STMicroelectronics STM32H7S3I8T6
- Part No.:
- STM32H7S3I8T6
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- 176-LQFP
- Datasheet:
-
STM32H7S3I8T6.pdf
- Description:
- IC MCU 32BIT 64KB FLASH 176LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:999
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
STM32H7S3I8T6 from STMicroelectronics is an Arm® Cortex®-M7 32-bit microcontroller operating at up to 600 MHz, featuring 64 KB flash, 620 KB SRAM (548 KB with ECC), dual FD-CAN interfaces, Ethernet MAC, and hardware-accelerated graphics (NeoChrom GPU2D + Chrom-ART DMA2D). It targets high-performance embedded applications requiring real-time control, secure firmware updates, and rich human-machine interface support - such as industrial HMIs and edge AI gateways.
For engineers reviewing the STM32H7S3I8T6 datasheet, STM32H7S3I8T6 pinout, STM32H7S3I8T6 application, or STM32H7S3I8T6 equivalent, key selection considerations include its 600 MHz M7 core with L1 cache, PSA Level 2/SESIP Level 3 security certification, dual 12-bit ADCs (5 MSPS), octo-SPI/XSPI memory interface supporting HyperRAM™ at 200 MHz, and UFBGA176+25 package with 176 I/Os and dedicated VCAP pins for SMPS stability.
Technical Context
The STM32H7S3I8T6 implements a dual-bus AXI/AHB interconnect matrix enabling concurrent CPU, DMA, and peripheral access without contention. Its memory subsystem integrates TCM RAM (64+64 KB), 384 KB AXI SRAM, and flexible external memory controllers (FMC, XSPI) supporting XiP from serial PSRAM/NOR and parallel SDRAM.
Security architecture includes root-of-trust boot via HDP, secure firmware installation (SFI/SFU) powered by embedded RSS, hardware AES coprocessors (one DPA-resistant), PKA for ECC verification, and on-the-fly encryption of external memories using MCE - all validated under PSA Level 2 and SESIP Level 3 certification scope.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M7 @ 600 MHz with DP-FPU, MPU, and 32+32 KB L1 cache enabling zero-wait-state execution from flash or external memory |
| Memory | 64 KB user flash + 620 KB SRAM (548 KB with ECC); includes 64+64 KB TCM RAM for deterministic real-time code/data |
| Analog | Two 12-bit ADCs, up to 5 MSPS each, supporting up to 17 channels with hardware oversampling and calibration |
| Graphics | NeoChrom GPU2D for rotation/scaling/texture mapping + Chrom-ART DMA2D for 2D composition + JPEG codec for hardware image encoding/decoding |
| Security | PSA Level 2 & SESIP Level 3 certified; includes SAES, PKA, HASH, RNG (NIST SP800-90B compliant), and secure boot with HDP |
| Connectivity | Dual FD-CAN, Ethernet MAC with DMA, USB OTG HS/FS, USB Type-C PD controller (UCPD), SPDIF-IN, HDMI-CEC, and 3x I2C FM+ |
| Power | 1.71–3.6 V supply; integrated SMPS step-down regulator for VCORE; supports Stop/Standby modes with RTC + 32×32-bit backup registers |
Pinout & Package
STM32H7S3I8T6 is packaged in UFBGA176+25 (10 × 10 mm, 176 signal balls + 25 VSS/VDD balls), optimized for high-density PCB layouts with dedicated VCAP pins for SMPS decoupling and separate analog/digital power domains.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Core power supply and ground | 17 pairs distributed across package per ST's layout guidelines to minimize IR drop and noise coupling in 600 MHz operation |
| VCAP_1, VCAP_2 | SMPS output filtering terminals | Require 2.2 µF ceramic capacitors each; critical for stable 1.1 V VCORE regulation under dynamic load |
| NRST | Active-low reset input | Asynchronous reset with internal pull-up; supports external debounced pushbutton or supervisor IC assertion |
| BOOT0 | Boot mode selection | High at power-up enables system memory bootloader; low selects user flash; sampled only during reset sequence |
| PA13/PA14 | SWD debug interface | Supports SWDIO/SWCLK for programming and real-time debugging; no JTAG pins required for basic development |
| PF14/PF15 | Ethernet RMII interface | Provide TXD1/TXD0 signals; require controlled impedance routing (50 Ω) and tight length matching for <100 Mbps operation |
Key Features
| Feature | Design Value |
|---|---|
| NeoChrom GPU2D + Chrom-GRC | Enables smooth UI rendering at XGA resolution with ≤20% memory bandwidth reduction via GFXMMU-based resource optimization |
| Dual FD-CAN with time-triggered communication | Supports CAN FD data rates up to 5 Mbps and ISO 11898-1:2015 compliance for automotive and industrial networking |
| Hardware JPEG codec | Encodes/decodes 1080p frames in <10 ms without CPU intervention, reducing host processor load in camera-enabled edge devices |
| CORDIC co-processor | Accelerates sine/cosine/tangent/log/exp operations in <100 cycles, improving motor control loop timing predictability |
| Flexible external memory interface | FMC supports NOR/NAND/PSRAM up to 32-bit bus width; XSPI runs at 200 MHz for XiP from HyperRAM™ with <50 ns latency |
Applications
| Industrial HMI | Secure Edge Gateway |
|---|---|
Use Scenario: Touchscreen-based operator interface for PLC-controlled machinery with local data logging and remote diagnostics. IC Role / Device Role / Timing Role: Main application processor executing FreeRTOS with LVGL GUI stack, managing LCD-TFT display (XGA), SD card storage, and dual CAN FD fieldbus connectivity. Use Value: NeoChrom GPU2D renders anti-aliased vector graphics at 60 fps while CORDIC accelerates real-time PID calculations for motion control feedback loops. | Use Scenario: Field-deployable IoT gateway aggregating sensor data from Modbus RTU, CAN FD, and Ethernet networks before TLS-secured cloud upload. IC Role / Device Role / Timing Role: Secure host MCU performing authenticated boot, encrypted OTA updates via SFI/SFU, and hardware-accelerated TLS handshake using SAES+PKA. Use Value: PSA Level 2 certification validates secure boot chain integrity; dual FD-CAN and Ethernet MAC enable simultaneous legacy and modern protocol bridging. |
| Smart Camera Node | Advanced Motor Drive Controller |
Use Scenario: Low-power vision node capturing VGA video via parallel DCMIPP interface, applying edge AI inference, and transmitting JPEG-compressed frames over USB OTG HS. IC Role / Device Role / Timing Role: Vision processing unit running lightweight CNN models in SRAM, leveraging hardware JPEG encoder and ADF for microphone-based voice trigger detection. Use Value: On-chip JPEG codec reduces frame transmission time by 70% vs software encoding; DTS and analog temperature sensor enable thermal throttling of AI workloads. | Use Scenario: High-precision servo drive with field-oriented control (FOC), current sensing via dual ADCs, and isolated gate driver interface via SPI. IC Role / Device Role / Timing Role: Real-time motion controller executing 20 kHz FOC loops using TCM-resident code, synchronized to PWM timers with <100 ns jitter. Use Value: Sixteen 16-bit timers (five low-power variants active in Stop mode) allow precise PWM generation and encoder capture while minimizing active power consumption. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32H743VI | Same Cortex-M7 core but older H74x series; lacks PSA/SESIP certification, no NeoChrom GPU2D, no FD-CAN, only one USB OTG HS | Targeting cost-sensitive industrial control where advanced graphics and automotive-grade CAN FD are unnecessary | Select when security certification and FD-CAN are not required; verify compatibility of legacy HAL drivers and toolchain support |
| STM32U5A8JDK6 | Cortex-M33 core @ 160 MHz; lower performance but superior ultra-low-power profile (Stop2 mode: 1.5 µA); PSA Level 3 certified with TrustZone | Suitable for battery-powered edge nodes needing long-term autonomy and moderate compute, not real-time graphics or high-speed networking | Prefer for energy-constrained deployments; trade off 600 MHz throughput for 4× lower active power and enhanced TrustZone isolation |
Compared with STM32H743VI, the STM32H7S3I8T6 delivers certified security, FD-CAN, and GPU acceleration at higher clock speed - whereas STM32U5A8JDK6 trades raw performance for sub-µA low-power operation and TrustZone-based isolation, making it better suited for intermittent-sensing applications.
Availability
STM32H7S3I8T6 is available at Aetrix Electronics and suitable for industrial HMIs, secure edge gateways, smart camera nodes, and advanced motor drive controllers requiring stable component supply across multi-year production cycles.
Supply support for STM32H7S3I8T6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, sensors, and analog components for industrial, automotive, and consumer markets.
The STM32H7S series is ST's next-generation high-performance secure MCU line targeting applications demanding real-time responsiveness, hardware-accelerated graphics, and PSA-certified security - especially in industrial automation and edge AI endpoints.
FAQ
What is the maximum operating frequency and how is it achieved?
The STM32H7S3I8T6 achieves 600 MHz via its Arm Cortex-M7 core with dual 32 KB L1 instruction and data caches, enabling zero-wait-state execution from embedded flash or external memory. This requires proper VCAP capacitor placement (2.2 µF per pin) and stable 1.1 V VCORE supplied by the integrated SMPS regulator - verified in DS14359 Rev 7 Section 6.3.3.
Does this MCU support hardware-accelerated cryptography for TLS?
Yes - it integrates SAES (secure AES), PKA (public key accelerator for ECC verification), HASH, and RNG (NIST SP800-90B compliant), all used by ST's X-CUBE-SBSFU middleware to perform TLS 1.2/1.3 handshakes with hardware offload. PSA Level 2 certification confirms the cryptographic boundary integrity per DS14359 Section 3.31.
What display interfaces does the STM32H7S3I8T6 support?
It supports LCD-TFT up to XGA (1024×768) resolution via LTDC controller, parallel display interfaces through FMC8/16, and serial displays via octo-SPI with XiP capability. The NeoChrom GPU2D handles rotation, scaling, and perspective-correct texture mapping independently of the CPU - detailed in Sections 3.12 and 3.30 of DS14359.
How many I/O pins are available in the UFBGA176+25 package?
The UFBGA176+25 package provides 176 signal balls plus 25 dedicated VSS/VDD balls, yielding 152 general-purpose I/Os with interrupt capability as specified in Table 3 of DS14359 Rev 7. Pin functions are fully configurable via GPIO alternate function registers and multiplexed across multiple peripherals.
STM32H7S3I8T6 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 176-LQFP
- Series:
- STM32H7
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M7
- Core Size:
- 32-Bit
- Speed:
- 600MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MDIO, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, SWPMI, UART/USART, USB OTG
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
- Number of I/O:
- 119
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 616K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 17x12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
STM32H7S3I8T6 FAQ
1.How can I place an order for STM32H7S3I8T6 through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32H7S3I8T6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32H7S3I8T6 reliable?
The price and inventory of STM32H7S3I8T6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32H7S3I8T6 is usually 5 days.
3.What payment methods are accepted for STM32H7S3I8T6?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32H7S3I8T6 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STM32H7S3I8T6?
STM32H7S3I8T6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32H7S3I8T6 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32H7S3I8T6?
For technical support, including STM32H7S3I8T6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32H7S3I8T6 requirements.
6.How does Aetrix verify that STM32H7S3I8T6 is sourced from the original manufacturer or authorized distributors?
All STM32H7S3I8T6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32H7S3I8T6 meets industry standards.
7.What is the process for return or replacement of STM32H7S3I8T6?
All STM32H7S3I8T6 units undergo pre-shipment inspection (PSI). If there is an issue with STM32H7S3I8T6, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32H7S3I8T6 part is unused and in its original packaging.
Return procedure for STM32H7S3I8T6:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
STM32H7S3I8T6 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

