STMicroelectronics STM32H747XGH6
- Part No.:
- STM32H747XGH6
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- 265-TFBGA
- Datasheet:
-
STM32H747XGH6.pdf
- Description:
- IC MCU 32BIT 1MB FLASH TFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,638
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Product details
Overview
STM32H747XGH6 from STMicroelectronics is a dual-core 32-bit Arm® Cortex®-M7 (up to 480 MHz) and Cortex®-M4 (up to 240 MHz) microcontroller with double-precision FPU, 2 MB flash, 1 MB RAM (including 192 KB TCM), and integrated SMPS regulator. It supports DSI display interface, Ethernet MAC, dual CAN FD, and hardware JPEG codec - deployed in industrial HMI, medical imaging gateways, and real-time motor control systems.
For engineers reviewing the STM32H747XGH6 datasheet, STM32H747XGH6 pinout, STM32H747XGH6 application, or STM32H747XGH6 equivalent, key selection criteria include dual-core asymmetric execution capability, 168 GPIOs with interrupt support, voltage scaling across 6 ranges, 2.95 µA standby current, and UFBGA169 package compatibility with high-density PCB layouts.
Technical Context
The device implements three independent power domains (D1/D2/D3) enabling selective clock gating and domain shutdown for fine-grained power management. Its interconnect architecture includes one AXI and two AHB bus matrices with five AHB2-APB and two AXI2-AHB bridges, supporting concurrent high-bandwidth peripheral access without CPU contention.
Dual-core operation is coordinated via shared memory with hardware semaphores and mailbox registers; the M7 core handles compute-intensive tasks (e.g., JPEG decode, FFT), while the M4 executes real-time control loops (e.g., PWM timing, ADC sampling) with deterministic latency under ART Accelerator-enabled flash execution.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Cores | Dual Arm® Cortex®-M7 @ 480 MHz + Cortex®-M4 @ 240 MHz, each with FPU and MPU for safety-critical partitioning |
| Memory | 2 MB flash (read-while-write), 1 MB RAM: 192 KB TCM (64 KB ITCM + 128 KB DTCM), 864 KB user SRAM, 4 KB backup SRAM |
| Power Management | SMPS step-down converter + LDO; 6 voltage scaling ranges in Run/Stop modes; 2.95 µA Standby (RTC/LSE ON, Backup SRAM OFF) |
| Peripherals | 2× CAN FD, 2× USB OTG (HS/FS + FS), Ethernet MAC, MIPI DSI host, LCD-TFT controller, JPEG codec, DFSDM, 3× 16-bit ADCs (3.6 MSPS) |
| Package | UFBGA169 (7 × 7 mm, 0.65 mm pitch), ECOPACK2-compliant, 168 I/Os with interrupt capability |
| Clock System | 3× PLLs (fractional), internal 64 MHz HSI/48 MHz HSI48/4 MHz CSI/32 kHz LSI, external 4–48 MHz HSE/32.768 kHz LSE |
| Analog | 2× 12-bit DACs (1 MHz), 2× op-amps (7.3 MHz GBW), 2× ultra-low-power comparators, temperature sensor, VREF+ buffer |
Pinout & Package
UFBGA169 package (7 × 7 mm, 0.65 mm ball pitch) with 168 functional I/O balls and dedicated power/ground balls. Pinout validated per STMicroelectronics DS12930 Rev 3, Section 5 (Pinout, pin description and alternate functions).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDIO2 | Core/analog/I/O supply rails | Independent 1.62–3.6 V domains enable mixed-signal isolation and dynamic voltage scaling |
| VCAP_1, VCAP_2 | Core regulator bypass capacitors | Required 2.2 µF ceramic caps per pin for SMPS/LDO stability; placement within 1 mm of ball critical |
| NRST | Active-low reset input | Asynchronous reset with internal pull-up; supports external debounced pushbutton or supervisor IC |
| BOOT0 | Boot mode selection | High at power-up enables system memory bootloader; low selects main flash; sampled once at reset release |
| PA0–PA15, PB0–PB15, etc. | General-purpose I/Os | 168 total GPIOs with configurable pull-up/pull-down, analog/digital mode, and EXTI interrupt mapping per pin |
| PF14, PG13, PH12, PI12 | DSI host data/lane signals | MIPI D-PHY compliant outputs supporting up to 500 Mbps/lane for XGA-resolution displays |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core asymmetric processing | Enables concurrent real-time control (M4) and high-throughput computation (M7) without OS-level scheduling overhead |
| ART Accelerator + L1 cache | Eliminates flash wait states for both cores: 16 KB I-cache + 16 KB D-cache on M7; zero-wait-state execution from flash at 240 MHz on M4 |
| Flexible memory controller (FMC) | Supports SDRAM, PSRAM, NOR/NAND flash, and SRAM with 32-bit bus width and 125 MHz synchronous clocking |
| Hardware JPEG codec | Offloads CPU for encode/decode of 4:2:0/4:2:2 YUV images up to 1080p; reduces frame processing time by >90% vs software implementation |
| SMPS + LDO dual-regulator system | SMPS supplies VCORE directly (efficiency >85% at 200 mA); LDO powers analog/peripherals - enables dynamic switching based on load profile |
Applications
| Industrial HMI Gateway | Medical Imaging Edge Node |
|---|---|
Use Scenario: Touch-enabled panel PC controlling PLCs, sensors, and actuators in factory automation. IC Role / Device Role / Timing Role: Dual-core orchestrates GUI rendering (M7 + Chrom-ART DMA2D) and real-time fieldbus communication (M4 + CAN FD/Ethernet). Use Value: 192 KB TCM RAM ensures deterministic response <10 µs for motion control interrupts while running Qt-based UI from flash. | Use Scenario: Portable ultrasound front-end acquiring and preprocessing RF echo data before cloud transmission. IC Role / Device Role / Timing Role: M7 executes beamforming FFT and JPEG compression; M4 manages ADC sampling (3.6 MSPS × 3 ADCs) and SDIO storage write buffering. Use Value: Hardware JPEG codec reduces 1080p image encode latency from 120 ms (software) to 8 ms, enabling real-time preview at 15 fps. |
| Automotive ADAS Camera Hub | Energy Monitoring Gateway |
Use Scenario: Multi-camera fusion unit aggregating feeds from rear-view, surround-view, and driver-monitoring cameras. IC Role / Device Role / Timing Role: DCMI interface captures 80 MHz parallel camera streams; DSI drives rear-seat display; Ethernet transmits fused video to central ECU. Use Value: 80 MHz DCMI bandwidth supports simultaneous 1.3 MP@30 fps capture from two sensors, synchronized via hardware triggers. | Use Scenario: Smart grid node measuring voltage/current harmonics, thermal drift, and battery state in solar inverters. IC Role / Device Role / Timing Role: 3× 16-bit ADCs sample isolated analog inputs at 3.6 MSPS; DFSDM filters sigma-delta modulator outputs for precision energy metering. Use Value: 16-bit resolution + 92 dB SNR enables Class 0.2 accuracy per IEC 62053-22, eliminating external metrology ASIC. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core Arm Cortex-M microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32H757IIT6 | Same dual-core M7/M4, identical peripherals, but 2 MB flash only (no 1 MB RAM variant); LQFP208 package | Lacks UFBGA169 footprint and SMPS regulator - requires external PMIC for high-efficiency power design | Select when board space allows larger LQFP and external power management is preferred |
| NXP i.MX RT1176DVMAAR | Single Cortex-M7 @ 1 GHz + Cortex-M4 @ 400 MHz; no SMPS; 2 MB flash, 1 MB RAM; different peripheral set (no DSI, no JPEG codec) | Targets higher-clock AI inference (e.g., TinyML), but lacks display/video acceleration and analog subsystem depth | Select for ML edge inference where display interface and hardware JPEG are unnecessary |
Compared with STM32H747XGH6, STM32H757IIT6 trades package compactness and integrated SMPS for pin-compatible legacy layout support, while i.MX RT1176DVMAAR shifts focus to raw M7 compute at the expense of analog integration and display subsystems - making STM32H747XGH6 optimal for space-constrained, mixed-signal, graphics-rich embedded systems.
Availability
STM32H747XGH6 is available at Aetrix Electronics and suitable for industrial HMI, medical imaging edge nodes, automotive camera hubs, and energy monitoring gateways requiring stable component supply across multi-year production cycles.
Supply support for STM32H747XGH6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, MEMS, and automotive-grade components since 1987.
The STM32H7 series targets high-performance embedded applications demanding real-time determinism, rich connectivity, and advanced graphics - specifically engineered for industrial automation, medical devices, and automotive infotainment with functional safety readiness.
FAQ
What is the maximum operating frequency of each core in the STM32H747XGH6?
The Arm Cortex-M7 core operates at up to 480 MHz with double-precision FPU and L1 cache; the Cortex-M4 core runs at up to 240 MHz with single-precision FPU and ART Accelerator. Both frequencies are achievable simultaneously when powered by the SMPS regulator and configured with appropriate voltage scaling (Range 0 or 1).
Does the STM32H747XGH6 support hardware-accelerated graphics rendering?
Yes - it integrates the Chrom-ART Accelerator (DMA2D) for 2D graphics composition and the LCD-TFT controller supporting XGA resolution. These blocks offload pixel blending, image rotation, and layer mixing from the CPU, reducing GUI rendering latency by up to 70% in Qt-based applications.
How does the SMPS regulator improve power efficiency compared to traditional LDO-only designs?
The integrated SMPS step-down converter achieves >85% efficiency at 200 mA load (vs ~50% for LDOs), reducing heat dissipation and extending battery life in portable applications. It directly supplies VCORE and can be dynamically enabled/disabled alongside the LDO to optimize efficiency across active/idle states.
Can the STM32H747XGH6 boot from external Quad-SPI flash memory?
Yes - the device supports XIP (execute-in-place) from Quad-SPI memory via its dedicated QUADSPI interface, which operates up to 133 MHz. Boot mode configuration (via BOOT pins) allows direct execution from external flash without copying code to internal RAM, conserving SRAM for data buffers.
STM32H747XGH6 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 265-TFBGA
- Series:
- STM32H7
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4/M7
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 240MHz, 480MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MDIO, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, SWPMI, UART/USART, USB OTG
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
- Number of I/O:
- 168
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 1M x 8
- Voltage - Supply (Vcc/Vdd):
- 1.62V ~ 3.6V
- Data Converters:
- A/D 36x16b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
STM32H747XGH6 FAQ
1.How can I place an order for STM32H747XGH6 through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32H747XGH6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32H747XGH6 reliable?
The price and inventory of STM32H747XGH6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32H747XGH6 is usually 5 days.
3.What payment methods are accepted for STM32H747XGH6?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32H747XGH6 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STM32H747XGH6?
STM32H747XGH6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32H747XGH6 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32H747XGH6?
For technical support, including STM32H747XGH6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32H747XGH6 requirements.
6.How does Aetrix verify that STM32H747XGH6 is sourced from the original manufacturer or authorized distributors?
All STM32H747XGH6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32H747XGH6 meets industry standards.
7.What is the process for return or replacement of STM32H747XGH6?
All STM32H747XGH6 units undergo pre-shipment inspection (PSI). If there is an issue with STM32H747XGH6, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32H747XGH6 part is unused and in its original packaging.
Return procedure for STM32H747XGH6:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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