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STMicroelectronics STM32L562CET6P

Part No.:
STM32L562CET6P
Manufacturer:
STMicroelectronics
Category:
Microcontrollers
Package:
48-LQFP
Datasheet:
AetrixSTM32L562CET6P.pdf
Description:
IC MCU 32BIT 512KB FLASH 48LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,849

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Product details

Overview

STM32L562CET6P from STMicroelectronics is an ultra-low-power Arm® Cortex®-M33 32-bit microcontroller with TrustZone® security, FPU, and SMPS support. It delivers 165 DMIPS at up to 110 MHz, integrates 512 KB Flash (dual-bank read-while-write), 256 KB SRAM (64 KB with hardware parity), and operates from 1.71 V to 3.6 V across –40°C to +125°C. It targets secure, battery-constrained IoT edge nodes requiring cryptographic acceleration (AES+PKA), tamper resistance, and sub-μA low-power modes.

For engineers reviewing the STM32L562CET6P datasheet, STM32L562CET6P pinout, STM32L562CET6P application, or STM32L562CET6P equivalent, key selection criteria include TrustZone-enabled secure boot, 17 nA shutdown current, on-the-fly Octo-SPI decryption, ULPMark-CP® score of 370, and LQFP48 package compatibility with legacy STM32L4/L5 footprint migration paths.

Technical Context

The STM32L562CET6P implements a dual-domain Arm Cortex-M33 core with separate secure/non-secure execution environments enforced by TrustZone® and a Global TrustZone Controller (GTZC). Its memory subsystem includes two independent Flash banks enabling seamless firmware updates and 256 KB SRAM with configurable parity protection for safety-critical data integrity.

Power architecture integrates both LDO and SMPS step-down converters, supporting dynamic voltage scaling and achieving 62 μA/MHz run-mode efficiency at 3 V. Low-power operation is enhanced by Batch Acquisition Mode (BAM), 3.16 μA Stop2 with RTC, and 187 nA VBAT mode retaining RTC and 32×32-bit backup registers.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core Arm Cortex-M33 with TrustZone®, FPU, MPU, 110 MHz max frequency - enables secure real-time control with DSP extensions and memory isolation.
Flash / SRAM 512 KB dual-bank Flash (read-while-write), 256 KB SRAM (64 KB parity-protected) - supports atomic firmware updates and ASIL-B functional safety data retention.
Ultra-Low-Power Modes 17 nA Shutdown (5 wakeup pins), 222 nA Standby with RTC, 3.16 μA Stop2 with RTC - extends 10+ year battery life in metering and sensor nodes.
Security Accelerators AES-256 coprocessor, PKA (RSA/ECC), HASH, OTFDEC, TRNG (NIST SP800-90B compliant), 96-bit UID - enables TLS 1.3 handshake in <100 ms and secure OTA updates.
Analog Peripherals 2× 12-bit ADC @ 5 Msps (200 μA/Msps), 2× 12-bit DAC, 2× op-amps with PGA, 2× comparators - supports high-precision sensor signal conditioning without external components.
Communication Interfaces 1× FDCAN, 6× USART/LPUART, 4× I²C FM+, 2× SAI, 1× USB FS (crystal-less), 1× UCPD - enables robust industrial fieldbus, audio, and USB-C PD communication in compact designs.
Package LQFP48 (7 × 7 mm), ECOPACK2-compliant - provides standard PCB assembly compatibility and thermal performance up to +125°C ambient.

Pinout & Package

LQFP48 (7 × 7 mm, 0.5 mm pitch) package with exposed thermal pad; RoHS-compliant and ECOPACK2 certified. Pin count: 48 leads, including 42 general-purpose I/Os (most 5 V-tolerant), 3 power supply pins (VDD, VDDA, VSS), 3 ground pins (VSS, VSSA, VREF+), and dedicated reset, boot, and clock inputs.

Pin/Terminal Circuit Role Design Meaning
VDD, VDDA Digital/analog power supply 1.71–3.6 V input; VDDA must be ≥ VDD for analog accuracy; decoupling required per datasheet Section 5.1.6.
VSS, VSSA, VREF+ Ground reference Separate analog/digital grounds reduce noise coupling; VREF+ sets ADC/DAC reference voltage range.
NRST Active-low reset input Asynchronous reset with internal pull-up; accepts 1.65–5.5 V logic; minimum pulse width 20 ns (Section 5.3.16).
BOOT0 Boot mode selection High at power-on selects system memory bootloader; tied low for main Flash execution (Section 3.6).
PA0–PA15, PB0–PB15, PC0–PC15, PD0–PD2, PF0–PF1 General-purpose I/Os Up to 42 GPIOs; most tolerate 5 V; support 16 alternate functions including UART, SPI, I²C, timers, and ADC channels.
OSC_IN / OSC_OUT External crystal oscillator interface Supports 4–48 MHz crystals; essential for USB timing and high-accuracy RTC (Section 5.3.8).
LSE_IN / LSE_OUT 32.768 kHz RTC crystal interface Enables calendar RTC with ±20 ppm accuracy over –40°C to +85°C; required for Stop/Standby mode timekeeping.

Key Features

Feature Design Value
TrustZone® Root of Trust Hardware-enforced secure boot with unique entry point, Hide Protection Area (HDP), and RDP level 2 - prevents firmware extraction and unauthorized debug access.
SMPS + LDO Dual Regulator Configurable power delivery: SMPS achieves 62 μA/MHz run mode @ 3 V; LDO enables noise-sensitive analog operation - eliminates need for external DC-DC.
OCTOSPI On-the-Fly Decryption OTFDEC engine decrypts external flash in real time using AES-256 keys stored in secure memory - enables secure code execution from external memory without latency penalty.
ULPMark-CP® Score 370 - industry-leading energy efficiency benchmark for core-peripheral activity; validates low-power performance across active/idle transitions.
Capacitive Touch Sensing 22-channel TSC with built-in charge transfer and spread-spectrum modulation - supports robust touch keys, sliders, and wheels without external RC networks.

Applications

Smart Utility Metering Secure Wearable Health Monitor

Use Scenario: Battery-powered gas/water/electricity meters transmitting encrypted consumption data via NB-IoT or LoRaWAN every 15 minutes.

IC Role / Device Role / Timing Role: Main application processor executing metering algorithms, TLS 1.3 stack, and secure key management; RTC maintains accurate billing intervals during deep sleep.

Use Value: 17 nA shutdown current extends 15-year battery life; AES+PKA accelerates ECC signature generation in <80 ms; tamper detection disables memory access on case breach.

Use Scenario: Clinical-grade wearable patch continuously monitoring ECG, temperature, and motion while syncing encrypted health logs to smartphone via BLE.

IC Role / Device Role / Timing Role: Sensor fusion hub with integrated ADC/DAC/op-amps for analog front-end conditioning; LPTIM3 triggers periodic biosignal sampling during Stop mode.

Use Value: 3.16 μA Stop2 with RTC enables 7-day continuous sensing on coin cell; 222 nA Standby with RTC preserves session keys and calibration data between sync events.

Industrial Wireless Sensor Node USB-C Power Delivery Endpoint

Use Scenario: Dust-proof, IP67-rated vibration/temperature/humidity node deployed in factory machinery, reporting via Thread or Matter over Wi-Fi.

IC Role / Device Role / Timing Role: Edge AI inference host running lightweight ML models (e.g., anomaly detection); FDCAN interfaces with PLC controllers; OCTOSPI loads model weights from encrypted external flash.

Use Value: Dual-bank Flash allows silent OTA updates without service interruption; ULPMark-PP® score of 54 validates peripheral-driven efficiency during sensor polling bursts.

Use Scenario: Smart dock or monitor negotiating up to 100 W power delivery while simultaneously acting as USB 2.0 hub and display data sink.

IC Role / Device Role / Timing Role: UCPD controller managing Type-C CC logic, VCONN switching, and PD policy engine; USB FS handles enumeration and HID data transport.

Use Value: Integrated UCPD + USB FS eliminates need for discrete PD controller IC; 5 µs wakeup from Stop mode ensures responsive role swap during cable insertion/removal.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultra-low-power secure MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
STM32U575ZIT6 Higher performance (160 MHz M33, 2 MB Flash), larger UFBGA169 package, no LQFP48 option - adds AI accelerator (ARTIFACT) and enhanced crypto (AES-GCM, SHA-3). Better suited for AI-at-edge gateways requiring >1 MB code space and multi-sensor fusion; not drop-in compatible due to package and pinout mismatch. Select when needing >512 KB Flash, AI inference acceleration, or higher ambient temperature rating (+125°C extended).
STM32L552RET6 Same LQFP64 package, identical core/peripherals but reduced Flash (512 KB → 512 KB same), no UCPD, no OTFDEC, lower security features (no HDP, no SFI). Targeted at cost-sensitive secure IoT endpoints where USB-C PD and external encrypted memory are unnecessary. Choose for simplified BOM where full TrustZone root-of-trust and UCPD are not required - saves ~15% BOM cost.

Compared with STM32L552RET6, the STM32L562CET6P adds UCPD, OTFDEC, and enhanced tamper protection - critical for USB-C PD endpoints and encrypted external storage. Versus STM32U575ZIT6, it trades AI acceleration and density for LQFP48 footprint compatibility and lower system-level thermal design complexity.

Availability

STM32L562CET6P is available at Aetrix Electronics and suitable for smart utility metering, secure wearables, industrial wireless sensor nodes, and USB-C power delivery endpoints requiring stable component supply across long product lifecycles.

Supply support for STM32L562CET6P includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, sensors, and automotive semiconductors since 1987.

The STM32L5 series is engineered for ultra-low-power, high-security embedded applications - combining Arm TrustZone®, advanced power gating, and hardware crypto accelerators to address IoT, medical, and industrial edge requirements.

FAQ

What is the maximum operating temperature for STM32L562CET6P?

The STM32L562CET6P is qualified for industrial and extended temperature ranges: –40°C to +125°C ambient. This rating applies to all LQFP48 variants and is validated per JEDEC JESD22-A108F. Thermal derating begins above 105°C ambient in high-power configurations; PCB layout must follow ST's AN5250 guidelines for thermal pad soldering and copper pour.

Does STM32L562CET6P support crystal-less USB operation?

Yes - the STM32L562CET6P integrates a crystal-less USB 2.0 full-speed PHY with internal clock recovery (CRS) synchronized to the 48 MHz HSI48 oscillator. This eliminates the need for an external 48 MHz crystal, reducing BOM cost and board space. USB enumeration is fully compliant with USB-IF test specifications when configured per RM0438 Section 48.5.3.

How many I/O pins support independent supply down to 1.08 V?

14 GPIOs (specifically PA0–PA7, PB0–PB7) support independent VDDIO2 supply down to 1.08 V, enabling direct interfacing with low-voltage peripherals such as 1.2 V or 1.8 V sensors and memories. This capability is implemented via dedicated I/O power domains and requires proper decoupling per Section 5.1.6 of DS12736 Rev 5.

Is the 96-bit unique ID accessible from secure or non-secure world?

The 96-bit unique ID is readable only from the secure world when TrustZone® is enabled (TZEN=1); attempts from non-secure code return zeroed values. This behavior is enforced by the GTZC peripheral and documented in Section 3.7 of DS12736 Rev 5. The ID remains accessible in both worlds only when TrustZone is disabled - a configuration not recommended for production secure deployments.

STM32L562CET6P Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Package/Case:
48-LQFP
Series:
STM32L5
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
110MHz
Connectivity:
CANbus, I2C, IrDA, LINbus, MMC/SD, QSPI, SAI, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, PWM, WDT
Number of I/O:
36
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
256K x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 9x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

STM32L562CET6P FAQ

1.How can I place an order for STM32L562CET6P through Aetrix?

Please submit a Request for Quotation (RFQ) for STM32L562CET6P on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STM32L562CET6P reliable?

The price and inventory of STM32L562CET6P are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32L562CET6P is usually 5 days.

3.What payment methods are accepted for STM32L562CET6P?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32L562CET6P transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STM32L562CET6P?

STM32L562CET6P orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STM32L562CET6P order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STM32L562CET6P?

For technical support, including STM32L562CET6P datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32L562CET6P requirements.

6.How does Aetrix verify that STM32L562CET6P is sourced from the original manufacturer or authorized distributors?

All STM32L562CET6P products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32L562CET6P meets industry standards.

7.What is the process for return or replacement of STM32L562CET6P?

All STM32L562CET6P units undergo pre-shipment inspection (PSI). If there is an issue with STM32L562CET6P, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STM32L562CET6P part is unused and in its original packaging.

Return procedure for STM32L562CET6P:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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