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STMicroelectronics STM32H7S7L8H6H
- Part No.:
- STM32H7S7L8H6H
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- 225-TFBGA
- Datasheet:
-
STM32H7S7L8H6H.pdf
- Description:
- IC MCU 32BIT 64KB FLASH 225TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,858
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Product details
Overview
STM32H7S7L8H6H from STMicroelectronics is an Arm® Cortex®-M7 32-bit microcontroller operating at up to 600 MHz, featuring 64 KB flash, 620 KB SRAM (548 KB with ECC), dual FD-CAN interfaces, Ethernet MAC, and hardware-accelerated graphics (NeoChrom GPU2D + Chrom-ART DMA2D). It targets high-performance industrial HMI, secure edge gateways, and real-time vision-enabled control systems.
For engineers reviewing the STM32H7S7L8H6H datasheet, STM32H7S7L8H6H pinout, STM32H7S7L8H6H application, or STM32H7S7L8H6H equivalent, key selection considerations include FD-CAN timing compliance, TCM RAM allocation for deterministic code execution, on-the-fly external memory encryption capability, and PSA Level 2/SESIP Level 3 security certification status.
Technical Context
This MCU integrates a dual-bank Arm Cortex-M7 core with 32+32 KB L1 instruction/data cache, enabling zero-wait-state execution from flash or external memories. Its memory subsystem includes 64 KB user flash, 620 KB SRAM (partitioned into 128 KB TCM, 384 KB AXI, and 4 KB backup RAM), and flexible external memory controllers supporting SDR/LPSDR SDRAM, NOR/NAND, and octo-SPI HyperRAM™/HyperFlash™ at up to 200 MHz.
The device implements a layered security architecture anchored by a root of trust (secure boot entry + HDP), hardware unique key (HUK), two DPA-resistant AES coprocessors, public key accelerator (PKA), and on-the-fly encryption/decryption of serial and parallel external memories - all validated under PSA Level 2 and SESIP Level 3 certification.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M7 @ 600 MHz with DP-FPU, MPU, and 32+32 KB L1 cache - enables deterministic real-time execution and floating-point-intensive algorithms without cache misses. |
| Flash Memory | 64 KB user flash - sufficient for compact firmware images with space reserved for secure firmware update (SFU) metadata and rollback protection. |
| SRAM | 620 KB total SRAM (548 KB with ECC enabled) - includes 128 KB TCM for time-critical ISR/code and 384 KB AXI SRAM for DMA buffers and graphics frame storage. |
| Security Certification | PSA Level 2 and SESIP Level 3 certified - provides verified hardware-enforced isolation, secure boot, and cryptographic service integrity for IoT edge deployments. |
| Graphics Acceleration | NeoChrom GPU2D + Chrom-ART DMA2D + Chrom-GRC GFXMMU - delivers hardware-accelerated rotation, scaling, texture mapping, and 20% graphic resource optimization for XGA-resolution TFT displays. |
| Communication Interfaces | 2× FD-CAN, 1× Ethernet MAC with DMA, 2× USB OTG (FS/HS), 1× UCPD - supports automotive diagnostics, industrial networking, and USB-C power delivery negotiation in single-chip gateway designs. |
| Analog Peripherals | 2× 12-bit ADCs (up to 5 MSPS, 17 channels), audio digital filters (ADF), voice activity detection (VAD) - enables sensor fusion and voice-triggered low-power wake-up in smart devices. |
Pinout & Package
STM32H7S7L8H6H is packaged in VFQFPN68 (10 × 10 mm, 0.4 mm pitch), a thermally enhanced quad flat no-lead package suitable for space-constrained industrial and automotive applications requiring robust thermal performance and reflow compatibility.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDIO2 | Core, analog, and I/O supply rails | Separate 1.71–3.6 V domains enable mixed-signal noise isolation and selective power gating during low-power modes. |
| VCAP1, VCAP2 | Core voltage decoupling terminals | Require external 2.2 µF ceramic capacitors per pin to stabilize internal SMPS-regulated VCORE (1.1 V typical) for reliable 600 MHz operation. |
| NRST | Active-low reset input | Asynchronous reset with internal pull-up; accepts 1.65–5.5 V logic levels and supports external reset supervisor integration. |
| BOOT0 | Boot mode selection | High at power-up selects system memory bootloader; low selects user flash - critical for field firmware recovery and secure boot enforcement. |
| PA13/PA14 | SWDIO/SWCLK debug interface | Dedicated Serial Wire Debug pins supporting authenticated debug access and trace via embedded ETM buffer - required for secure lifecycle management. |
| PD0/PD1 | OSC_IN/OSC_OUT | Connects to external 4–50 MHz crystal for high-accuracy clock source; essential for Ethernet PHY synchronization and FD-CAN bit timing precision. |
Key Features
| Feature | Design Value |
|---|---|
| Secure Boot with HDP | Hardware-protected hide protection area prevents unauthorized read-out of boot code and cryptographic keys - foundational for secure device onboarding. |
| On-the-fly External Memory Encryption | MCE engine encrypts/decrypts data in real time during FMC/XSPI reads/writes - eliminates need for software-based encryption overhead while protecting firmware and assets in external flash/SDRAM. |
| NeoChrom GPU2D | Accelerates arbitrary-angle rotation, perspective-correct texture mapping, and alpha blending - reduces CPU load by >70% in GUI rendering versus software-only implementations. |
| FD-CAN with Protocol Engine | Supports ISO 11898-1:2015 CAN FD frames (up to 8 MBps data rate) with hardware timestamping and message filtering - meets automotive ECU timing requirements without CPU intervention. |
| CORDIC Co-processor | Hardware-accelerated trigonometric and hyperbolic functions (sin/cos/tan/log/exp) - cuts computation latency by 10× vs. software library equivalents in motor control and signal processing loops. |
Applications
| Industrial HMI Panel | Secure Edge Gateway |
|---|---|
Use Scenario: 7-inch TFT display with touch controller and Ethernet backhaul in factory-floor operator interface. IC Role / Device Role / Timing Role: Primary application processor executing FreeRTOS, driving LCD-TFT at XGA resolution via LTDC, managing Ethernet TCP/IP stack, and handling FD-CAN diagnostics from PLCs. Use Value: NeoChrom GPU2D renders smooth animations at 60 fps; 620 KB SRAM accommodates framebuffer + network stack + CAN message buffers; PSA-certified security enforces OTA firmware signature verification. | Use Scenario: Smart building controller aggregating BACnet MS/TP, Modbus RTU, and BLE sensors before forwarding to cloud via TLS-secured Ethernet. IC Role / Device Role / Timing Role: Central protocol translator and secure TLS endpoint with hardware crypto acceleration (AES/PKA/HASH), FD-CAN for legacy HVAC bus bridging, and USB-C PD for field-service power negotiation. Use Value: Dual FD-CAN ports isolate legacy fieldbus traffic; on-the-fly external memory encryption protects stored configuration and credentials; 64 KB flash hosts dual-image SFU for fail-safe updates. |
| Real-Time Vision Node | Automotive Diagnostic Tool |
Use Scenario: Compact vision module using parallel camera interface (DCMIPP) and JPEG codec for license plate capture in parking systems. IC Role / Device Role / Timing Role: Image acquisition processor capturing 1280×720@30 fps via DCMIPP, performing pixel cropping/format conversion, compressing to JPEG in hardware, and transmitting over Ethernet. Use Value: DCMIPP hardware cropping reduces bandwidth to AXI SRAM; JPEG codec offloads CPU by 95%; 384 KB AXI SRAM stores full-frame buffers without external DRAM. | Use Scenario: Handheld OBD-II scanner supporting UDS, DoIP, and CAN FD diagnostics for EV battery management systems. IC Role / Device Role / Timing Role: CAN FD physical layer interface controller with precise bit timing (±1.5% tolerance), USB OTG HS host for PC connectivity, and secure key storage for vehicle authentication tokens. Use Value: FD-CAN hardware timestamping ensures sub-microsecond diagnostic event correlation; HUK-protected token storage prevents cloning; 4 KB backup SRAM retains session state across battery removal. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32H7S7I8H6H | LQFP176 package (24 × 24 mm), 176-pin layout with expanded I/O count (152 GPIOs) and additional analog inputs. | Better suited for prototyping and applications requiring maximum peripheral flexibility and debug accessibility. | Select when board layout allows larger footprint and design requires >100 GPIOs or extra ADC channels beyond VFQFPN68 pinout limits. |
| STM32H7S3L8H6H | Same VFQFPN68 package but with reduced feature set: no Ethernet MAC, no USB HS, no NeoChrom GPU2D, and only one FD-CAN. | Targeted at cost-sensitive, non-networked HMI or control applications where graphics and dual-CAN are unnecessary. | Choose for simplified BOM and lower licensing cost where Ethernet, dual FD-CAN, and advanced graphics are not required. |
Compared with STM32H7S7I8H6H, the STM32H7S7L8H6H offers identical security and graphics IP in a smaller footprint but fewer GPIOs; versus STM32H7S3L8H6H, it adds Ethernet, USB HS, dual FD-CAN, and NeoChrom - making it the minimal-feature option for full-featured secure gateway designs in compact form factors.
Availability
STM32H7S7L8H6H is available at Aetrix Electronics and suitable for industrial HMI, secure edge gateways, real-time vision nodes, and automotive diagnostic tools requiring stable component supply through June 2026 and beyond.
Supply support for STM32H7S7L8H6H includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, sensors, and analog products for industrial, automotive, and consumer markets.
The STM32H7S series is engineered for secure, graphics-rich, real-time edge intelligence - combining Arm Cortex-M7 performance with PSA-certified security, hardware-accelerated 2D graphics, and automotive-grade communication interfaces in compact packages.
FAQ
What is the maximum operating frequency and associated CoreMark score?
The STM32H7S7L8H6H operates at up to 600 MHz with a measured CoreMark score of 3196 (5.33 CoreMark/MHz), achieved using its 32+32 KB L1 cache to eliminate wait states during flash execution. This performance level is sustained across the full industrial temperature range (-40°C to +105°C) when powered by the internal SMPS regulator and properly decoupled with VCAP capacitors.
Does this part support hardware-accelerated JPEG encoding and decoding?
Yes - the STM32H7S7L8H6H integrates a dedicated hardware JPEG codec capable of both encoding and decoding YUV422/JPEG streams at up to 1280×720 resolution. It operates independently of the CPU, reducing processing load by up to 95% compared to software libraries, and supports direct DMA transfer between camera interface (DCMIPP) and external memory.
How is secure firmware update (SFU) implemented on this MCU?
SFU is enabled via embedded Root Secure Services (RSS), which provide secure boot, image validation (ECDSA signature check), encrypted image loading, and rollback protection. The implementation uses the hardware unique key (HUK) for AES-CTR decryption of firmware images stored in external memory, with all cryptographic operations performed in dedicated SAES and PKA engines - no software exposure of keys or plaintext firmware.
What are the key thermal design considerations for the VFQFPN68 package?
The VFQFPN68 package (10 × 10 mm) requires a minimum 4-layer PCB with dedicated thermal pad (exposed center die paddle) soldered to a solid copper pour connected to ≥4 thermal vias (0.3 mm diameter) to an internal ground plane. Junction-to-board thermal resistance (θJB) is 18.5°C/W; for continuous 600 MHz operation at +105°C ambient, PCB-level thermal design must limit total power dissipation to ≤1.8 W with forced airflow or heatsink augmentation.
STM32H7S7L8H6H Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 225-TFBGA
- Series:
- STM32H7
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M7
- Core Size:
- 32-Bit
- Speed:
- 600MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MDIO, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, SWPMI, UART/USART, USB OTG
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
- Number of I/O:
- 150
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 616K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 20x12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
STM32H7S7L8H6H FAQ
1.How can I place an order for STM32H7S7L8H6H through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32H7S7L8H6H on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32H7S7L8H6H reliable?
The price and inventory of STM32H7S7L8H6H are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32H7S7L8H6H is usually 5 days.
3.What payment methods are accepted for STM32H7S7L8H6H?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32H7S7L8H6H transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STM32H7S7L8H6H?
STM32H7S7L8H6H orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32H7S7L8H6H order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32H7S7L8H6H?
For technical support, including STM32H7S7L8H6H datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32H7S7L8H6H requirements.
6.How does Aetrix verify that STM32H7S7L8H6H is sourced from the original manufacturer or authorized distributors?
All STM32H7S7L8H6H products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32H7S7L8H6H meets industry standards.
7.What is the process for return or replacement of STM32H7S7L8H6H?
All STM32H7S7L8H6H units undergo pre-shipment inspection (PSI). If there is an issue with STM32H7S7L8H6H, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32H7S7L8H6H part is unused and in its original packaging.
Return procedure for STM32H7S7L8H6H:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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