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STMicroelectronics STM32H747BGT6

Part No.:
STM32H747BGT6
Manufacturer:
STMicroelectronics
Category:
Microcontrollers
Package:
208-LQFP
Datasheet:
AetrixSTM32H747BGT6.pdf
Description:
IC MCU 32BIT 1MB FLASH 208LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,592

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Product details

Overview

STM32H747BGT6 from STMicroelectronics is a dual-core 32-bit Arm® Cortex®-M7 (up to 480 MHz) and Cortex®-M4 (up to 240 MHz) microcontroller with double-precision FPU, 2 MB flash, 1 MB RAM (including 192 KB TCM), and integrated SMPS regulator. It supports DSI display interface, Ethernet MAC, dual CAN FD, and hardware JPEG codec - deployed in industrial HMI, medical imaging front-ends, and real-time motor control systems.

For engineers reviewing the STM32H747BGT6 datasheet, STM32H747BGT6 pinout, STM32H747BGT6 application, or STM32H747BGT6 equivalent, key selection factors include dual-core asymmetric execution capability, on-chip SMPS power architecture, DSI host + LTDC graphics pipeline, and deterministic low-latency peripheral routing via AXI/AHB interconnect matrix.

Technical Context

The device implements a true heterogeneous dual-core architecture: the M7 core handles high-throughput tasks (e.g., image processing, protocol stacks) with L1 cache (16 KB I-Cache + 16 KB D-Cache) and 1027 DMIPS performance, while the M4 core manages real-time control loops and sensor fusion with ART Accelerator for zero-wait-state flash execution. Both cores operate independently with separate memory maps and privilege domains.

Its power architecture features three isolated voltage domains (D1/D2/D3), an embedded SMPS step-down converter (supporting direct VCORE supply), and dynamic voltage scaling across six ranges - enabling sub-3 µA standby current (RTC/LSE active, Backup SRAM off) and precise energy budgeting per subsystem.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture Dual Arm® Cortex®-M7 (480 MHz) + Cortex®-M4 (240 MHz), each with FPU, MPU, and independent cache
Memory 2 MB flash (read-while-write), 1 MB RAM: 192 KB TCM (64 KB ITCM + 128 KB DTCM), 864 KB user SRAM, 4 KB backup SRAM
Graphics Interface MIPI DSI host with integrated D-PHY, LCD-TFT controller (XGA resolution), Chrom-ART DMA2D accelerator, hardware JPEG codec
Power Management Integrated SMPS step-down converter + LDO; 3 independent power domains (D1/D2/D3); 6-range voltage scaling; 2.95 µA Standby current
Analog Peripherals 3× 16-bit ADCs (3.6 MSPS total), 2× 12-bit DACs (1 MHz), 2× op-amps (7.3 MHz GBW), 2× ultra-low-power comparators, DFSDM (8-channel sigma-delta filter)
Communication 2× USB OTG (FS/HS), 2× CAN FD + 1× TT-CAN, 2× SDIO/MMC (125 MHz), 4× USART/UART + 1× LPUART, 4× I2C FM+, 6× SPI (incl. Quad-SPI), SPDIFRX, SWPMI, MDIO, HDMI-CEC
Timers & Control 1× HRTIM (2.1 ns resolution), 2× advanced motor-control timers, 10× general-purpose 16-bit timers, 5× low-power timers, RTC with sub-second accuracy

Pinout & Package

STM32H747BGT6 is housed in a 169-ball UFBGA package (7 × 7 mm, 0.65 mm pitch), compliant with ECOPACK2 environmental standards. Pin functions are defined across five voltage domains (VDD/VSS, VDDA/VSSA, VREF+/VREF–, VCAP, VBAT) and support multiple alternate functions per pin via flexible remapping.

Pin/Terminal Circuit Role Design Meaning
VDD, VSS Core power supply / ground Primary 1.62–3.6 V digital domain supply; 16 dedicated pairs ensure low-noise operation for dual-core logic
VDDA, VSSA Analog power supply / ground Independent 1.62–3.6 V analog domain supply; decoupled from digital rails to preserve ADC/DAC SNR
VREF+, VREF– Analog reference input External precision reference inputs for ADC/DAC; enable ratiometric measurement or calibrated absolute conversion
VCAP Core regulator bypass capacitor terminal Connects to external 2.2 µF ceramic capacitor for internal SMPS/LDO stability; critical for startup and transient response
VBAT Backup domain supply Accepts 1.2–3.6 V battery or supercap; powers RTC, backup SRAM, and tamper detection during main power loss
NRST Active-low reset input Asynchronous reset pin with internal pull-up; triggers system-wide reset including both cores and peripherals
BOOT0 Boot mode selection Configures boot source (system memory, embedded flash, or FMC) at power-on; sampled during reset release

Key Features

Feature Design Value
Heterogeneous dual-core execution Enables concurrent real-time control (M4) and high-bandwidth data processing (M7) without OS-level scheduling overhead
Integrated SMPS regulator Reduces external BOM count by eliminating discrete DC-DC; supports direct VCORE supply and >85% efficiency at 1 A load
DSI host + LTDC controller Drives MIPI D-PHY-based displays up to XGA (1024×768) with hardware-accelerated layer composition and alpha blending
ART Accelerator + L1 cache Eliminates flash wait states for M4 code execution and enables deterministic interrupt latency (<12 cycles) for time-critical routines
Dual-domain power management Allows selective shutdown of D1 (M7), D2 (peripherals), or D3 (power control) to achieve granular energy optimization per use case

Applications

Industrial HMI Terminal Medical Imaging Front-End

Use Scenario: Touch-enabled diagnostic display with real-time waveform rendering and DICOM metadata overlay.

IC Role / Device Role / Timing Role: STM32H747BGT6 acts as display controller and image preprocessor - receiving raw sensor data via DCMI, compressing frames with hardware JPEG codec, and driving high-resolution DSI panels via LTDC+DMA2D.

Use Value: Dual-core isolation ensures UI responsiveness (M4) while M7 handles pixel pipeline without frame drops; DSI PHY timing compliance guarantees stable 1024×768@60Hz output.

Use Scenario: Portable ultrasound probe with beamforming preprocessing and local image buffering before wireless transmission.

IC Role / Device Role / Timing Role: Acts as acquisition engine - synchronizing multi-channel ADC sampling (3.6 MSPS aggregate), applying FIR filtering via DFSDM, and managing DDR3 buffer via FMC for burst capture.

Use Value: On-chip SMPS enables battery-powered operation with <3 µA standby; dual ADCs support simultaneous RF/IQ path digitization; hardware JPEG reduces host-side compression load.

Automotive ADAS Camera Node Programmable Logic Controller (PLC) Edge Gateway

Use Scenario: Rear-view camera module with lane detection, object classification, and HDMI-CEC-triggered display wake-up.

IC Role / Device Role / Timing Role: Performs vision preprocessing (DCMI input → YUV conversion → edge detection) and protocol bridging (CAN FD to HDMI-CEC) using dedicated peripherals and dual-core task partitioning.

Use Value: Hardware-accelerated chroma subsampling and CEC message generation reduce CPU load; CAN FD interfaces meet ISO 11898-1:2015 timing requirements for automotive networks.

Use Scenario: DIN-rail mounted gateway aggregating Modbus RTU, EtherNet/IP, and fieldbus I/O in factory automation.

IC Role / Device Role / Timing Role: Serves as protocol translator and real-time scheduler - running EtherNet/IP stack on M7 while M4 handles deterministic I/O scanning and watchdog supervision.

Use Value: Dual Ethernet MAC + dual CAN FD enables redundant network paths; 168 GPIOs support hot-swappable I/O modules; voltage scaling maintains timing integrity across ambient temperature shifts.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core Arm MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
STM32H757BIT6 Same dual-core architecture and pinout, but adds cryptographic accelerators (AES-256, PKA, HASH) and secure boot ROM Required where firmware authenticity, OTA update signing, or data-at-rest encryption are mandated (e.g., IIoT gateways) Select when security certification (IEC 62443, Common Criteria) is required; otherwise, STM32H747BGT6 offers lower cost and identical real-time performance
NXP i.MX RT1176DVMAA Single Cortex-M7 core (1 GHz) + Cortex-M4 (400 MHz); no integrated SMPS; larger 256-pin BGA; lacks DSI and LTDC Better suited for Linux-capable edge AI inference (e.g., TensorFlow Lite Micro) but requires external PMIC and display bridge ICs Choose for higher single-thread compute throughput and external DDR4 support; avoid if DSI-native display or SMPS integration are design constraints

Compared with STM32H757BIT6, the STM32H747BGT6 trades hardware crypto for lower BOM cost and identical graphics/peripheral integration; versus i.MX RT1176DVMAA, it delivers superior display subsystem integration and power efficiency at the expense of peak M7 clock speed and external memory bandwidth.

Availability

STM32H747BGT6 is available at Aetrix Electronics and suitable for industrial HMI terminals, medical imaging front-ends, automotive ADAS camera nodes, and programmable logic controller edge gateways requiring stable component supply across extended product lifecycles.

Supply support for STM32H747BGT6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in microcontrollers, power management, sensors, and automotive ICs with over 40 years of industrial-grade reliability validation.

The STM32H7 series targets high-performance embedded applications demanding real-time determinism, rich graphics, and energy-aware operation - designed specifically for next-generation industrial control, medical devices, and automotive infotainment systems.

FAQ

What is the maximum operating frequency of each core in the STM32H747BGT6?

The Cortex-M7 core runs at up to 480 MHz with double-precision FPU and L1 cache enabled, delivering 1027 DMIPS; the Cortex-M4 core operates at up to 240 MHz with single-precision FPU and ART Accelerator, achieving 300 DMIPS. Both frequencies are validated under full voltage scaling range 1 (Vcore = 1.32 V) and ambient temperature ≤85°C per DS12930 Rev 3 Section 6.3.14.

Does the STM32H747BGT6 support hardware JPEG encoding and decoding?

Yes - it integrates a dedicated hardware JPEG codec capable of real-time encoding and decoding of YUV422 and RGB565 formats up to 1024×768 resolution. The codec operates independently of both CPU cores, uses DMA for memory transfers, and supports quantization table customization per application requirement as specified in Section 3.27 of the datasheet.

How many power domains does the STM32H747BGT6 have, and what do they control?

The device implements three independent power domains: D1 (high-performance domain hosting Cortex-M7, AXI bus, and GPU-related peripherals), D2 (communication and timer domain with Cortex-M4, USB, CAN, Ethernet), and D3 (low-power domain containing reset/clock/power management logic and RTC). Each domain supports individual clock gating and power switching per Section 3.5.1.

What display interfaces are supported natively without external bridge ICs?

The STM32H747BGT6 natively supports MIPI DSI via its integrated D-PHY physical layer and LCD-TFT controller (LTDC) for direct connection to DSI-compatible panels up to XGA resolution. It also supports parallel RGB (via LTDC) and 8-/16-bit Intel 8080/6800 bus interfaces. No external bridge IC is needed for DSI or RGB output - only passive termination and timing-critical layout adherence per Section 3.26.

STM32H747BGT6 Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Package/Case:
208-LQFP
Series:
STM32H7
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4/M7
Core Size:
32-Bit Dual-Core
Speed:
240MHz, 480MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MDIO, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, SWPMI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
148
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
1M x 8
Voltage - Supply (Vcc/Vdd):
1.62V ~ 3.6V
Data Converters:
A/D 32x16b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

STM32H747BGT6 FAQ

1.How can I place an order for STM32H747BGT6 through Aetrix?

Please submit a Request for Quotation (RFQ) for STM32H747BGT6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STM32H747BGT6 reliable?

The price and inventory of STM32H747BGT6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32H747BGT6 is usually 5 days.

3.What payment methods are accepted for STM32H747BGT6?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32H747BGT6 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STM32H747BGT6?

STM32H747BGT6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STM32H747BGT6 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STM32H747BGT6?

For technical support, including STM32H747BGT6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32H747BGT6 requirements.

6.How does Aetrix verify that STM32H747BGT6 is sourced from the original manufacturer or authorized distributors?

All STM32H747BGT6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32H747BGT6 meets industry standards.

7.What is the process for return or replacement of STM32H747BGT6?

All STM32H747BGT6 units undergo pre-shipment inspection (PSI). If there is an issue with STM32H747BGT6, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STM32H747BGT6 part is unused and in its original packaging.

Return procedure for STM32H747BGT6:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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