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STMicroelectronics STM32H7B3LIH6Q

Part No.:
STM32H7B3LIH6Q
Manufacturer:
STMicroelectronics
Category:
Microcontrollers
Package:
225-TFBGA
Datasheet:
AetrixSTM32H7B3LIH6Q.pdf
Description:
IC MCU 32BIT 2MB FLASH 225TFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,193

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Product details

Overview

STM32H7B3LIH6Q from STMicroelectronics is a 32-bit Arm® Cortex®-M7 microcontroller operating at up to 280 MHz with double-precision FPU, 2 Mbytes of flash memory, 1.4 Mbytes of RAM (including 64 Kbytes ITCM + 128 Kbytes DTCM), and integrated SMPS regulator. It supports dual Octo-SPI interfaces with on-the-fly AES-128 decryption, FMC for SDRAM/NAND/NOR, and advanced peripherals including FDCAN, TT-CAN, JPEG codec, LCD-TFT controller, and cryptographic accelerators (AES/GCM/CCM, HASH, RNG). It targets high-performance industrial control and real-time embedded systems requiring deterministic timing and secure firmware execution.

For engineers reviewing the STM32H7B3LIH6Q datasheet, STM32H7B3LIH6Q pinout, STM32H7B3LIH6Q application, or STM32H7B3LIH6Q equivalent, key selection criteria include its 280 MHz Cortex-M7 core with L1 cache, dual-bank flash with RWW, TCM RAM partitioning for time-critical code, Octo-SPI security features, and package-specific peripheral availability in UFBGA176+25 (7×7 mm, 176 balls + 25 ground pads).

Technical Context

The STM32H7B3LIH6Q implements a six-stage dual-issue Cortex-M7 core with Harvard architecture, 16 KB instruction and 16 KB data caches, and tightly coupled memory (64 KB ITCM, 128 KB DTCM) for zero-wait-state deterministic execution. Its interconnect matrix comprises one AXI and two AHB bus matrices, five DMA controllers-including MDMA for high-speed memory-to-memory transfers-and domain isolation between CPU domain (CD) and Smart Run Domain (SRD).

It integrates two independent power domains with voltage scaling, SMPS step-down converter for VCORE supply, and dedicated regulators for USB, SDMMC, and backup SRAM. Security includes ROP/PC-ROP, active tamper detection, secure firmware upgrade, and two OTFDEC AES-128 engines for real-time Octo-SPI memory decryption-enabling secure boot and encrypted external code execution.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core Arm® Cortex®-M7 @ 280 MHz with double-precision FPU, 599 DMIPS, and 64-bit AXI interface for high-throughput data movement.
Memory 2 Mbytes dual-bank flash (RWW support), 192 Kbytes TCM RAM (64K ITCM + 128K DTCM), 1.18 Mbytes user SRAM, 4 Kbytes backup SRAM.
Octo-SPI 2x interfaces with on-the-fly AES-128 CTR decryption (OTFDEC), supporting HyperRAM/NOR/PSRAM up to 140 MHz SDR and 110 MHz DTR modes.
Security RNG compliant with NIST SP 800-90B, AES-128/192/256 (ECB/CBC/CTR/GCM/CCM), HASH (MD5/SHA-1/SHA-2), HMAC, and PC-ROP protection.
Power Management SMPS step-down converter for VCORE; Stop mode current down to 32 µA (full RAM retention); Standby at 2.8 µA (RTC/LSE active, Backup SRAM off).
Peripherals 2x FDCAN + 1x TT-CAN, 6x SPI/I2S, 4x I2C, 5x USART/5x UART/1x LPUART, 2x SDMMC, JPEG codec, LCD-TFT controller, Chrom-ART (DMA2D), GFXMMU.
Package UFBGA176+25 (7 × 7 mm, 176 signal balls + 25 ground pads), ECOPACK2-compliant, rated for −40 to +85 °C ambient operation.

Pinout & Package

STM32H7B3LIH6Q uses the UFBGA176+25 package (7 × 7 mm, 176 signal balls + 25 dedicated ground pads), optimized for high-density PCB layouts and thermal performance in industrial and automotive-adjacent applications. Pin assignments follow ST's standardized ball map for H7B3 series, with dedicated VDD/VSS pairs per power domain, isolated analog supplies (VDDA/VSSA), and configurable I/O banks supporting 5-V-tolerant operation on up to 164 pins.

Pin/Terminal Circuit Role Design Meaning
VDD, VSS Core power supply and ground Dual-domain supply: VDD powers CPU domain (CD); separate VDDSMPS feeds SMPS input; VDDMMC supplies SDMMC independently.
VDDA, VSSA Analog reference supply and ground Isolated 1.62–3.6 V supply for ADC/DAC/OPAMPs; enables precise analog measurement without digital noise coupling.
BOOT0 Boot mode selection Pulled low by default; high at reset selects system memory bootloader (USART/I2C/SPI/USB-DFU/FDCAN supported).
NRESET Active-low reset input Synchronizes internal reset logic; accepts external push-button or supervisor IC assertion; supports reset propagation to peripherals.
OSC_IN / OSC_OUT HSE crystal oscillator connection Supports 4–50 MHz external crystal; required for precise clock generation, USB timing, and RTC calibration when LSE unavailable.
PA13 / PA14 SWD debug interface Standard 2-pin Serial Wire Debug (SWDIO/SWCLK); enables full JTAG/SWD debugging, trace, and programming without dedicated JTAG header.

Key Features

Feature Design Value
Dual Octo-SPI with OTFDEC Enables secure, real-time execution from encrypted external HyperRAM/NOR flash-eliminates need for external decryption hardware and reduces BOM cost.
TCM RAM partitioning 64 KB ITCM + 128 KB DTCM allows placement of critical ISR code and real-time buffers in zero-wait-state memory, guaranteeing deterministic latency under load.
Integrated SMPS regulator On-chip step-down converter replaces external DC-DC, reducing board area and improving efficiency (up to 90%) over LDO-based solutions in battery-powered or thermally constrained designs.
JPEG hardware codec Full encode/decode acceleration offloads CPU during image capture/display tasks-reducing processing time by >10× vs software-only implementation.
FDCAN + TT-CAN dual support Single chip satisfies both high-bandwidth CAN FD communication and deterministic time-triggered scheduling for safety-critical subsystems (e.g., motor control, diagnostics).

Applications

Industrial PLC & Motion Control Medical Imaging Edge Node

Use Scenario: Real-time servo loop execution, multi-axis motion profiling, and EtherCAT/PROFINET gateway functions in compact programmable logic controllers.

IC Role / Device Role / Timing Role: Primary application processor executing control algorithms, managing fieldbus stacks, and driving PWM timers with sub-microsecond jitter via DTCM-resident code.

Use Value: 280 MHz Cortex-M7 + 128 KB DTCM ensures <1 µs interrupt latency; dual FDCAN supports distributed I/O synchronization; SMPS improves thermal margin in sealed enclosures.

Use Scenario: Portable ultrasound or endoscopy device capturing, compressing, and displaying live video streams at bedside.

IC Role / Device Role / Timing Role: System-on-chip handling CMOS sensor interface (DCMI), JPEG compression, TFT display output (LTDC), and secure DICOM transmission over USB/UART.

Use Value: Hardware JPEG codec reduces frame encode time to <5 ms; Chrom-ART (DMA2D) accelerates UI rendering; OTFDEC secures firmware updates from untrusted cloud sources.

Smart Building HVAC Controller Secure IoT Gateway

Use Scenario: Multi-sensor environmental hub aggregating temperature, humidity, CO₂, and occupancy data while running local PID control and edge analytics.

IC Role / Device Role / Timing Role: Central MCU interfacing with 12-bit DACs (valve actuation), ultra-low-power comparators (threshold detection), and multiple UARTs for legacy BMS protocols.

Use Value: 2.8 µA Standby current extends battery life in wireless nodes; dual ADCs (3.6 MSPS) enable simultaneous sampling of 24 channels; LPUART maintains connectivity during deep sleep.

Use Scenario: Cellular-connected edge gateway aggregating Zigbee/Z-Wave sensors, performing OTA firmware validation, and enforcing TLS-secured cloud uplinks.

IC Role / Device Role / Timing Role: Root-of-trust anchor with secure boot, AES-GCM authenticated encryption, and hardware RNG for key derivation and session establishment.

Use Value: On-the-fly Octo-SPI decryption prevents firmware tampering; HASH engine accelerates certificate chain verification; tamper pins detect physical intrusion attempts.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance Cortex-M7 microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
STM32H743VIH6 Same 280 MHz Cortex-M7 core, 2 MB flash, 1 MB RAM-but lacks SMPS, OTFDEC, and TT-CAN; includes FMC but only one Octo-SPI. Targeted at graphics-rich HMI (Chrom-ART + LTDC) without external memory encryption or time-triggered networking requirements. Select when SMPS integration and TT-CAN are unnecessary, and lower BOM cost justifies missing security/peripheral features.
STM32H753IIK6 Identical core, memory, and peripheral set-but in LQFP176 package (24×24 mm), no UFBGA option; same SMPS/OTFDEC/TT-CAN support. Better suited for prototyping or cost-sensitive industrial boards where fine-pitch BGA assembly is avoided. Choose for easier rework, standard PCB fabrication, or when thermal dissipation via exposed pad is not required.

Compared with STM32H743VIH6, the STM32H7B3LIH6Q adds SMPS and OTFDEC for power-efficient secure boot from external flash; versus STM32H753IIK6, it trades LQFP accessibility for UFBGA176+25 density and superior thermal performance in space-constrained designs.

Availability

STM32H7B3LIH6Q is available at Aetrix Electronics and suitable for industrial PLCs, medical imaging edge nodes, smart building HVAC controllers, and secure IoT gateways requiring stable component supply, long lifecycle assurance, and consistent parametric performance across production batches.

Supply support for STM32H7B3LIH6Q includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, sensors, and analog devices for industrial, automotive, and consumer markets.

The STM32H7 series targets high-end embedded applications demanding real-time determinism, cryptographic security, and rich multimedia capability-positioned between mainstream Cortex-M4 and application-processor SoCs.

FAQ

What is the maximum operating frequency and how is it achieved?

The STM32H7B3LIH6Q achieves 280 MHz via its Arm Cortex-M7 core with six-stage dual-issue pipeline, dynamic branch prediction, and 16 KB instruction/data caches. This frequency requires stable 1.2 V core supply (VDDCORE), proper decoupling, and configuration of PLL1 with HSE or HSI as source. All timers, ADCs, and peripherals derive clocks from this system clock, with optional prescalers maintaining functional integrity at full speed.

Does STM32H7B3LIH6Q support secure firmware updates over-the-air?

Yes-it supports secure firmware upgrades using embedded cryptographic accelerators (AES-GCM, HASH, RNG) and active tamper detection. Firmware images can be authenticated and decrypted in real time using OTFDEC for external flash or verified in internal flash before execution. The bootloader supports FDCAN, USB-DFU, and UART-based update mechanisms with signature checking against public keys stored in OTP memory.

How does the SMPS regulator integrate with the power architecture?

The integrated SMPS steps down input voltage (typically 3.3 V or 5 V) to 1.2 V for VCORE, replacing an external DC-DC converter. It connects directly to VDDSMPS and VSSSMPS pins, with feedback via VFBSMPS and output filtering via external LC components. Its enable/disable is controlled by software or hardware (PWR_CR3 register), and it operates in forced PWM or automatic PFM mode depending on load, achieving >90% efficiency at medium loads.

Which packages include the full peripheral set including dual Octo-SPI and TT-CAN?

Only UFBGA176+25 (STM32H7B3LIH6Q), TFBGA225, and LQFP176 packages support the complete feature set: dual Octo-SPI, TT-CAN, SMPS, OTFDEC, and all 168 GPIOs. Smaller packages like LQFP100 or UFBGA169 omit TT-CAN, reduce GPIO count, and disable one Octo-SPI interface-verified in Table 1 of DS13139 Rev 8 (page 7).

STM32H7B3LIH6Q Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Package/Case:
225-TFBGA
Series:
STM32H7
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit Single-Core
Speed:
280MHz
Connectivity:
Camera, CANbus, EBI/EMI, HDMI-CEC, I2C, IrDA, LINbus, MDIO, MMC/SD/SDIO, PSSI, SAI, SPDIF, SPI, SWPMI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
168
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
1.4M x 8
Voltage - Supply (Vcc/Vdd):
1.62V ~ 3.6V
Data Converters:
A/D 24x16b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

STM32H7B3LIH6Q FAQ

1.How can I place an order for STM32H7B3LIH6Q through Aetrix?

Please submit a Request for Quotation (RFQ) for STM32H7B3LIH6Q on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STM32H7B3LIH6Q reliable?

The price and inventory of STM32H7B3LIH6Q are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32H7B3LIH6Q is usually 5 days.

3.What payment methods are accepted for STM32H7B3LIH6Q?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32H7B3LIH6Q transactions.

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4.How is shipping managed for STM32H7B3LIH6Q?

STM32H7B3LIH6Q orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STM32H7B3LIH6Q order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STM32H7B3LIH6Q?

For technical support, including STM32H7B3LIH6Q datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32H7B3LIH6Q requirements.

6.How does Aetrix verify that STM32H7B3LIH6Q is sourced from the original manufacturer or authorized distributors?

All STM32H7B3LIH6Q products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32H7B3LIH6Q meets industry standards.

7.What is the process for return or replacement of STM32H7B3LIH6Q?

All STM32H7B3LIH6Q units undergo pre-shipment inspection (PSI). If there is an issue with STM32H7B3LIH6Q, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STM32H7B3LIH6Q part is unused and in its original packaging.

Return procedure for STM32H7B3LIH6Q:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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