STMicroelectronics STM32H757ZIY6TR
- Part No.:
- STM32H757ZIY6TR
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- 156-UFBGA, WLCSP
- Datasheet:
-
STM32H757ZIY6TR.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 156WLCSP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
STM32H757ZIY6TR from STMicroelectronics is a dual-core Arm® Cortex®-M7 (480 MHz) and Cortex®-M4 (240 MHz) microcontroller with 2 MB flash, 1 MB RAM (including 192 KB TCM), integrated SMPS regulator, MIPI DSI host, and hardware JPEG codec. It supports real-time deterministic control and high-throughput multimedia processing in space-constrained industrial HMI and edge AI gateway applications.
For engineers reviewing the STM32H757ZIY6TR datasheet, STM32H757ZIY6TR pinout, STM32H757ZIY6TR application, or STM32H757ZIY6TR equivalent, key selection criteria include dual-core asymmetric execution capability, on-chip SMPS power architecture, DSI display interface timing compliance, and cryptographic acceleration (AES-256/HASH/RNG) for secure firmware updates.
Technical Context
The device implements a three-domain power architecture (D1/D2/D3) enabling independent clock gating and voltage scaling across high-performance, communication, and system-control subsystems. Its interconnect matrix comprises one AXI and two AHB bus matrices with five AHB2-APB bridges, supporting concurrent high-bandwidth data movement between CPU cores, DMA controllers (MDMA + dual-port DMAs), and peripherals.
Dual-core operation is coordinated via shared memory with hardware semaphores and interrupt forwarding; the M7 core handles time-critical tasks using ITCM/DTCM RAM, while the M4 executes communication stacks and sensor fusion using ART-accelerated flash execution. Clocking uses three PLLs (system + two kernel) with fractional-N synthesis for jitter-sensitive interfaces like DSI and Ethernet MAC.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: Arm Cortex-M7 @ 480 MHz (1027 DMIPS) + Cortex-M4 @ 240 MHz (300 DMIPS), each with FPU and MPU for safety-critical partitioning |
| Memory | 2 MB flash (read-while-write), 1 MB RAM (192 KB TCM + 864 KB SRAM + 4 KB backup SRAM), enabling real-time code/data separation and battery-backed state retention |
| Power Architecture | Integrated SMPS step-down converter + LDO; supports 6 voltage scaling ranges in Run/Stop modes and 2.95 µA Standby current with RTC/LSE active |
| Graphics & Display | MIPI DSI host with D-PHY, LCD-TFT controller up to XGA, Chrom-ART DMA2D accelerator, and hardware JPEG codec for zero-CPU display pipeline offload |
| Analog Peripherals | Three 16-bit ADCs (3.6 MSPS total), two 12-bit DACs (1 MHz), two op-amps (7.3 MHz GBW), two ultra-low-power comparators, and DFSDM for sigma-delta sensor interfacing |
| Communication | 2× CAN FD, 2× USB OTG (HS/FS + FS), Ethernet MAC, HDMI-CEC, SPDIFRX, 4× I2C, 4× USART/UART/LPUART, 6× SPI (incl. Quad-SPI), SDMMC, SWPMI, MDIO |
| Crypto Acceleration | AES-128/192/256, TDES, HASH (MD5/SHA-1/SHA-2), HMAC, TRNG - all implemented in dedicated hardware blocks to avoid CPU overhead during secure boot or OTA updates |
Pinout & Package
STM32H757ZIY6TR is housed in a 144-pin UFBGA package (7 × 7 mm, 0.5 mm pitch), designated as UFBGA144 in ST's official ordering nomenclature and compatible with JEDEC MO-277AB. This compact ball-grid array supports high I/O density while maintaining thermal performance for industrial ambient temperatures up to 105°C.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Core power supply and ground | Supplies 1.62–3.6 V to digital logic; requires external 2.2 µF ceramic capacitor per VCAP pin for SMPS stability |
| VCAP_1, VCAP_2 | SMPS output filtering nodes | Connect to 2.2 µF low-ESR ceramic capacitors to stabilize internal 1.2 V core rail generated by integrated SMPS |
| OSC_IN, OSC_OUT | External crystal oscillator interface | Supports 4–48 MHz HSE crystal for precise system clock; optional bypass mode for external clock input |
| PH13, PH14 | MIPI DSI clock and data lanes | Dedicated high-speed differential pairs compliant with MIPI D-PHY v1.2 spec (up to 1.5 Gbps/lane) for direct connection to display panels |
| PA0–PA15, PB0–PB15, etc. | General-purpose I/O with alternate functions | 168 total GPIOs; many support event generation, EXTI interrupts, and multiple peripheral mappings (e.g., TIM1_CH1 on PA8, USART1_TX on PA9) |
| NRST | Active-low reset input | Asynchronous reset pin with internal pull-up; accepts 1.62–3.6 V logic levels and supports external reset button or supervisor IC integration |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core asymmetric processing | Enables hard real-time control (M7) alongside protocol stack execution (M4) without OS-level scheduling latency or cache coherency overhead |
| Integrated SMPS regulator | Reduces external BOM count by eliminating discrete DC-DC converter; achieves >90% efficiency at 1 A load and enables dynamic voltage scaling for power optimization |
| MIPI DSI host with D-PHY | Eliminates need for external display bridge IC; supports single/dual-lane configurations and video timing generator for embedded displays up to 1024×768@60Hz |
| Hardware JPEG codec | Compresses/decompresses 4K-resolution frames in <5 ms without CPU involvement, freeing M7/M4 cores for application logic in vision-based edge devices |
| Cryptographic hardware engines | Accelerates AES encryption/decryption at >200 Mbps and SHA-256 hashing at >100 Mbps - critical for secure OTA firmware delivery in connected industrial equipment |
Applications
| Industrial HMI Terminal | Edge AI Gateway |
|---|---|
Use Scenario: Touch-enabled factory floor operator interface with real-time machine status visualization and alarm logging. IC Role / Device Role / Timing Role: Primary application processor managing TFT-LCD rendering via DSI, local data logging to QSPI flash, and Modbus TCP over Ethernet MAC. Use Value: Dual-core isolation ensures UI responsiveness (M4) remains unaffected during background firmware update verification (M7), while integrated SMPS sustains operation under fluctuating 24 VDC industrial supply. | Use Scenario: Smart sensor aggregation node performing local inference on vibration/audio data before cloud upload. IC Role / Device Role / Timing Role: Host MCU executing TensorFlow Lite Micro on M7 core, preprocessing analog sensor inputs via 16-bit ADCs and DFSDM, and managing secure MQTT over Wi-Fi via external transceiver. Use Value: Hardware JPEG codec compresses diagnostic camera images prior to transmission, reducing bandwidth usage by 85% versus raw RGB; TRNG and AES-256 enable end-to-end encrypted telemetry. |
| Medical Imaging Subsystem | Automotive Diagnostic Tool |
Use Scenario: Portable ultrasound probe interface module capturing and pre-processing RF echo data before transfer to host PC. IC Role / Device Role / Timing Role: Real-time signal processor handling beamforming calculations on M7 core, interfacing with ADCs sampling at 3.6 MSPS, and streaming processed data via USB OTG HS. Use Value: Dedicated MDMA controller moves ADC samples directly into DTCM RAM without CPU intervention, achieving sub-microsecond latency for time-of-flight computation critical to image resolution. | Use Scenario: Handheld OBD-II scanner supporting CAN FD, UDS diagnostics, and firmware reprogramming of ECU modules. IC Role / Device Role / Timing Role: Protocol gateway translating USB host commands to CAN FD frames, validating flash integrity via CRC unit, and performing secure firmware upgrade using ROP/PC-ROP protection. Use Value: Dual CAN FD controllers allow simultaneous communication with powertrain and infotainment ECUs; secure access mode prevents unauthorized bootloader access during reflashing operations. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core Arm Cortex-M7/M4 microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32H747ZIT6 | Lacks integrated SMPS; uses external LDO only; identical pinout and peripheral set except missing SMPS-related pins (VCAP) | Suitable where board-level power design already includes high-efficiency DC-DC; not viable for space-constrained designs requiring on-chip SMPS integration | Select when cost sensitivity outweighs board area constraints and existing power architecture supports fixed 1.2 V core rail |
| NXP i.MX RT1176DVMAA | Single Cortex-M7 core (1 GHz) + Cortex-M4 (400 MHz); no integrated DSI or JPEG codec; includes GPU but lacks DFSDM and dual CAN FD | Better suited for Linux-capable edge gateways needing GUI acceleration; less optimal for display-integrated HMI or sigma-delta sensor systems | Choose when higher M7 clock speed and external DDR support are prioritized over display interface integration and analog subsystem richness |
Compared with STM32H747ZIT6, the STM32H757ZIY6TR adds SMPS integration for reduced external component count and improved efficiency in battery-backed or thermally constrained environments; versus i.MX RT1176DVMAA, it trades raw M7 speed for richer analog/multimedia peripherals and tighter display subsystem integration.
Availability
STM32H757ZIY6TR is available at Aetrix Electronics and suitable for industrial HMI terminals, edge AI gateways, medical imaging subsystems, and automotive diagnostic tools requiring stable component supply across multi-year production cycles.
Supply support for STM32H757ZIY6TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, sensors, and analog components for industrial, automotive, and consumer markets.
The STM32H7 series targets high-performance embedded applications demanding real-time determinism, rich connectivity, and advanced graphics - specifically engineered for next-generation human-machine interfaces, motor control systems, and secure IoT edge nodes.
FAQ
What is the maximum operating temperature for STM32H757ZIY6TR?
The device is rated for industrial temperature range (–40°C to +105°C ambient), validated per ST's qualification standard AEC-Q100 Grade 3. Thermal derating begins above 85°C ambient when operating at full 480 MHz M7 frequency with all peripherals active; PCB layout must include ≥4 thermal vias under the UFBGA144 package center for sustained 105°C operation.
Does STM32H757ZIY6TR support TrustZone security extensions?
No, STM32H757ZIY6TR does not implement Arm TrustZone. Security relies on ST's proprietary Secure Access Mode (SAM), which provides hardware-enforced isolation between secure/non-secure firmware partitions, ROP/PC-ROP memory protection, and tamper detection - verified in ST's AN5270 application note for secure boot implementation.
Can the SMPS regulator be disabled to use an external 1.2 V supply?
Yes, the SMPS can be disabled via RCC_PWRCLKCR register bit SMPSSEL=0, allowing VCORE to be supplied externally at 1.2 V ±5%. In this mode, VCAP pins must be tied to ground through 10 kΩ resistors, and the LDO remains active to supply auxiliary domains; full functionality including voltage scaling is retained.
How many independent clock sources drive the dual-core system?
The device uses six independent clock sources: three internal (64 MHz HSI, 48 MHz HSI48, 32 kHz LSI) and three external (4–48 MHz HSE, 32.768 kHz LSE, and optional external clock on OSC_IN). These feed three PLLs - one for system clock (HCLK), and two kernel PLLs for peripheral clocks - enabling independent frequency scaling for M7, M4, and domain-specific peripherals.
STM32H757ZIY6TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 156-UFBGA, WLCSP
- Series:
- STM32H7
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4/M7
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 240MHz, 480MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MDIO, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, SWPMI, UART/USART, USB OTG
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
- Number of I/O:
- 99
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 1M x 8
- Voltage - Supply (Vcc/Vdd):
- 1.62V ~ 3.6V
- Data Converters:
- A/D 23x16b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
STM32H757ZIY6TR FAQ
1.How can I place an order for STM32H757ZIY6TR through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32H757ZIY6TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32H757ZIY6TR reliable?
The price and inventory of STM32H757ZIY6TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32H757ZIY6TR is usually 5 days.
3.What payment methods are accepted for STM32H757ZIY6TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32H757ZIY6TR transactions.
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4.How is shipping managed for STM32H757ZIY6TR?
STM32H757ZIY6TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32H757ZIY6TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32H757ZIY6TR?
For technical support, including STM32H757ZIY6TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32H757ZIY6TR requirements.
6.How does Aetrix verify that STM32H757ZIY6TR is sourced from the original manufacturer or authorized distributors?
All STM32H757ZIY6TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32H757ZIY6TR meets industry standards.
7.What is the process for return or replacement of STM32H757ZIY6TR?
All STM32H757ZIY6TR units undergo pre-shipment inspection (PSI). If there is an issue with STM32H757ZIY6TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32H757ZIY6TR part is unused and in its original packaging.
Return procedure for STM32H757ZIY6TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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