JTCK/JTMS/JTDI/JTDO/nTRST), with full support for real-time variable watch and flash programming.
How is the power supply configured for the embedded DCDC regulator?
The STM32H725VGH3's embedded SMPS operates in VFQFPN68 packages only and requires two 2.2 µF X7R ceramic capacitors on VCAP_1 and VCAP_2 pins. Input voltage range is 1.62–3.6 V; the DCDC outputs 1.25 V for core logic. External LDO mode is disabled in this variant - the DCDC must be used, and proper PCB layout (short traces, solid ground plane) is mandatory for stability.
STM32H725VGH3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 100-TFBGA
- Series:
- STM32H7
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M7
- Core Size:
- 32-Bit
- Speed:
- 550MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MDIO, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, SWPMI, UART/USART, USB OTG
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
- Number of I/O:
- 74
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 564K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.62V ~ 3.6V
- Data Converters:
- A/D 43x12/16b; D/A 2x12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
STM32H725VGH3 FAQ
1.How can I place an order for STM32H725VGH3 through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32H725VGH3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32H725VGH3 reliable?
The price and inventory of STM32H725VGH3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32H725VGH3 is usually 5 days.
3.What payment methods are accepted for STM32H725VGH3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32H725VGH3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STM32H725VGH3?
STM32H725VGH3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32H725VGH3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32H725VGH3?
For technical support, including STM32H725VGH3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32H725VGH3 requirements.
6.How does Aetrix verify that STM32H725VGH3 is sourced from the original manufacturer or authorized distributors?
All STM32H725VGH3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32H725VGH3 meets industry standards.
7.What is the process for return or replacement of STM32H725VGH3?
All STM32H725VGH3 units undergo pre-shipment inspection (PSI). If there is an issue with STM32H725VGH3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32H725VGH3 part is unused and in its original packaging.
Return procedure for STM32H725VGH3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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