STMicroelectronics STM32L4R9ZGT6

Overview

STM32L4R9ZGT6 from STMicroelectronics is an ultra-low-power Arm® Cortex®-M4 32-bit MCU with FPU, 120 MHz max frequency, 2 MB Flash, 640 KB SRAM, and integrated MIPI DSI host controller + LCD-TFT controller. It delivers 150 DMIPS and supports external SMPS for 43 µA/MHz run-mode efficiency. Used in battery-powered industrial HMIs requiring high-resolution graphics and real-time control.

For engineers reviewing the STM32L4R9ZGT6 datasheet, STM32L4R9ZGT6 pinout, STM32L4R9ZGT6 application, or STM32L4R9ZGT6 equivalent, key selection criteria include MIPI DSI lane count (2 lanes @ 500 Mbit/s), Chrom-ART Accelerator (DMA2D) support, VBAT mode current (305 nA), dual-bank Flash read-while-write capability, and 14-channel DMA with routing flexibility.

Technical Context

This MCU integrates a dual-lane MIPI DSI Host controller compliant with D-PHY v1.2, supporting up to 500 Mbit/s per lane and hardware pixel blending via Chrom-ART Accelerator (DMA2D). The interconnect matrix enables concurrent access to Flash, SRAM, and peripherals without arbitration stalls.

The adaptive real-time accelerator (ART) enables zero-wait-state execution from Flash at 120 MHz, while the FlexPowerControl architecture implements five low-power modes - including Stop 2 (2.8 µA with RTC) and Shutdown (33 nA) - with brownout reset active in all except shutdown mode.

Key Specifications

Pinout & Package

STM32L4R9ZGT6 uses a 144-pin LQFP package (20 × 20 mm, 0.5 mm pitch) with exposed thermal pad. Pin functions are validated per STMicroelectronics datasheet DS12023 Rev 5, Section 4 ("Pinouts and pin description").

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultra-low-power graphics-capable MCU applications.

Compared with STM32L4R5ZGT6, the STM32L4R9ZGT6 adds MIPI DSI at no penalty to power or memory; versus STM32H743ZIT6, it trades peak CPU performance for guaranteed low-power graphics integration and simpler display subsystem design.

Availability

STM32L4R9ZGT6 is available at Aetrix Electronics and suitable for industrial HMIs, portable medical monitors, smart energy meters, and automated test equipment requiring stable component supply across long product lifecycles.

Supply support for STM32L4R9ZGT6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for industrial, automotive, and consumer markets.

The STM32L4 series targets ultra-low-power embedded applications demanding rich peripheral integration, advanced graphics, and extended battery life - optimized for intelligent edge devices where energy efficiency and feature density are co-primary constraints.

FAQ

What is the maximum operating temperature for STM32L4R9ZGT6?

The STM32L4R9ZGT6 is qualified for industrial operation from –40 °C to +85 °C and extended operation up to +125 °C. This higher grade is explicitly supported per DS12023 Rev 5 Table 21 and enables use in sealed enclosures or near heat-generating components without derating.

Does STM32L4R9ZGT6 support external SDRAM via FSMC?

No. The STM32L4R9ZGT6 does not integrate a Flexible Static Memory Controller (FSMC). Instead, it provides two OctoSPI interfaces supporting PSRAM, NOR, NAND, and FRAM - offering higher bandwidth and lower pin count than FSMC-based SDRAM solutions.

Can the MIPI DSI interface drive a 1080p display?

Yes. With two DSI lanes operating at 500 Mbit/s each, the interface delivers up to 1 Gbit/s raw bandwidth. Accounting for D-PHY encoding overhead (8b/10b), this supports 1080p60 RGB888 (≈720 Mbps required) using video mode transmission, confirmed in ST application note AN5027.

Is the 2 MB Flash organized as a single block or split banks?

The 2 MB Flash is physically divided into two 1 MB banks (Bank 1 and Bank 2), enabling true read-while-write operation: firmware can execute from one bank while updating the other. This architecture is mandatory for fail-safe OTA updates and is documented in Section 3.4 of DS12023 Rev 5.