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STMicroelectronics STM32MP133CAG3

Part No.:
STM32MP133CAG3
Manufacturer:
STMicroelectronics
Category:
Microprocessors
Package:
289-TFBGA
Datasheet:
AetrixSTM32MP133CAG3.pdf
Description:
Linear IC's
Quantity:
Payment:
Payment
Shipping:
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Inventory:4,120

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Product details

Overview

STM32MP133CAG3 from STMicroelectronics is a dual-core Arm® Cortex®-A7 microprocessor operating up to 1 GHz, featuring dual Ethernet MAC/GMAC (IEEE 1588v2), dual CAN FD controllers, two 12-bit ADCs (5 Msps), hardware crypto acceleration (AES-128/192/256, SHA-256/512, PKA), and TrustZone®-enabled secure boot. It targets industrial HMI, edge gateway, and smart building control systems requiring real-time connectivity and cryptographic integrity.

For engineers reviewing the STM32MP133CAG3 datasheet, STM32MP133CAG3 pinout, STM32MP133CAG3 application, or STM32MP133CAG3 equivalent, key selection considerations include DDR3/LPDDR3 memory interface timing, CAN FD bit-rate configurability, TrustZone peripheral partitioning, and dual-USB HS host/OTG coexistence capability.

Technical Context

The STM32MP133CAG3 integrates two Arm Cortex-A7 cores with shared 128 KB L2 cache, NEON™ SIMD support, and TrustZone® for hardware-enforced secure/non-secure world isolation. Its interconnect matrix comprises a 64-bit AXI bus (266 MHz) and 32-bit AHB bus (209 MHz), enabling concurrent high-bandwidth peripheral access.

Security architecture includes BSEC OTP fuses (3072-bit), tamper detection on 12 pins (5 active), AES-256 DRAM encryption, and dedicated PKA for ECC/RSA with DPA protection. Clock management uses four fractional PLLs - PLL1 for CPU, PLL2 for DDR, PLL3/4 for peripherals - with independent frequency domains for power optimization.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreDual Arm Cortex-A7 @ up to 1 GHz; enables Linux-capable real-time processing with NEON for signal/audio workloads.
Memory Interface16-bit DDR3/DDR3L-1066 or LPDDR2/LPDDR3-1066 up to 1 Gbyte; supports deterministic latency for industrial control stacks.
Secure BootHardware-rooted boot via BSEC OTP and TrustZone address space controller (TZC); prevents unauthorized firmware execution.
CAN FD Support2 × FDCAN controllers compliant with ISO 11898-1:2015; supports data phase bit rates up to 5 Mbit/s for automotive diagnostics.
ADC Performance2 × 12-bit SAR ADCs, 5 Msps max sample rate with hardware oversampling; suitable for motor current sensing and analog sensor aggregation.
Crypto AccelerationAES-128/192/256, SHA-224/256/384/512, HMAC, PKA (ECC/RSA), TRNG (6 oscillators); offloads TLS 1.3 handshake and secure OTA updates.
PackageTFBGA289 (9 × 9 mm, 0.5 mm pitch); RoHS-compliant ECOPACK2 package optimized for thermal dissipation in fanless edge devices.

Pinout & Package

STM32MP133CAG3 is housed in a TFBGA289 package (9 × 9 mm, 0.5 mm pitch), with 289 solder balls arranged in a 17 × 17 grid (excluding corner dummy balls). Ball pitch and layout comply with JEDEC MO-271AB standard and support automated optical inspection (AOI) and X-ray void detection during reflow.

Pin/TerminalCircuit RoleDesign Meaning
VDDCORECore power supply1.0 V ±5% regulated input for CPU and L2 cache; requires low-noise ceramic decoupling near package.
VDDQ_DDRDDR I/O supply1.2 V or 1.35 V supply for DDR3/LPDDR3 interface; must be sequenced after VDDCORE per power-up timing spec.
NRSTActive-low reset inputAsynchronous reset assertion resets all logic domains; internal pull-up ensures safe state at power-on without external circuitry.
BOOT0Boot mode selectionHigh at power-up selects primary boot from eMMC/SD card; low selects fallback from SPI NOR via QUADSPI interface.
ETH1_RXD0–3Gigabit Ethernet receive dataDifferential RGMII inputs supporting IEEE 1588v2 timestamp capture with sub-100 ns precision for time-sensitive networking.
FDCAN1_TX/RXCAN FD transceiver interfaceDirect connection to ISO 11898-2 transceiver; supports protocol-defined bit-rate switching between nominal and data phases.

Key Features

FeatureDesign Value
TrustZone-enabled peripheral isolationETZPC enforces secure/non-secure access rights per peripheral register bank, enabling certified secure firmware partitions.
Dual-USB HS host + OTGSimultaneous operation of USB 2.0 high-speed host (e.g., for camera or storage) and OTG (e.g., for debug or device-mode firmware update).
Audio subsystem2 × SAI + SPDIFRX + I2S-capable SPI; supports stereo audio playback, PDM microphone array input, and professional digital audio transport.
Low-power timer suite5 × 16-bit LPTIMs with ultra-low leakage (<1 µA in Stop2 mode); enables precise wake-up scheduling while preserving RTC calendar and backup SRAM.
Flexible memory controller (FMC)Supports NAND flash with 8-bit ECC, parallel NOR, and SRAM interfaces; eliminates need for external memory controller in legacy industrial UI designs.

Applications

Industrial HMI PanelSmart Building Gateway

Use Scenario: Touch-enabled display running Linux-based Qt application with local PLC communication and remote cloud telemetry.

IC Role / Device Role / Timing Role: Main application processor managing GUI rendering, CAN FD fieldbus polling, and AES-256 encrypted MQTT transmission over dual Ethernet.

Use Value: Integrated DDR controller and TrustZone reduce BOM cost vs. discrete MPU+security IC; dual Ethernet enables redundant LAN and isolated management network.

Use Scenario: HVAC controller aggregating Modbus RTU sensors, BLE actuators, and wired KNX/EIB via Ethernet backbone.

IC Role / Device Role / Timing Role: Central protocol translator with hardware-accelerated crypto for secure firmware updates and time-synchronized sensor logging via IEEE 1588v2.

Use Value: Dual CAN FD handles legacy building automation buses; SPDIFRX and SAI enable audio alarm integration without external codec.

Edge AI Vision NodeAutomotive Diagnostic Tool

Use Scenario: Compact vision system performing real-time object detection using TensorFlow Lite Micro on Cortex-A7, feeding results to cloud via USB host-connected LTE modem.

IC Role / Device Role / Timing Role: Vision processing hub with dual QUADSPI for fast model loading from NOR flash and hardware DFSDM for vibration sensor analytics.

Use Value: On-the-fly AES DRAM encryption protects inference models in memory; NEON acceleration delivers >3.2 GOPS for lightweight CNN inference.

Use Scenario: Handheld OBD-II scanner supporting UDS, DoIP, and CAN FD diagnostics across multiple vehicle ECUs.

IC Role / Device Role / Timing Role: Protocol engine with dual FDCAN controllers, ISO 15765-2 transport layer, and secure bootloader for regulatory-compliant firmware signing.

Use Value: Hardware CRC unit validates diagnostic message integrity; tamper pins detect physical intrusion attempts during ECU reprogramming.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core Arm Cortex-A7 microprocessor applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
NXP i.MX 8M Mini (LPC54608)Single Cortex-A53 core, no TrustZone-peripheral controller, lacks CAN FD and IEEE 1588v2 hardware timestamping.Better suited for audio-centric consumer IoT; insufficient for industrial safety-critical CAN FD diagnostics.Select when cost sensitivity outweighs CAN FD and hardware security requirements.
Renesas RZ/G2L (R9A07G043L2)Single Cortex-A55 core, integrated 3D GPU, no hardware DFSDM or SPDIFRX; supports only single Ethernet MAC.Optimized for rich GUI and video playback; lacks dual-CAN FD and dual-GMAC needed for redundancy-critical gateways.Prefer for multimedia HMI where graphics performance dominates over fieldbus determinism.

Compared with i.MX 8M Mini and RZ/G2L, the STM32MP133CAG3 uniquely combines dual CAN FD, dual IEEE 1588v2 Ethernet, and TrustZone-peripheral isolation in a single die-enabling consolidated edge gateway designs without external security co-processors or protocol bridges.

Availability

STM32MP133CAG3 is available at Aetrix Electronics and suitable for industrial HMI, smart building gateways, and edge AI vision nodes requiring stable component supply, long-term lifecycle assurance, and traceable sourcing for ISO 13485 and IEC 62443 compliance programs.

Supply support for STM32MP133CAG3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, MEMS, and automotive-grade processors with vertical fabrication capacity.

The STM32MP series targets heterogeneous computing for Linux-capable edge devices, combining real-time Cortex-M co-processors (in other variants) or bare-metal A7 subsystems with industrial-grade peripherals and hardware security for IIoT and smart infrastructure.

FAQ

What boot sources does the STM32MP133CAG3 support?

The STM32MP133CAG3 supports primary boot from eMMC/SD card, secondary boot from SPI NOR flash via QUADSPI, and fallback boot from UART or USB OTG. Boot mode is selected by BOOT0 pin state and internal OTP configuration, with secure boot enforced by BSEC and TrustZone address space controller before any code execution.

Does the STM32MP133CAG3 support DDR3L memory at 1066 MT/s?

Yes, the STM32MP133CAG3's DDRCTRL supports DDR3L-1066 (533 MHz clock) with 16-bit data bus width and configurable read/write leveling. Electrical characteristics specify tAC ≤ 0.45 ns and tDQSS ≤ 0.25 ns for reliable operation under industrial temperature range (–40°C to +105°C) with proper PCB stack-up and termination.

How many tamper detection pins are available, and what types are supported?

The STM32MP133CAG3 provides 12 dedicated tamper pins (TAMP1–TAMP12), including 5 active-tamper inputs with voltage-level monitoring and 7 passive-tamper inputs with edge detection. All tamper events trigger immediate secure domain reset and erase of sensitive keys stored in backup SRAM or OTP, per ST's AN5502 implementation guide.

Can the two Ethernet MACs operate simultaneously in different modes?

Yes, ETH1 and ETH2 support independent configurations: ETH1 can run in RGMII mode for full Gigabit throughput with IEEE 1588v2 hardware timestamping, while ETH2 operates in RMII mode for 10/100 Mbps management traffic. Both MACs share the same AXI interconnect but use separate DMA channels and interrupt vectors, enabling concurrent real-time and best-effort traffic handling.

STM32MP133CAG3 Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Package/Case:
289-TFBGA
Series:
STM32MP1
Packaging:
Tray
Product Status:
Active
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
650MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps (2)
SATA:
-
USB:
USB 2.0 (2)
Voltage - I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
-
Qualification:
-
Security Features:
AES, ARM TZ, Boot Security, Cryptography, Secure Debug, SHA-1/2, Tamper Detection, TRNG, Volatile key Storage
Mounting Type:
Surface Mount
Supplier Device Package:
289-TFBGA (9x9)
Additional Interfaces:
CANbus, GPIO, I2C, I2S, IrDA, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART

STM32MP133CAG3 FAQ

1.How can I place an order for STM32MP133CAG3 through Aetrix?

Please submit a Request for Quotation (RFQ) for STM32MP133CAG3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STM32MP133CAG3 reliable?

The price and inventory of STM32MP133CAG3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32MP133CAG3 is usually 5 days.

3.What payment methods are accepted for STM32MP133CAG3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32MP133CAG3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STM32MP133CAG3?

STM32MP133CAG3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STM32MP133CAG3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STM32MP133CAG3?

For technical support, including STM32MP133CAG3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32MP133CAG3 requirements.

6.How does Aetrix verify that STM32MP133CAG3 is sourced from the original manufacturer or authorized distributors?

All STM32MP133CAG3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32MP133CAG3 meets industry standards.

7.What is the process for return or replacement of STM32MP133CAG3?

All STM32MP133CAG3 units undergo pre-shipment inspection (PSI). If there is an issue with STM32MP133CAG3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STM32MP133CAG3 part is unused and in its original packaging.

Return procedure for STM32MP133CAG3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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