Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

STMicroelectronics STM32H7S3I8T6

Part No.:
STM32H7S3I8T6
Manufacturer:
STMicroelectronics
Category:
Microcontrollers
Package:
176-LQFP
Datasheet:
AetrixSTM32H7S3I8T6.pdf
Description:
IC MCU 32BIT 64KB FLASH 176LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:999

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

STM32H7S3I8T6 from STMicroelectronics is an Arm® Cortex®-M7 32-bit microcontroller operating at up to 600 MHz, featuring 64 KB flash, 620 KB SRAM (548 KB with ECC), dual FD-CAN interfaces, Ethernet MAC, and hardware-accelerated graphics (NeoChrom GPU2D + Chrom-ART DMA2D). It targets high-performance embedded applications requiring real-time control, secure firmware updates, and rich human-machine interface support - such as industrial HMIs and edge AI gateways.

For engineers reviewing the STM32H7S3I8T6 datasheet, STM32H7S3I8T6 pinout, STM32H7S3I8T6 application, or STM32H7S3I8T6 equivalent, key selection considerations include its 600 MHz M7 core with L1 cache, PSA Level 2/SESIP Level 3 security certification, dual 12-bit ADCs (5 MSPS), octo-SPI/XSPI memory interface supporting HyperRAM™ at 200 MHz, and UFBGA176+25 package with 176 I/Os and dedicated VCAP pins for SMPS stability.

Technical Context

The STM32H7S3I8T6 implements a dual-bus AXI/AHB interconnect matrix enabling concurrent CPU, DMA, and peripheral access without contention. Its memory subsystem integrates TCM RAM (64+64 KB), 384 KB AXI SRAM, and flexible external memory controllers (FMC, XSPI) supporting XiP from serial PSRAM/NOR and parallel SDRAM.

Security architecture includes root-of-trust boot via HDP, secure firmware installation (SFI/SFU) powered by embedded RSS, hardware AES coprocessors (one DPA-resistant), PKA for ECC verification, and on-the-fly encryption of external memories using MCE - all validated under PSA Level 2 and SESIP Level 3 certification scope.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm Cortex-M7 @ 600 MHz with DP-FPU, MPU, and 32+32 KB L1 cache enabling zero-wait-state execution from flash or external memory
Memory64 KB user flash + 620 KB SRAM (548 KB with ECC); includes 64+64 KB TCM RAM for deterministic real-time code/data
AnalogTwo 12-bit ADCs, up to 5 MSPS each, supporting up to 17 channels with hardware oversampling and calibration
GraphicsNeoChrom GPU2D for rotation/scaling/texture mapping + Chrom-ART DMA2D for 2D composition + JPEG codec for hardware image encoding/decoding
SecurityPSA Level 2 & SESIP Level 3 certified; includes SAES, PKA, HASH, RNG (NIST SP800-90B compliant), and secure boot with HDP
ConnectivityDual FD-CAN, Ethernet MAC with DMA, USB OTG HS/FS, USB Type-C PD controller (UCPD), SPDIF-IN, HDMI-CEC, and 3x I2C FM+
Power1.71–3.6 V supply; integrated SMPS step-down regulator for VCORE; supports Stop/Standby modes with RTC + 32×32-bit backup registers

Pinout & Package

STM32H7S3I8T6 is packaged in UFBGA176+25 (10 × 10 mm, 176 signal balls + 25 VSS/VDD balls), optimized for high-density PCB layouts with dedicated VCAP pins for SMPS decoupling and separate analog/digital power domains.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VSSCore power supply and ground17 pairs distributed across package per ST's layout guidelines to minimize IR drop and noise coupling in 600 MHz operation
VCAP_1, VCAP_2SMPS output filtering terminalsRequire 2.2 µF ceramic capacitors each; critical for stable 1.1 V VCORE regulation under dynamic load
NRSTActive-low reset inputAsynchronous reset with internal pull-up; supports external debounced pushbutton or supervisor IC assertion
BOOT0Boot mode selectionHigh at power-up enables system memory bootloader; low selects user flash; sampled only during reset sequence
PA13/PA14SWD debug interfaceSupports SWDIO/SWCLK for programming and real-time debugging; no JTAG pins required for basic development
PF14/PF15Ethernet RMII interfaceProvide TXD1/TXD0 signals; require controlled impedance routing (50 Ω) and tight length matching for <100 Mbps operation

Key Features

FeatureDesign Value
NeoChrom GPU2D + Chrom-GRCEnables smooth UI rendering at XGA resolution with ≤20% memory bandwidth reduction via GFXMMU-based resource optimization
Dual FD-CAN with time-triggered communicationSupports CAN FD data rates up to 5 Mbps and ISO 11898-1:2015 compliance for automotive and industrial networking
Hardware JPEG codecEncodes/decodes 1080p frames in <10 ms without CPU intervention, reducing host processor load in camera-enabled edge devices
CORDIC co-processorAccelerates sine/cosine/tangent/log/exp operations in <100 cycles, improving motor control loop timing predictability
Flexible external memory interfaceFMC supports NOR/NAND/PSRAM up to 32-bit bus width; XSPI runs at 200 MHz for XiP from HyperRAM™ with <50 ns latency

Applications

Industrial HMISecure Edge Gateway

Use Scenario: Touchscreen-based operator interface for PLC-controlled machinery with local data logging and remote diagnostics.

IC Role / Device Role / Timing Role: Main application processor executing FreeRTOS with LVGL GUI stack, managing LCD-TFT display (XGA), SD card storage, and dual CAN FD fieldbus connectivity.

Use Value: NeoChrom GPU2D renders anti-aliased vector graphics at 60 fps while CORDIC accelerates real-time PID calculations for motion control feedback loops.

Use Scenario: Field-deployable IoT gateway aggregating sensor data from Modbus RTU, CAN FD, and Ethernet networks before TLS-secured cloud upload.

IC Role / Device Role / Timing Role: Secure host MCU performing authenticated boot, encrypted OTA updates via SFI/SFU, and hardware-accelerated TLS handshake using SAES+PKA.

Use Value: PSA Level 2 certification validates secure boot chain integrity; dual FD-CAN and Ethernet MAC enable simultaneous legacy and modern protocol bridging.

Smart Camera NodeAdvanced Motor Drive Controller

Use Scenario: Low-power vision node capturing VGA video via parallel DCMIPP interface, applying edge AI inference, and transmitting JPEG-compressed frames over USB OTG HS.

IC Role / Device Role / Timing Role: Vision processing unit running lightweight CNN models in SRAM, leveraging hardware JPEG encoder and ADF for microphone-based voice trigger detection.

Use Value: On-chip JPEG codec reduces frame transmission time by 70% vs software encoding; DTS and analog temperature sensor enable thermal throttling of AI workloads.

Use Scenario: High-precision servo drive with field-oriented control (FOC), current sensing via dual ADCs, and isolated gate driver interface via SPI.

IC Role / Device Role / Timing Role: Real-time motion controller executing 20 kHz FOC loops using TCM-resident code, synchronized to PWM timers with <100 ns jitter.

Use Value: Sixteen 16-bit timers (five low-power variants active in Stop mode) allow precise PWM generation and encoder capture while minimizing active power consumption.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance secure MCU applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STM32H743VISame Cortex-M7 core but older H74x series; lacks PSA/SESIP certification, no NeoChrom GPU2D, no FD-CAN, only one USB OTG HSTargeting cost-sensitive industrial control where advanced graphics and automotive-grade CAN FD are unnecessarySelect when security certification and FD-CAN are not required; verify compatibility of legacy HAL drivers and toolchain support
STM32U5A8JDK6Cortex-M33 core @ 160 MHz; lower performance but superior ultra-low-power profile (Stop2 mode: 1.5 µA); PSA Level 3 certified with TrustZoneSuitable for battery-powered edge nodes needing long-term autonomy and moderate compute, not real-time graphics or high-speed networkingPrefer for energy-constrained deployments; trade off 600 MHz throughput for 4× lower active power and enhanced TrustZone isolation

Compared with STM32H743VI, the STM32H7S3I8T6 delivers certified security, FD-CAN, and GPU acceleration at higher clock speed - whereas STM32U5A8JDK6 trades raw performance for sub-µA low-power operation and TrustZone-based isolation, making it better suited for intermittent-sensing applications.

Availability

STM32H7S3I8T6 is available at Aetrix Electronics and suitable for industrial HMIs, secure edge gateways, smart camera nodes, and advanced motor drive controllers requiring stable component supply across multi-year production cycles.

Supply support for STM32H7S3I8T6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, sensors, and analog components for industrial, automotive, and consumer markets.

The STM32H7S series is ST's next-generation high-performance secure MCU line targeting applications demanding real-time responsiveness, hardware-accelerated graphics, and PSA-certified security - especially in industrial automation and edge AI endpoints.

FAQ

What is the maximum operating frequency and how is it achieved?

The STM32H7S3I8T6 achieves 600 MHz via its Arm Cortex-M7 core with dual 32 KB L1 instruction and data caches, enabling zero-wait-state execution from embedded flash or external memory. This requires proper VCAP capacitor placement (2.2 µF per pin) and stable 1.1 V VCORE supplied by the integrated SMPS regulator - verified in DS14359 Rev 7 Section 6.3.3.

Does this MCU support hardware-accelerated cryptography for TLS?

Yes - it integrates SAES (secure AES), PKA (public key accelerator for ECC verification), HASH, and RNG (NIST SP800-90B compliant), all used by ST's X-CUBE-SBSFU middleware to perform TLS 1.2/1.3 handshakes with hardware offload. PSA Level 2 certification confirms the cryptographic boundary integrity per DS14359 Section 3.31.

What display interfaces does the STM32H7S3I8T6 support?

It supports LCD-TFT up to XGA (1024×768) resolution via LTDC controller, parallel display interfaces through FMC8/16, and serial displays via octo-SPI with XiP capability. The NeoChrom GPU2D handles rotation, scaling, and perspective-correct texture mapping independently of the CPU - detailed in Sections 3.12 and 3.30 of DS14359.

How many I/O pins are available in the UFBGA176+25 package?

The UFBGA176+25 package provides 176 signal balls plus 25 dedicated VSS/VDD balls, yielding 152 general-purpose I/Os with interrupt capability as specified in Table 3 of DS14359 Rev 7. Pin functions are fully configurable via GPIO alternate function registers and multiplexed across multiple peripherals.

STM32H7S3I8T6 Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Package/Case:
176-LQFP
Series:
STM32H7
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit
Speed:
600MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MDIO, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, SWPMI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
119
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
616K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 17x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

STM32H7S3I8T6 FAQ

1.How can I place an order for STM32H7S3I8T6 through Aetrix?

Please submit a Request for Quotation (RFQ) for STM32H7S3I8T6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STM32H7S3I8T6 reliable?

The price and inventory of STM32H7S3I8T6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32H7S3I8T6 is usually 5 days.

3.What payment methods are accepted for STM32H7S3I8T6?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32H7S3I8T6 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STM32H7S3I8T6?

STM32H7S3I8T6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STM32H7S3I8T6 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STM32H7S3I8T6?

For technical support, including STM32H7S3I8T6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32H7S3I8T6 requirements.

6.How does Aetrix verify that STM32H7S3I8T6 is sourced from the original manufacturer or authorized distributors?

All STM32H7S3I8T6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32H7S3I8T6 meets industry standards.

7.What is the process for return or replacement of STM32H7S3I8T6?

All STM32H7S3I8T6 units undergo pre-shipment inspection (PSI). If there is an issue with STM32H7S3I8T6, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STM32H7S3I8T6 part is unused and in its original packaging.

Return procedure for STM32H7S3I8T6:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

STM32H7S3I8T6 Tags

  • STM32H7S3I8T6
  • STM32H7S3I8T6 PDF
  • STM32H7S3I8T6 Datasheet
  • STM32H7S3I8T6 Specifications
  • STM32H7S3I8T6 Images
  • STMicroelectronics
  • STMicroelectronics STM32H7S3I8T6
  • Buy STM32H7S3I8T6
  • STM32H7S3I8T6 Price
  • STM32H7S3I8T6 Distributor
  • STM32H7S3I8T6 Supplier
  • STM32H7S3I8T6 Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER