STMicroelectronics STM32L471RGT6
- Part No.:
- STM32L471RGT6
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
STM32L471RGT6.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 64LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:926
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Product details
Overview
STM32L471RGT6 from STMicroelectronics is an ultra-low-power Arm® Cortex®-M4 32-bit MCU with FPU, operating up to 80 MHz (100 DMIPS), featuring 1 MB Flash, 128 KB SRAM, and integrated analog peripherals including three 12-bit ADCs (5 Msps), two 12-bit DACs, two op-amps, and two ultra-low-power comparators. It supports advanced low-power modes (e.g., 420 nA Standby with RTC) and is deployed in battery-powered industrial sensors and portable medical devices requiring long runtime and mixed-signal processing.
For engineers reviewing the STM32L471RGT6 datasheet, STM32L471RGT6 pinout, STM32L471RGT6 application, or STM32L471RGT6 equivalent, key selection considerations include its FlexPowerControl architecture, dual-bank read-while-write Flash, hardware parity-protected SRAM, and support for SAIs, CAN 2.0B, and LPUART wake-up from Stop 2 mode.
Technical Context
The STM32L471RGT6 integrates an Adaptive Real-time Accelerator (ART Accelerator™) enabling zero-wait-state execution from Flash at 80 MHz, alongside a Memory Protection Unit (MPU) and interconnect matrix for deterministic peripheral arbitration. Its power architecture includes three voltage scaling ranges and five low-power modes-Shutdown (30 nA), Standby (120 nA), Stop 2 (1.1 µA), and VBAT mode (300 nA)-with hardware calendar RTC and 5 wakeup pins.
It features three independent analog domains: one for ADC/DAC/OPAMP/COMP (1.62–3.6 V), one for TSC (1.62–3.6 V), and one for VREFBUF (1.2–3.6 V). Clocking includes four PLLs (system, audio, ADC, SAI), auto-trimmed MSI (±0.25%), and external crystal support up to 48 MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M4 with FPU, 80 MHz max, 100 DMIPS, ART Accelerator for zero-wait-state Flash execution |
| Memory | 1 MB dual-bank Flash (read-while-write), 128 KB SRAM (32 KB with hardware parity) |
| Low-Power Performance | 420 nA Standby with RTC; 1.1 µA Stop 2 mode; 4 µs wake-up time from Stop |
| Analog Peripherals | 3× 12-bit ADC (5 Msps, 16-bit oversampling), 2× 12-bit DAC, 2× OPAMP with PGA, 2× ultra-low-power comparators |
| Communication Interfaces | 2× SAI, 3× I²C (FM+), 5× USART, 1× LPUART, 3× SPI + Quad-SPI, CAN 2.0B, SDMMC, SWPMI |
| Timers & Control | 16 timers: 2× advanced-control (TIM1/TIM8), 2× 32-bit GP, 5× 16-bit GP, 2× LP timers (active in Stop), 2× watchdogs |
| Package & Pin Count | LQFP144 (20 × 20 mm), 114 fast I/Os (most 5 V-tolerant), 14 I/Os with independent supply down to 1.08 V |
Pinout & Package
LQFP144 package (20 × 20 mm, 0.5 mm pitch), RoHS-compliant and ECOPACK2® certified, with exposed thermal pad for enhanced thermal dissipation in high-duty-cycle embedded applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Main power supply and ground | Core and I/O domain supply (1.71–3.6 V); decoupling required per datasheet layout guidelines |
| VDDA, VSSA | Analog power and ground | Dedicated 1.62–3.6 V supply for ADC/DAC/OPAMP/COMP; must be filtered and isolated from digital noise |
| PA0–PA15, PB0–PB15, etc. | General-purpose I/Os | 114 total I/Os; most 5 V-tolerant; up to 14 configurable for independent 1.08–3.6 V supply (VDDIO2) |
| NRST | Active-low reset input | Asynchronous reset with internal pull-up; supports external reset circuitry and debugger-initiated reset |
| BOOT0 | Boot mode selection | High at reset enables system memory boot (for bootloader); tied low for main Flash boot |
| SWDIO / SWCLK | Serial Wire Debug interface | 2-pin debug port supporting full SWD protocol (no JTAG required); compatible with ST-LINK and CMSIS-DAP tools |
Key Features
| Feature | Design Value |
|---|---|
| FlexPowerControl architecture | Enables dynamic voltage scaling and multi-level low-power modes with sub-µA quiescent current in Standby/Stop |
| ART Accelerator™ | Eliminates Flash wait states at 80 MHz, delivering consistent 100 DMIPS performance without SRAM code relocation |
| Dual-bank Flash with RWW | Allows firmware update via background bank swap while application runs from active bank-critical for OTA reliability |
| Hardware cryptographic acceleration | True random number generator (TRNG) and CRC unit enable secure boot, firmware signing, and data integrity verification |
| Independent analog supply domains | Separate VDDA/VREF+/VBAT rails allow precision analog operation during digital sleep-essential for sensor node accuracy |
| Batch Acquisition Mode (BAM) | Permits autonomous peripheral data capture (ADC, DFSDM) during CPU sleep, reducing system-level power by >30% in sensing cycles |
Applications
| Wireless Sensor Node | Portable Medical Monitor |
|---|---|
Use Scenario: Battery-powered environmental sensor collecting temperature, humidity, and gas concentration every 30 seconds, transmitting via BLE or LoRaWAN. IC Role / Device Role / Timing Role: Primary controller managing sensor acquisition, signal conditioning (ADC + OPAMP), low-power scheduling (LPTIM), and communication stack timing (LPUART/SAI). Use Value: 420 nA Standby with RTC enables >10-year coin-cell lifetime; BAM reduces active time per measurement cycle by 65% versus polling. |
Use Scenario: Handheld ECG/SpO₂ monitor with real-time waveform display, on-device analysis, and USB/Bluetooth data export. IC Role / Device Role / Timing Role: Mixed-signal SoC handling analog front-end (2× ADC @ 5 Msps, 2× OPAMP for gain/anti-alias), digital filtering (DFSDM), and UI rendering (FSMC-driven LCD). Use Value: Dual-bank Flash allows safe firmware updates without interrupting patient monitoring; hardware parity SRAM ensures clinical data integrity. |
| Industrial Predictive Maintenance Edge Node | Smart Energy Metering Module |
Use Scenario: Vibration and acoustic emission sensor mounted on motor drives, performing FFT-based anomaly detection locally before cloud upload. IC Role / Device Role / Timing Role: Real-time DSP engine (Cortex-M4+FPU) executing floating-point FFTs, synchronized sampling (TIM+ADC trigger), and CAN bus telemetry reporting. Use Value: 100 DMIPS + ART Accelerator delivers 273.55 CoreMark® @ 80 MHz-enough headroom for concurrent sensor fusion and encryption. |
Use Scenario: DIN-rail-mounted electricity meter with metrology-grade ADC, tamper detection, and secure HPLC/RF communication. IC Role / Device Role / Timing Role: Metrology controller interfacing with sigma-delta ADCs (via DFSDM), managing RTC calendar for billing intervals, and enforcing secure boot via TRNG+CRC. Use Value: 3× independent ADCs support simultaneous voltage/current/neutral channel sampling; VBAT-backed RTC maintains billing accuracy during mains failure. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power Cortex-M4 MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32L433RCT6 | 512 KB Flash, 64 KB SRAM, no Quad-SPI, no SAI, lower temp grade (−40 to 85 °C) | Suitable for cost-sensitive sensor nodes without audio or external memory expansion | Select when Flash/SRAM demand < 60% of L471RGT6 and no SAI/Quad-SPI required |
| STM32L552RET6 | ARM TrustZone®, 512 KB Flash, 256 KB SRAM, 110 °C extended temp, higher active power (120 µA/MHz vs. 100 µA/MHz) | Required for secure boot, encrypted firmware storage, and PSA Level 2 certification | Choose when hardware security isolation and certified secure element functionality are mandatory |
Compared with STM32L433RCT6, the STM32L471RGT6 offers double Flash/SRAM and audio/external memory interfaces at modest cost premium; versus STM32L552RET6, it trades TrustZone security for lower active power and broader analog integration-ideal for non-certified but power-critical edge nodes.
Availability
STM32L471RGT6 is available at Aetrix Electronics and suitable for wireless sensor nodes, portable medical monitors, industrial predictive maintenance edge nodes, and smart energy metering modules requiring stable component supply across multi-year production cycles.
Supply support for STM32L471RGT6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power ICs, sensors, and analog components for industrial, automotive, and consumer markets.
The STM32L4 series targets ultra-low-power embedded applications demanding high performance-per-microwatt, combining Cortex-M4 efficiency with ST's proprietary power management IP-including FlexPowerControl and ART Accelerator-to serve battery-constrained IoT and portable equipment.
FAQ
What is the maximum operating frequency and corresponding performance metric?
The STM32L471RGT6 operates at up to 80 MHz, delivering 100 DMIPS (Dhrystone 2.1) and 273.55 CoreMark® (3.42 CoreMark/MHz). This performance is sustained via the ART Accelerator™, which eliminates Flash wait states, and is validated under full voltage scaling (VOS0) with all peripherals enabled and cache active.
How does the dual-bank Flash architecture support firmware updates?
Dual-bank Flash enables Read-While-Write (RWW) operation: while the application runs from Bank 1, new firmware can be written to Bank 2. A controlled bank swap-triggered by software or reset-allows seamless, atomic firmware updates without halting real-time operation, critical for remote or safety-critical deployments.
Which low-power modes support RTC operation and wake-up capability?
RTC remains active in Standby mode (420 nA), Stop 0/1/2 modes (1.1–2.3 µA), and VBAT mode (300 nA). Wake-up from Stop 2 is supported via LPUART, EXTI lines, RTC alarm, or tamper events; Standby wake-up uses RTC alarm, WKUP pins, or external reset-ensuring precise time-triggered autonomy.
What analog supply configurations are required for simultaneous ADC and OPAMP use?
VDDA must be supplied at 1.62–3.6 V and decoupled with ≥1 µF ceramic capacitor; VREF+ (internal or external) sets ADC reference; OPAMPs require VDDA and optionally VREF+ for rail-to-rail output. The TSC domain (VDDTSC) is separate and must be ≥1.62 V if capacitive sensing is used concurrently.
STM32L471RGT6 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 64-LQFP
- Series:
- STM32L4
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 80MHz
- Connectivity:
- CANbus, I2C, IrDA, LINbus, MMC/SD, QSPI, SAI, SPI, SWPMI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, PWM, WDT
- Number of I/O:
- 51
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- A/D 16x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
STM32L471RGT6 FAQ
1.How can I place an order for STM32L471RGT6 through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32L471RGT6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32L471RGT6 reliable?
The price and inventory of STM32L471RGT6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32L471RGT6 is usually 5 days.
3.What payment methods are accepted for STM32L471RGT6?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32L471RGT6 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STM32L471RGT6?
STM32L471RGT6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32L471RGT6 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32L471RGT6?
For technical support, including STM32L471RGT6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32L471RGT6 requirements.
6.How does Aetrix verify that STM32L471RGT6 is sourced from the original manufacturer or authorized distributors?
All STM32L471RGT6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32L471RGT6 meets industry standards.
7.What is the process for return or replacement of STM32L471RGT6?
All STM32L471RGT6 units undergo pre-shipment inspection (PSI). If there is an issue with STM32L471RGT6, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32L471RGT6 part is unused and in its original packaging.
Return procedure for STM32L471RGT6:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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