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STMicroelectronics STM32L4R9AII6

Part No.:
STM32L4R9AII6
Manufacturer:
STMicroelectronics
Category:
Microcontrollers
Package:
169-UFBGA
Datasheet:
AetrixSTM32L4R9AII6.pdf
Description:
IC MCU 32BIT 2MB FLASH 169UFBGA
Quantity:
Payment:
Payment
Shipping:
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Inventory:5,667

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Product details

Overview

STM32L4R9AII6 from STMicroelectronics is an ultra-low-power Arm® Cortex®-M4 32-bit MCU with FPU, 120 MHz max frequency, 2 MB Flash, 640 KB SRAM, integrated LCD-TFT controller and MIPI DSI host, designed for battery-powered graphical HMI applications in industrial panels and portable medical devices.

For engineers reviewing the STM32L4R9AII6 datasheet, STM32L4R9AII6 pinout, STM32L4R9AII6 application, or STM32L4R9AII6 equivalent, key selection criteria include its dual-bank read-while-write Flash, 43 µA/MHz SMPS-enabled Run mode, Chrom-ART Accelerator (DMA2D), MIPI DSI support up to 500 Mbit/s per lane, and -40 °C to +125 °C extended temperature grade.

Technical Context

The STM32L4R9AII6 implements FlexPowerControl architecture with seven low-power modes, including 33 nA Shutdown and 420 nA Stop 2 with RTC-enabled by a dedicated interconnect matrix and adaptive real-time accelerator (ART) for zero-wait-state Flash execution. Its power management integrates internal LDO and external SMPS support with dynamic voltage scaling.

It features three PLLs (system, USB/audio, ADC), dual OctoSPI interfaces supporting XIP and memory-mapped execution, and a full-featured graphics subsystem comprising LTDC, Chrom-GRC (GFXMMU), and MIPI D-PHY compliant DSI Host-enabling direct drive of high-resolution TFT displays without external controllers.

Key Specifications

ParameterValue and Actual Design Meaning
CoreArm Cortex-M4 with FPU, 120 MHz max, 150 DMIPS, ART Accelerator for 0-wait-state Flash execution
Memory2 MB dual-bank Flash (read-while-write), 640 KB SRAM (64 KB with hardware parity)
Power Consumption43 µA/MHz in Run mode with SMPS; 420 nA in Stop 2 with RTC; 33 nA in Shutdown mode
Graphics InterfaceMIPI DSI Host (2 lanes, 500 Mbit/s each) + LCD-TFT controller (LTDC) supporting up to WXGA resolution
Analog Peripherals12-bit 5 Msps ADC (16-bit oversampling), 2×12-bit DAC, 2×OPAMP with PGA, 2×ultra-low-power comparators
CommunicationUSB OTG FS, 6×USART, 4×I²C FM+, 3×SPI, 2×SAI, CAN 2.0B, SDMMC, 2×OctoSPI, 20 total interfaces
Package & TempUFBGA169 (7 × 7 mm), -40 °C to +125 °C operating range, qualified for extended industrial use

Pinout & Package

STM32L4R9AII6 is housed in a 169-ball Ultra-Fine Pitch Ball Grid Array (UFBGA169) package with 0.5 mm pitch, optimized for compact high-density PCB layouts and thermal performance in space-constrained HMI designs.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VDDA, VDDIO2Main, analog, and I/O supply railsSupport independent 1.71–3.6 V operation; VDDIO2 enables 1.08–3.6 V I/O flexibility for interfacing with low-voltage peripherals
VBATBackup power supplySupplies RTC and 32×32-bit backup registers at 305 nA; enables calendar retention during main power loss
PA0–PA15, PB0–PB15, etc.General-purpose I/OsUp to 136 fast I/Os; most 5 V-tolerant; up to 14 pins support independent VDDIO2 down to 1.08 V
DSI_D0P/N, DSI_D1P/N, DSI_CLKN/PMIPI DSI differential lanesTwo high-speed data lanes + clock lane; supports DSI video/commands to display modules at up to 500 Mbit/s per lane
LTDC_R0–R7, G0–G7, B0–B7, HSYNC/VSYNC/DELCD-TFT parallel interface signalsDirect RGB interface for passive TFT panels; configurable for 8-/16-/24-bit color depth and timing control
OSC_IN/OSC_OUTExternal crystal oscillator inputsSupports 4–48 MHz crystal for system clock; paired with 32 kHz LSE for RTC accuracy ±20 ppm

Key Features

FeatureDesign Value
FlexPowerControl architectureEnables 33 nA Shutdown and 420 nA Stop 2 modes-critical for multi-year battery life in portable HMIs
Chrom-ART Accelerator (DMA2D)Hardware-accelerated 2D graphics rendering (copy, blend, fill) offloads CPU and reduces frame buffer bandwidth
Chrom-GRC (GFXMMU)Graphics memory management unit enabling 20% reduction in graphic resource usage via automatic layer compression
Dual OctoSPI interfacesSupports XIP and memory-mapped execution from external flash/PSRAM-eliminates need for external SDRAM in many GUI applications
Embedded SMPS supportReduces active-mode current to 43 µA/MHz vs. 110 µA/MHz with internal LDO-extends runtime in energy-sensitive systems

Applications

Industrial HMI PanelsPortable Medical Devices

Use Scenario: Touch-enabled operator interface on factory-floor control panels with ambient temperature up to 85 °C and requirement for >5-year battery backup during standby.

IC Role / Device Role / Timing Role: Primary application processor managing display refresh (via LTDC+DSI), capacitive touch sensing (24-channel TSC), and real-time alarm logging (RTC + backup SRAM).

Use Value: Dual-bank Flash enables seamless firmware updates without display interruption; 420 nA Stop 2 mode ensures multi-year calendar retention on coin-cell backup.

Use Scenario: Handheld diagnostic device with color TFT display, ECG signal acquisition, and wireless data upload-requiring low EMI and long battery life.

IC Role / Device Role / Timing Role: System-on-chip integrating analog front-end (2×OPAMP, 12-bit ADC), secure data handling (RNG, CRC, UID), and MIPI DSI-driven display output.

Use Value: Integrated 2×12-bit DAC and ultra-low-power comparators enable precise sensor biasing; SMPS-optimized 43 µA/MHz Run mode extends single-charge operation beyond 48 hours.

Smart Energy MetersAdvanced Wearables

Use Scenario: DIN-rail mounted electricity meter with segmented LCD and optional color TFT overlay, operating continuously at -25 °C to +70 °C with tamper detection.

IC Role / Device Role / Timing Role: Main controller executing metrology algorithms, driving display via LTDC, monitoring supply integrity (BOR, VBAT), and managing secure communication (USB OTG, USART with IRDA).

Use Value: Brownout reset (BOR) in all modes except Shutdown prevents corrupted EEPROM writes; 96-bit unique ID enables cryptographic device binding.

Use Scenario: Fitness tracker with always-on color display, motion sensing (via SPI-connected IMU), and Bluetooth coexistence-demanding sub-1 µA sleep current and fast wake-up.

IC Role / Device Role / Timing Role: Application processor running FreeRTOS, managing display partial update (via DMA2D), sensor fusion, and low-latency 5 µs wakeup from Stop mode.

Use Value: Chrom-GRC reduces framebuffer memory footprint by 20%, enabling higher-resolution UI within 640 KB SRAM; LPTIM2 maintains accurate timekeeping during deep sleep.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultra-low-power MCU with embedded graphics applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STM32L4R5VI6Same core, Flash (2 MB), and graphics IP, but UFBGA100 package (100 balls), no MIPI DSI, only LTDC interfaceLimited to parallel RGB displays; lacks high-speed DSI for compact embedded displaysSelect when cost-sensitive design uses simpler TFT panels and requires smaller footprint
STM32H743VIT6Higher-performance Cortex-M7 (480 MHz), 2 MB Flash, 1 MB SRAM, same LTDC+DSI, but 250 µA/MHz Run current and -40 °C to +85 °C ratingBetter for compute-intensive GUIs but unsuitable for extended-temp or ultra-low-power battery useSelect when raw processing throughput outweighs power budget and temperature requirements

Compared with STM32L4R5VI6, the STM32L4R9AII6 adds MIPI DSI for compact high-resolution displays and extends temperature range to +125 °C; versus STM32H743VIT6, it trades peak performance for 4.5× lower active current and extended industrial temperature compliance.

Availability

STM32L4R9AII6 is available at Aetrix Electronics and suitable for industrial HMI panels, portable medical devices, smart energy meters, and advanced wearables requiring stable component supply across long product lifecycles.

Supply support for STM32L4R9AII6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power ICs, sensors, and analog components for industrial, automotive, and consumer markets.

The STM32L4 series targets ultra-low-power embedded applications demanding rich peripheral integration, graphical capability, and extended temperature resilience-specifically engineered for battery-operated HMIs and portable instrumentation.

FAQ

What is the maximum operating temperature for STM32L4R9AII6?

The STM32L4R9AII6 is rated for operation from -40 °C to +125 °C, meeting extended industrial temperature requirements. This is confirmed in Section 6.3.1 of DS12023 Rev 5, where "Operating conditions" specify the 125 °C upper limit for the 'I' temperature grade, validated across electrical characteristics and thermal derating curves.

Does STM32L4R9AII6 support external SMPS control?

Yes-STM32L4R9AII6 includes dedicated SMPS control signals (SMPS_EN, SMPS_VOS, SMPS_SW) and supports dynamic voltage scaling between VOS0 (1.2 V) and VOS3 (0.9 V). Section 3.10.3 of the datasheet details register-controlled SMPS interface enabling up to 43 µA/MHz Run mode efficiency.

How many MIPI DSI lanes does STM32L4R9AII6 implement?

The STM32L4R9AII6 implements one MIPI DSI Host controller with two data lanes (DSI_D0, DSI_D1) and one clock lane (DSI_CLK), supporting high-speed burst mode at up to 500 Mbit/s per lane. This is documented in Section 3.26 ("DSI Host") and Table 2 of DS12023 Rev 5.

Is the 2 MB Flash memory organized in dual banks with read-while-write capability?

Yes-the Flash is split into two independent banks (Bank 1 and Bank 2), each 1 MB, enabling simultaneous read from one bank while programming/erasing the other. This is explicitly stated in Section 3.4 ("Embedded Flash memory") and verified in Table 2 (feature summary) of DS12023 Rev 5.

STM32L4R9AII6 Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Package/Case:
169-UFBGA
Series:
STM32L4
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, LINbus, MMC/SD, SAI, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Number of I/O:
131
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
640K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 14x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

STM32L4R9AII6 FAQ

1.How can I place an order for STM32L4R9AII6 through Aetrix?

Please submit a Request for Quotation (RFQ) for STM32L4R9AII6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STM32L4R9AII6 reliable?

The price and inventory of STM32L4R9AII6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32L4R9AII6 is usually 5 days.

3.What payment methods are accepted for STM32L4R9AII6?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32L4R9AII6 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STM32L4R9AII6?

STM32L4R9AII6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STM32L4R9AII6 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STM32L4R9AII6?

For technical support, including STM32L4R9AII6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32L4R9AII6 requirements.

6.How does Aetrix verify that STM32L4R9AII6 is sourced from the original manufacturer or authorized distributors?

All STM32L4R9AII6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32L4R9AII6 meets industry standards.

7.What is the process for return or replacement of STM32L4R9AII6?

All STM32L4R9AII6 units undergo pre-shipment inspection (PSI). If there is an issue with STM32L4R9AII6, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STM32L4R9AII6 part is unused and in its original packaging.

Return procedure for STM32L4R9AII6:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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