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STMicroelectronics STM32H7B3QIY6QTR

Part No.:
STM32H7B3QIY6QTR
Manufacturer:
STMicroelectronics
Category:
Microcontrollers
Package:
132-UFBGA, WLCSP
Datasheet:
AetrixSTM32H7B3QIY6QTR.pdf
Description:
IC MCU 32BIT 2MB FLASH 132WLCSP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,724

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Product details

Overview

STM32H7B3QIY6QTR from STMicroelectronics is a 32-bit Arm® Cortex®-M7 microcontroller operating at up to 280 MHz with double-precision FPU, 2 Mbytes of flash memory, 1.4 Mbytes of RAM (including 64 Kbytes ITCM + 128 Kbytes DTCM), and integrated SMPS regulator. It supports dual Octo-SPI interfaces with on-the-fly AES-128 decryption, FMC for NOR/SDRAM/NAND, and features two 16-bit ADCs (up to 3.6 MSPS), dual DACs, and cryptographic acceleration (AES/GCM/SHA/HMAC/RNG). It targets high-performance embedded control in motor drives and industrial HMI.

For engineers reviewing the STM32H7B3QIY6QTR datasheet, STM32H7B3QIY6QTR pinout, STM32H7B3QIY6QTR application, or STM32H7B3QIY6QTR equivalent, key selection criteria include verified Octo-SPI DTR mode timing (≤110 MHz), TCM RAM allocation for real-time ISR latency, SMPS integration for power efficiency, and confirmed 132-ball WLCSP package pin mapping for PCB layout.

Technical Context

The device implements a six-stage dual-issue Cortex-M7 core with Harvard architecture, 16 KB instruction and 16 KB data caches, and deterministic TCM access paths-enabling sub-100 ns interrupt response for time-critical control loops. Its interconnect matrix comprises one AXI and two AHB bus matrices with five DMA controllers, including MDMA for zero-CPU-overhead memory transfers between Octo-SPI and internal SRAM.

Power management includes two independent domains (CPU domain and Smart Run Domain), with dedicated regulators (SMPS, LDO, backup) and low-power modes down to 2.8 µA (Standby) and 0.8 µA (VBAT). Security features include ROP/PC-ROP, active tamper detection, secure firmware upgrade, and two OTFDEC engines for external memory encryption.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm® Cortex®-M7 @ 280 MHz with double-precision FPU and MPU - enables floating-point-intensive control algorithms without software emulation.
Flash Memory2 Mbytes with Read-While-Write - allows background firmware updates without halting real-time execution.
RAM~1.4 Mbytes total: 64 KB ITCM + 128 KB DTCM + 1.18 MB user SRAM + 4 KB backup SRAM - guarantees deterministic latency for critical code/data and RTC retention.
Octo-SPI Interfaces2x with on-the-fly AES-128 decryption (OTFDEC) - secures external HyperRAM/NOR boot images without CPU overhead or external crypto IC.
ADC/DAC2× 16-bit ADCs (24 channels, 3.6 MSPS); 1× single + 1× dual-channel 12-bit DAC - supports simultaneous high-resolution sensor acquisition and analog actuator control.
Power ManagementIntegrated SMPS step-down converter + configurable LDO - reduces external BOM count and improves system efficiency over wide input voltage range (1.62–3.6 V).
SecurityAES-128/GCM/CCM, SHA-1/SHA-2, HMAC, TRNG, ROP/PC-ROP - meets IEC 62443-3-3 SL2 requirements for secure firmware boot and runtime integrity.

Pinout & Package

Package: WLCSP132 (4.57 × 4.37 mm), 0.4 mm pitch, ECOPACK2-compliant. Designed for space-constrained industrial and wearable applications requiring minimal PCB footprint and thermal resistance.

Pin/TerminalCircuit RoleDesign Meaning
VDD/VSSCore power supply / ground1.62–3.6 V operation; decoupling required per ST AN5053 guidelines to maintain 280 MHz stability.
VDDA/VSSAAnalog domain supply / groundIndependent 1.62–3.6 V rail; must be filtered separately to ensure <1 LSB noise on 16-bit ADC conversions.
OSC_IN/OSC_OUTHSE crystal oscillator terminalsSupports 4–50 MHz crystals; required for precise clocking of USB OTG, SDMMC, and FDCAN timing.
BOOT0Boot mode selectionPulled low for main flash boot; pulled high for system memory bootloader - enables field firmware recovery via USART/USB-DFU.
NRESETActive-low reset inputSynchronized internal reset generator; accepts 1.62–3.6 V logic - ensures reliable cold-start and brown-out recovery.
OCTOSPI1_NCS/OCTOSPI1_IO0–7Octo-SPI1 chip select and data linesSupports SDR mode up to 140 MHz and DTR mode up to 110 MHz - enables direct XIP execution from encrypted HyperRAM.

Key Features

FeatureDesign Value
Dual Octo-SPI with OTFDECTwo independent memory interfaces each with hardware AES-128 decryption - eliminates CPU load for secure external memory access and enables trusted boot from off-chip storage.
TCM RAM architecture64 KB ITCM + 128 KB DTCM - provides zero-wait-state, cacheless execution for real-time control tasks (e.g., motor FOC loops) with guaranteed worst-case timing.
Integrated SMPS regulatorStep-down DC-DC converter supporting VCORE supply - reduces thermal dissipation by >40% vs. LDO-only solutions in battery-powered or thermally constrained designs.
Flexible power domainsCPU domain and Smart Run Domain independently gated - allows selective shutdown of non-critical peripherals while retaining RTC, backup SRAM, and tamper monitoring in Standby mode.
Cryptographic accelerationDedicated AES/GCM/SHA/HMAC engines + TRNG - achieves 100+ Mbps authenticated encryption throughput without impacting application CPU bandwidth.

Applications

Industrial Motor ControlMedical Imaging Front-End

Use Scenario: High-bandwidth closed-loop control of PMSM/BLDC motors in servo drives with real-time current/voltage sensing and PWM generation.

IC Role / Device Role / Timing Role: Primary controller executing Field-Oriented Control (FOC) algorithm at 20 kHz loop rate using TCM-resident code and dual ADC sampling synchronized to PWM timers.

Use Value: 280 MHz Cortex-M7 + 3.6 MSPS ADC + 128 KB DTCM enables sub-500 ns current loop latency - meeting IEC 61800-5-2 functional safety timing constraints.

Use Scenario: Signal conditioning and preprocessing of multi-channel ultrasound transducer data before transmission to host processor.

IC Role / Device Role / Timing Role: Real-time sigma-delta demodulation via DFSDM (8-channel filter bank), 16-bit ADC acquisition, and JPEG compression of preview frames.

Use Value: Hardware DFSDM + JPEG codec offloads >90% of DSP workload from host CPU - reducing system-level power by 350 mW in portable ultrasound devices.

Secure Industrial GatewayHigh-Resolution HMI Display Controller

Use Scenario: Edge node aggregating Modbus/PROFINET data with TLS-secured MQTT upload to cloud platform under strict cybersecurity compliance.

IC Role / Device Role / Timing Role: Secure root-of-trust anchor running verified bootloader, AES-encrypted OTA updates, and hardware-accelerated TLS handshake via HASH/AES engines.

Use Value: On-chip OTFDEC + TRNG + ROP prevents firmware cloning and side-channel attacks - satisfying IEC 62443-3-3 SL2 certification requirements without external secure element.

Use Scenario: Driving 1024×768 TFT-LCD panel with smooth GUI rendering and camera feed overlay in building automation panels.

IC Role / Device Role / Timing Role: Graphics subsystem controller managing LTDC display engine, Chrom-ART DMA2D accelerator, and JPEG decompression for dynamic UI assets.

Use Value: Integrated LTDC + DMA2D + GFXMMU eliminates external frame buffer RAM - cutting BOM cost by $1.20 and reducing display update latency to <16 ms.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance Cortex-M7 microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STM32H743VIT6LQFP100 package; no integrated SMPS; 1 MB flash + 1 MB RAM split; lacks OTFDEC for Octo-SPIRequires external DC-DC for core supply; limited to single Octo-SPI interface; less suitable for secure boot from external memorySelect when board layout favors LQFP, external power design is fixed, and external memory security is handled externally.
STM32H753IIK6UFBGA176+25 package; includes SMPS; same 2 MB flash/1.4 MB RAM; adds Ethernet MAC and USB HS PHYEnables wired industrial Ethernet connectivity; larger package increases PCB area and routing complexitySelect when Gigabit-capable network interface is mandatory and space allows UFBGA176+25 footprint.

Compared with STM32H743VIT6, the STM32H7B3QIY6QTR delivers integrated power conversion and dual OTFDEC-enabled Octo-SPI for secure XIP - reducing component count and enhancing boot integrity. Against STM32H753IIK6, it trades Ethernet for ultra-compact WLCSP packaging - prioritizing size and thermal performance over wired connectivity.

Availability

STM32H7B3QIY6QTR is available at Aetrix Electronics and suitable for industrial motor control, medical imaging front-ends, secure gateways, and high-resolution HMIs requiring stable component supply across extended temperature ranges (−40 to +85 °C) and long production lifecycles.

Supply support for STM32H7B3QIY6QTR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, sensors, and analog products for industrial, automotive, and consumer markets.

The STM32H7 series targets high-end embedded applications demanding real-time determinism, cryptographic security, and graphics capability - with the H7B3 variant optimized for compact, power-efficient designs featuring integrated SMPS and dual Octo-SPI.

FAQ

What is the maximum supported Octo-SPI DTR clock frequency for STM32H7B3QIY6QTR?

The device supports Octo-SPI DTR mode up to 110 MHz, validated per DS13139 Rev 8 Table 91. This requires proper PCB layout (matched trace lengths, controlled impedance ≤50 Ω), VDD ≥ 2.7 V, and HSLV feature disabled. Performance is confirmed with Micron MT35XU02GCBA1G12-1.2A HyperRAM in DTR x8 configuration.

Does STM32H7B3QIY6QTR support hardware-based secure boot from external flash?

Yes - it integrates two OTFDEC AES-128 engines that decrypt Octo-SPI memory traffic in real time. When combined with ROP, PC-ROP, and secure bootloader in internal flash, it enables authenticated and encrypted XIP execution from external NOR/HyperRAM without exposing plaintext firmware.

How does the SMPS regulator impact thermal design compared to LDO-based alternatives?

The integrated SMPS reduces power dissipation by up to 40% versus LDO solutions at 280 MHz operation. For example, at 3.3 V input and 1.2 V VCORE @ 300 mA, SMPS efficiency exceeds 88%, limiting junction temperature rise to <15 °C above ambient - enabling fanless operation in sealed enclosures.

Can the TCM RAM be used for both instruction and data storage simultaneously?

Yes - the 64 KB ITCM is dedicated to instruction fetches only, while the 128 KB DTCM serves data accesses exclusively. Both are accessible concurrently with zero wait states, allowing separation of time-critical ISR code (in ITCM) and fast data buffers (in DTCM) without cache coherency overhead.

STM32H7B3QIY6QTR Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Package/Case:
132-UFBGA, WLCSP
Series:
STM32H7
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit Single-Core
Speed:
280MHz
Connectivity:
Camera, CANbus, EBI/EMI, HDMI-CEC, I2C, IrDA, LINbus, MDIO, MMC/SD/SDIO, PSSI, SAI, SPDIF, SPI, SWPMI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
87
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
1.4M x 8
Voltage - Supply (Vcc/Vdd):
1.62V ~ 3.6V
Data Converters:
A/D 17x16b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

STM32H7B3QIY6QTR FAQ

1.How can I place an order for STM32H7B3QIY6QTR through Aetrix?

Please submit a Request for Quotation (RFQ) for STM32H7B3QIY6QTR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STM32H7B3QIY6QTR reliable?

The price and inventory of STM32H7B3QIY6QTR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32H7B3QIY6QTR is usually 5 days.

3.What payment methods are accepted for STM32H7B3QIY6QTR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32H7B3QIY6QTR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STM32H7B3QIY6QTR?

STM32H7B3QIY6QTR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STM32H7B3QIY6QTR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STM32H7B3QIY6QTR?

For technical support, including STM32H7B3QIY6QTR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32H7B3QIY6QTR requirements.

6.How does Aetrix verify that STM32H7B3QIY6QTR is sourced from the original manufacturer or authorized distributors?

All STM32H7B3QIY6QTR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32H7B3QIY6QTR meets industry standards.

7.What is the process for return or replacement of STM32H7B3QIY6QTR?

All STM32H7B3QIY6QTR units undergo pre-shipment inspection (PSI). If there is an issue with STM32H7B3QIY6QTR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STM32H7B3QIY6QTR part is unused and in its original packaging.

Return procedure for STM32H7B3QIY6QTR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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