Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

STMicroelectronics STM32L412R8I6

Part No.:
STM32L412R8I6
Manufacturer:
STMicroelectronics
Category:
Microcontrollers
Package:
64-UFBGA
Datasheet:
AetrixSTM32L412R8I6.pdf
Description:
IC MCU 32BIT 64KB FLASH 64UFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,391

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

STM32L412R8I6 from STMicroelectronics is an ultra-low-power Arm® Cortex®-M4 32-bit MCU with FPU, 80 MHz max frequency, 128 KB flash, 40 KB SRAM, and integrated analog peripherals including dual 12-bit ADCs (5 Msps), one operational amplifier with PGA, and one ultra-low-power comparator. It supports external SMPS for optimized efficiency and operates across -40 °C to 85 °C in LQFP64 package - ideal for battery-powered IoT sensor nodes requiring long runtime and real-time signal conditioning.

For engineers reviewing the STM32L412R8I6 datasheet, STM32L412R8I6 pinout, STM32L412R8I6 application, or STM32L412R8I6 equivalent, key selection criteria include sub-1 µA Stop 2 mode current (0.7 µA), 4 µs wake-up latency, USB 2.0 full-speed crystal-less capability, and hardware parity on 8 KB SRAM - critical for safety-aware portable medical devices, smart metering endpoints, and low-duty-cycle environmental monitors.

Technical Context

The STM32L412R8I6 integrates an Adaptive Real-time Accelerator (ART Accelerator™) enabling zero-wait-state execution from flash at 80 MHz, coupled with a memory protection unit (MPU) and proprietary code readout protection. Its FlexPowerControl architecture supports dynamic voltage scaling and multiple low-power modes - including Shutdown (16 nA), Standby with RTC (245 nA), and Stop 2 (0.7 µA) - all managed via embedded power control logic and BOR circuitry.

It features a dual-bank interconnect matrix routing up to 12 communication interfaces (USB, 3×I²C, 3×USART, LPUART, 2×SPI, Quad SPI), 10 timers (including 2 low-power 16-bit timers active in Stop mode), and dedicated analog resources supplied independently to minimize noise coupling - enabling simultaneous sensing, processing, and secure wireless transmission in compact edge nodes.

Key Specifications

Parameter Value and Actual Design Meaning
Core Arm Cortex-M4 with FPU, 80 MHz max - delivers 100 DMIPS and DSP instructions for real-time filtering and control loops.
Memory 128 KB flash (single bank, code readout protected), 40 KB SRAM (8 KB with hardware parity) - ensures firmware integrity and robust data buffering.
Power Modes Shutdown: 16 nA; Standby w/RTC: 245 nA; Stop 2: 0.7 µA; Run @3.3 V (SMPS): 28 µA/MHz - enables multi-year battery life in intermittent-sensing applications.
Analog Peripherals 2×12-bit ADC (5 Msps, 16-bit oversampling), 1×OPAMP with PGA, 1×ultra-low-power comparator - supports precision sensor front-end without external signal chain components.
Timers & Clock 10 timers including 2 low-power 16-bit timers (active in Stop mode), LSE-supported auto-trimmed MSI (±0.25%), PLL for system clock - enables accurate timekeeping and event scheduling during deep sleep.
Communication USB 2.0 FS crystal-less, 3×I²C FM+, 3×USART (ISO 7816/LIN/IrDA), LPUART (Stop 2 wake-up), Quad SPI - supports direct sensor-to-cloud connectivity and legacy interface bridging.
Package LQFP64 (10 × 10 mm, 0.5 mm pitch) - provides full I/O access (up to 52 fast I/Os, most 5 V-tolerant) and thermal reliability for industrial PCB layouts.

Pinout & Package

LQFP64 package (10 × 10 mm, 0.5 mm pitch) with exposed thermal pad; RoHS-compliant and ECOPACK2 certified.

Pin/Terminal Circuit Role Design Meaning
VDD, VSS Power supply and ground Dual power domains: VDD (1.71–3.6 V main supply), VDDA/VSSA (analog domain isolation); supports external SMPS input at VDD12.
PA0–PA15, PB0–PB15, PC0–PC15, PD0–PD15, PE0–PE15 General-purpose I/Os Up to 52 GPIOs; most 5 V-tolerant; support 16 alternate functions per pin including USART, SPI, I²C, USB, and timer channels.
NRST Active-low reset input Asynchronous reset with internal pull-up; compatible with external reset supervisors and push-button recovery circuits.
BOOT0 Boot mode selection Configures boot source (system memory, flash, or SRAM) at power-on; requires external pull-down for normal flash execution.
OSC_IN / OSC_OUT External crystal oscillator inputs Supports 4–48 MHz HSE crystal; optional for USB clock accuracy or high-precision timing; LSE (32 kHz) dedicated for RTC calibration.
VBAT Battery backup supply Powers RTC and 32×32-bit backup registers in VBAT mode (300 nA typical) - maintains time and state during main power loss.

Key Features

Feature Design Value
FlexPowerControl architecture Enables 7 low-power modes with validated current specs - from 16 nA Shutdown to 79 µA/MHz Run (LDO) - for precise energy budgeting in duty-cycled systems.
ART Accelerator™ Eliminates flash wait states at 80 MHz, reducing CPU stall cycles and improving deterministic interrupt response in real-time control tasks.
Independent analog supply (VDDA) Isolates analog peripherals (ADC, OPAMP, COMP) from digital noise, ensuring <1 LSB INL error in 12-bit conversions under mixed-signal operation.
Hardware CRC and RNG On-the-fly CRC32 computation and true random number generation - accelerates secure firmware updates and cryptographic key derivation without software overhead.
Quad SPI with XIP Executes code directly from external flash (XIP) over Quad SPI interface - expands effective memory footprint while maintaining low-latency instruction fetch.

Applications

Wireless Sensor Node Portable Medical Monitor

Use Scenario: Battery-powered temperature/humidity node transmitting data via BLE or LoRaWAN every 5 minutes.

IC Role / Device Role / Timing Role: Central controller managing sensor acquisition (via ADC + OPAMP), RTC-triggered wake-up, USB-based firmware updates, and low-power radio interface timing.

Use Value: 0.7 µA Stop 2 current and 4 µs wake-up minimize idle power; integrated USB eliminates need for external transceiver; 128 KB flash accommodates OTA stack + application.

Use Scenario: Handheld ECG or pulse oximeter with touch interface and rechargeable Li-ion battery.

IC Role / Device Role / Timing Role: Signal conditioner (ADC oversampling + OPAMP gain), capacitive touch controller (12-channel TSC), and secure data logger with RTC timestamping.

Use Value: Hardware parity on 8 KB SRAM ensures ECG waveform integrity; ultra-low-power comparator enables battery voltage monitoring; 5 V-tolerant I/Os simplify connection to touch panel and display drivers.

Smart Utility Meter Industrial Predictive Maintenance Edge Node

Use Scenario: Gas/water meter with ultrasonic flow sensing, tamper detection, and NB-IoT backhaul.

IC Role / Device Role / Timing Role: Flow signal processor (dual ADC synchronized sampling), tamper event handler (wakeup on EXTI pins), and secure NB-IoT modem controller.

Use Value: 245 nA Standby with RTC sustains 10+ year battery life; LPUART wake-up enables instant command response; 32-bit backup registers retain metering logs during power interruption.

Use Scenario: Vibration/temperature monitor on rotating machinery, logging data locally and triggering alerts via RS-485 or CAN.

IC Role / Device Role / Timing Role: Multi-sensor aggregator (ADC + temp sensor + VBAT monitor), time-synchronized batch acquisition (BAM), and isolated communication controller.

Use Value: Batch Acquisition Mode reduces CPU load during high-rate sampling; independent VDDA ensures stable ADC performance near motor EMI; 40 KB SRAM buffers >30 sec of 10 kHz vibration samples.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultra-low-power MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
STM32L432KC Same core and architecture, but 256 KB flash, 64 KB SRAM, includes AES-256 and PKA crypto accelerators; no Quad SPI. Better suited for secure firmware signing and encrypted data storage; lacks XIP capability for external flash expansion. Select when cryptographic offload and larger code space outweigh need for Quad SPI XIP.
STM32L452RE Higher memory (512 KB flash, 128 KB SRAM), adds DFSDM for sigma-delta modulator interfacing; higher active current (95 µA/MHz). Targeted at audio preprocessing and high-resolution sensor fusion; less optimal for sub-µA standby-critical designs. Select when advanced digital filtering or larger local data buffering is required, and 28 µA/MHz SMPS efficiency is acceptable.

Compared with STM32L432KC and STM32L452RE, the STM32L412R8I6 offers the lowest active and standby currents in its family, prioritizes minimal silicon area and cost for resource-constrained nodes, and uniquely combines Quad SPI XIP with sub-1 µA Stop 2 - making it optimal for compact, long-life, flash-extensible edge sensors.

Availability

STM32L412R8I6 is available at Aetrix Electronics and suitable for wireless sensor nodes, portable medical monitors, smart utility meters, and industrial predictive maintenance edge nodes requiring stable component supply, long-term lifecycle assurance, and full traceability.

Supply support for STM32L412R8I6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, MEMS, and analog chips for industrial, automotive, and consumer markets.

The STM32L4 series targets ultra-low-power embedded applications demanding high performance-per-milliwatt, integrated analog functionality, and robust security - specifically engineered for battery-operated IoT endpoints and energy-sensitive industrial controllers.

FAQ

What is the minimum supply voltage for STM32L412R8I6 in Run mode?

The STM32L412R8I6 operates in Run mode from 1.71 V to 3.6 V. Below 1.71 V, brown-out reset (BOR) triggers to prevent unreliable operation. The device supports external SMPS regulation down to 1.10 V on VDD12, enabling efficient sub-1.8 V core operation while maintaining full peripheral functionality.

Does STM32L412R8I6 support USB without an external crystal?

Yes. The STM32L412R8I6 integrates a USB 2.0 full-speed crystal-less transceiver with internal clock recovery system (CRS), eliminating the need for a 48 MHz external crystal. This reduces BOM cost and PCB area while maintaining ±0.25% USB timing accuracy across temperature and voltage ranges.

How many I/O pins support wakeup from Stop mode?

Four dedicated wakeup pins (WKUP1–WKUP4) are available - mapped to PA0, PC13, PC14, and PC15 - each capable of generating an interrupt to exit Stop, Standby, or Shutdown modes. Additional GPIOs configured as EXTI lines can also serve as wakeup sources depending on selected low-power mode.

Is hardware parity available across all SRAM?

No. Hardware parity checking is implemented only on the first 8 KB of SRAM (SRAM1). The remaining 32 KB (SRAM2) lacks parity protection. This design balances fault tolerance for critical data structures (e.g., stack, control variables) with silicon area efficiency for bulk buffer usage.

STM32L412R8I6 Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Package/Case:
64-UFBGA
Series:
STM32L4
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
I2C, Infrared, IrDA, LINbus, Quad SPI, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, PWM, WDT
Number of I/O:
52
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
40K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

STM32L412R8I6 FAQ

1.How can I place an order for STM32L412R8I6 through Aetrix?

Please submit a Request for Quotation (RFQ) for STM32L412R8I6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STM32L412R8I6 reliable?

The price and inventory of STM32L412R8I6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32L412R8I6 is usually 5 days.

3.What payment methods are accepted for STM32L412R8I6?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32L412R8I6 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STM32L412R8I6?

STM32L412R8I6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STM32L412R8I6 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STM32L412R8I6?

For technical support, including STM32L412R8I6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32L412R8I6 requirements.

6.How does Aetrix verify that STM32L412R8I6 is sourced from the original manufacturer or authorized distributors?

All STM32L412R8I6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32L412R8I6 meets industry standards.

7.What is the process for return or replacement of STM32L412R8I6?

All STM32L412R8I6 units undergo pre-shipment inspection (PSI). If there is an issue with STM32L412R8I6, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STM32L412R8I6 part is unused and in its original packaging.

Return procedure for STM32L412R8I6:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

STM32L412R8I6 Tags

  • STM32L412R8I6
  • STM32L412R8I6 PDF
  • STM32L412R8I6 Datasheet
  • STM32L412R8I6 Specifications
  • STM32L412R8I6 Images
  • STMicroelectronics
  • STMicroelectronics STM32L412R8I6
  • Buy STM32L412R8I6
  • STM32L412R8I6 Price
  • STM32L412R8I6 Distributor
  • STM32L412R8I6 Supplier
  • STM32L412R8I6 Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER