STMicroelectronics STM32H7S3A8I6
- Part No.:
- STM32H7S3A8I6
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- 169-UFBGA
- Datasheet:
-
STM32H7S3A8I6.pdf
- Description:
- IC MCU 32BIT 64KB FLASH 169UFBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
STM32H7S3A8I6 from STMicroelectronics is an Arm® Cortex®-M7 32-bit microcontroller operating at up to 600 MHz, featuring 64 KB flash, 620 KB SRAM (548 KB with ECC), dual FD-CAN, Ethernet MAC, and hardware-accelerated graphics (NeoChrom GPU2D + Chrom-ART DMA2D) for embedded HMI applications. It integrates two 12-bit ADCs (5 MSPS), USB OTG HS/FS, and PSA Level 2 / SESIP Level 3 security certification.
For engineers reviewing the STM32H7S3A8I6 datasheet, STM32H7S3A8I6 pinout, STM32H7S3A8I6 application, or STM32H7S3A8I6 equivalent, key selection considerations include its LQFP176 package, dual FD-CAN support for automotive diagnostics, on-the-fly external memory encryption, and dedicated JPEG codec for real-time image processing in resource-constrained edge devices.
Technical Context
The STM32H7S3A8I6 implements a dual-bank Arm Cortex-M7 core with 32+32 KB L1 instruction/data cache, enabling zero-wait-state execution from flash or external memories. Its bus-interconnect matrix supports concurrent AXI/AHB/APB access, while dual GPDMA controllers offload CPU-intensive data movement across peripherals including FMC, XSPI, and SDMMC.
Security architecture includes a root-of-trust boot entry, secure hide protection area (HDP), embedded root secure services (RSS) for SFI/SFU, and two DPA-resistant AES coprocessors - one supporting on-the-fly encryption of serial/parallel external memories (e.g., HyperRAM™, SDRAM). The NeoChrom GPU2D handles rotation/scaling with perspective-correct texture mapping, decoupled from CPU load.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M7 @ up to 600 MHz with DP-FPU, MPU, and 32+32 KB L1 cache for deterministic real-time execution |
| Memory | 64 KB flash (user code/config); 620 KB SRAM (64+64 KB TCM, 384 KB AXI, 4 KB backup) - ECC optional on 548 KB |
| Graphics Acceleration | NeoChrom GPU2D + Chrom-ART DMA2D + Chrom-GRC GFXMMU - enables 20% graphic resource optimization and XGA LCD-TFT control |
| Security | PSA Level 2 & SESIP Level 3 certified; secure boot, HUK, 1 KB OTP, tamper detection, and MCE for on-the-fly memory ciphering |
| Analog & Timing | 2×12-bit ADCs (5 MSPS, 17 channels); CORDIC for trigonometric acceleration; RTC with sub-second resolution and calibration |
| Connectivity | 2× FD-CAN, Ethernet MAC with DMA, USB OTG HS/FS + Type-C PD controller, 6× SPI (4 with I2S), 3× I2C FM+, 1× I3C, 2× SAI, SPDIFRX, HDMI-CEC |
Pinout & Package
LQFP176 (24 × 24 mm, 0.5 mm pitch) package with exposed thermal pad; 152 I/Os with interrupt capability, multiple alternate functions per pin, and dedicated voltage domains (VDDA, VREF+, VCAP).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Core power supply and ground | 1.71–3.6 V application supply; separate VDDA/VSSA for analog domain integrity |
| VCAP | Core regulator bypass capacitor terminal | Requires external 2.2 µF ceramic capacitor for stable VCORE regulation via internal LDO or SMPS |
| NRST | Active-low reset input | Asynchronous reset with internal pull-up; supports external reset supervision and brown-out detection |
| BOOT0 | Boot mode selection | High at power-up selects system memory bootloader; low selects user flash or embedded SRAM |
| PA0–PA15, PB0–PB15, etc. | General-purpose I/O with AF capability | Configurable as GPIO, UART, SPI, CAN, ETH, USB, or graphics interface signals (e.g., LTDC, DCMIPP) |
Key Features
| Feature | Design Value |
|---|---|
| Hardware JPEG codec | Enables real-time encode/decode of JPEG images without CPU overhead - critical for camera-based UI or surveillance edge nodes |
| Dual FD-CAN interfaces | Supports ISO 11898-1:2015 CAN FD (up to 5 Mbps) for automotive diagnostics, firmware updates, and high-bandwidth vehicle network communication |
| Flexible external memory controller (FMC8/16) | Drives parallel LCD-TFT displays up to XGA (1024×768) and connects PSRAM/NOR/NAND with configurable timing and wait states |
| Audio digital filter (ADF) | Processes dual microphone inputs with voice activity detection (VAD), enabling low-power wake-on-voice in smart audio endpoints |
| Octo-SPI + Hexa-SPI interfaces | Supports XiP (execute-in-place) from serial PSRAM/HyperRAM™ at up to 200 MHz - eliminates need for large on-chip RAM in GUI applications |
Applications
| Automotive Diagnostic Tool | Industrial HMI Panel |
|---|---|
Use Scenario: Handheld OBD-II scanner performing real-time CAN FD message analysis and firmware update delivery. IC Role / Device Role / Timing Role: Primary MCU executing diagnostic stack, managing dual FD-CAN buses, and rendering UI via LTDC-driven TFT display. Use Value: 600 MHz Cortex-M7 + dual FD-CAN ensures sub-100 µs latency for UDS request/response cycles; JPEG codec compresses diagnostic screenshots for cloud upload. | Use Scenario: Factory-floor operator interface with touch-enabled XGA display, local data logging, and EtherNet/IP connectivity. IC Role / Device Role / Timing Role: Graphics-centric controller running FreeRTOS with NeoChrom GPU2D accelerating widget redraw and DMA2D handling layer composition. Use Value: 384 KB AXI SRAM buffers frame buffers; FMC8/16 drives parallel RGB display; Ethernet MAC enables PLC integration without external PHY. |
| Smart Audio Endpoint | Secure Edge Gateway |
Use Scenario: Voice-controlled industrial sensor node with dual MEMS microphones and local keyword spotting. IC Role / Device Role / Timing Role: Low-power audio processor using ADF + VAD to trigger wake-up, then switching to full performance for inference. Use Value: LPTIM timers maintain sub-µA sleep current; CORDIC accelerates FFT preprocessing; 12-bit ADCs sample at 5 MSPS for wideband acoustic capture. | Use Scenario: Field-deployable IoT gateway aggregating Modbus, CAN, and BLE sensor data with TLS-secured cloud upload. IC Role / Device Role / Timing Role: Secure host MCU enforcing PSA-certified boot, encrypting data-at-rest with HUK, and managing USB Type-C PD for field-replaceable battery packs. Use Value: Dual AES coprocessors enable concurrent encryption of sensor logs and OTA firmware; MCE secures external NAND used for firmware rollback storage. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32H743VI | Same Cortex-M7 core, but 2 MB flash, no FD-CAN, no JPEG codec, no NeoChrom GPU2D; uses older security model (no PSA Level 2) | Better suited for general-purpose real-time control without graphics or automotive CAN FD requirements | Select when larger flash and legacy peripheral set outweigh need for FD-CAN, hardware JPEG, or modern security certification |
| STM32H753II | 64 KB flash, 1 MB SRAM, adds cryptographic PKA accelerator and enhanced RNG; lacks FD-CAN and JPEG codec | Optimized for TLS-heavy secure communications (e.g., MQTT over TLS) rather than multimedia or automotive diagnostics | Choose when public-key operations dominate workload and FD-CAN/JPEG are unnecessary |
Compared with STM32H743VI and STM32H753II, the STM32H7S3A8I6 uniquely balances FD-CAN, JPEG, and PSA-certified security in a compact LQFP176 package - making it optimal for cost-sensitive, graphics-enabled automotive and industrial edge devices requiring field-upgradable firmware and tamper resilience.
Availability
STM32H7S3A8I6 is available at Aetrix Electronics and suitable for automotive diagnostics tools, industrial HMI panels, smart audio endpoints, and secure edge gateways requiring stable component supply across multi-year production cycles.
Supply support for STM32H7S3A8I6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power ICs, sensors, and analog components for industrial, automotive, and consumer markets.
The STM32H7S series targets secure, graphics-rich edge applications - combining high-performance Cortex-M7 execution, hardware-accelerated 2D graphics, and PSA-certified security in scalable packages for cost-sensitive HMI and automotive diagnostic use cases.
FAQ
What is the maximum operating frequency and core configuration of the STM32H7S3A8I6?
The STM32H7S3A8I6 features a single Arm Cortex-M7 core rated for up to 600 MHz operation, with integrated double-precision floating-point unit (DP-FPU), memory protection unit (MPU), and 32+32 KB L1 instruction/data cache. It does not implement dual-core or symmetric multiprocessing - all performance derives from this single high-frequency core with hardware accelerators (CORDIC, JPEG, GPU2D) offloading specific workloads.
Does the STM32H7S3A8I6 support external SDRAM, and what interfaces are available for that purpose?
Yes, the STM32H7S3A8I6 supports external SDR/LPSDR SDRAM via its Flexible Memory Controller (FMC) with up to 32-bit data bus width and configurable timing parameters. It also supports octo-SPI and hexa-SPI interfaces capable of XiP from serial PSRAM or HyperRAM™ - but SDRAM requires the parallel FMC interface, not SPI-based memory controllers.
How is security implemented on the STM32H7S3A8I6, and what certifications does it hold?
The STM32H7S3A8I6 implements hardware-enforced security including PSA Level 2 and SESIP Level 3 certification (under certification), secure boot with unique entry point, hardware unique key (HUK), 1 KB OTP, active tamper detection, and memory cipher engine (MCE) for on-the-fly encryption of external memories. It supports secure firmware installation/update (SFI/SFU) via embedded root secure services (RSS) and includes DPA-resistant AES and PKA accelerators.
What graphics capabilities does the STM32H7S3A8I6 provide, and which display interfaces does it support?
The STM32H7S3A8I6 integrates NeoChrom GPU2D for rotation, scaling, and perspective-correct texture mapping; Chrom-ART Accelerator (DMA2D) for 2D graphic composition; and Chrom-GRC (GFXMMU) for 20% graphic resource optimization. It supports LCD-TFT up to XGA (1024×768) via LTDC, parallel display interfaces through FMC8/16, and digital camera input via DCMIPP with pixel format conversion and cropping.
STM32H7S3A8I6 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 169-UFBGA
- Series:
- STM32H7
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M7
- Core Size:
- 32-Bit
- Speed:
- 600MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MDIO, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, SWPMI, UART/USART, USB OTG
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
- Number of I/O:
- 116
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 616K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
STM32H7S3A8I6 FAQ
1.How can I place an order for STM32H7S3A8I6 through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32H7S3A8I6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32H7S3A8I6 reliable?
The price and inventory of STM32H7S3A8I6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32H7S3A8I6 is usually 5 days.
3.What payment methods are accepted for STM32H7S3A8I6?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32H7S3A8I6 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STM32H7S3A8I6?
STM32H7S3A8I6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32H7S3A8I6 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32H7S3A8I6?
For technical support, including STM32H7S3A8I6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32H7S3A8I6 requirements.
6.How does Aetrix verify that STM32H7S3A8I6 is sourced from the original manufacturer or authorized distributors?
All STM32H7S3A8I6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32H7S3A8I6 meets industry standards.
7.What is the process for return or replacement of STM32H7S3A8I6?
All STM32H7S3A8I6 units undergo pre-shipment inspection (PSI). If there is an issue with STM32H7S3A8I6, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32H7S3A8I6 part is unused and in its original packaging.
Return procedure for STM32H7S3A8I6:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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