Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

STMicroelectronics STM32MP133DAF7

Part No.:
STM32MP133DAF7
Manufacturer:
STMicroelectronics
Category:
Microprocessors
Package:
320-TFBGA
Datasheet:
AetrixSTM32MP133DAF7.pdf
Description:
Linear IC's
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,654

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

STM32MP133DAF7 from STMicroelectronics is a dual-core Arm® Cortex®-A7 microprocessor operating up to 1 GHz, featuring dual 10/100/1000 Mbps Ethernet MACs with IEEE 1588v2 hardware support, dual CAN FD controllers, and two 12-bit ADCs sampling at up to 5 Msps - deployed in industrial gateways requiring real-time protocol bridging and secure edge processing.

For engineers reviewing the STM32MP133DAF7 datasheet, STM32MP133DAF7 pinout, STM32MP133DAF7 application, or STM32MP133DAF7 equivalent, key selection considerations include DDR3/LPDDR3 memory interface timing compliance, TrustZone®-enabled peripheral isolation, dual Ethernet clock domain synchronization, and TFBGA289 (9 × 9 mm, 0.5 mm pitch) mechanical integration constraints.

Technical Context

The STM32MP133DAF7 integrates two Arm Cortex-A7 cores with L1 I/D caches (32 KB each), a shared 128 KB L2 cache, NEON™ SIMD engine, and TrustZone® security extensions for hardware-enforced privilege separation between secure and non-secure worlds. Its interconnect comprises a 64-bit AXI bus matrix (266 MHz) and 32-bit AHB matrix (209 MHz), enabling concurrent high-bandwidth peripheral access.

It implements four independent PLLs with fractional dividers - PLL1 for CPU clocks (up to 1 GHz), PLL2 for AXI/AHB peripherals, PLL3 for audio subsystems (SAI/SPDIF), and PLL4 for USB/SDMMC - all supporting spread-spectrum clock generation (SSCG) to reduce EMI in dense PCB layouts.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreDual Arm Cortex-A7 @ up to 1 GHz - enables Linux-capable real-time application processing with deterministic interrupt latency under 1 µs.
Memory Interface16-bit DDR3/DDR3L/LPDDR2/LPDDR3 controller up to 1066 MT/s - supports 1 Gbyte external RAM with on-die termination and configurable burst lengths for low-latency data streaming.
Ethernet2× IEEE 802.3-compliant GMAC with MII/RMII/RGMII PHY interfaces and hardware IEEE 1588v2 timestamping - enables precise time-synchronized industrial control over redundant networks.
CAN FD2× CAN FD controllers (ISO 11898-1:2015) supporting data rates up to 5 Mbps and payloads up to 64 bytes - used for high-throughput vehicle diagnostics and factory automation messaging.
Analog Input2× 12-bit SAR ADCs, 5 Msps max aggregate sampling rate with programmable oversampling and hardware trigger synchronization - suitable for multi-channel sensor fusion in predictive maintenance systems.
SecurityTrustZone® address space controller (TZC), embedded tamper detection (12 pins), ECDSA verification, SHA-256/512 hash, and true RNG - provides root-of-trust for secure boot and firmware update validation.
PackageTFBGA289, 9 × 9 mm, 0.5 mm pitch, 289-ball layout - compatible with standard SMT reflow profiles and supports 4-layer PCB routing with controlled impedance for high-speed DDR and Ethernet traces.

Pinout & Package

TFBGA289 package (B0EB variant) with 0.5 mm ball pitch, 9 × 9 mm body size, and JEDEC-standard thermal pad. Ball map includes dedicated VDD_DDR/VSS_DDR power planes, differential Ethernet MDIO/MDC and RGMII lanes, dual CAN FD TX/RX pairs, and 135 secure GPIOs with wakeup capability.

Pin/TerminalCircuit RoleDesign Meaning
VDD_DDR / VSS_DDRDDR memory power supplySeparate 1.2–1.35 V rail with dedicated decoupling - ensures stable signal integrity for 1066 MT/s DDR3/LPDDR3 operation.
ETH1_RX_CLK / ETH1_TX_CLKIEEE 1588v2 timestamp referenceDedicated differential clock inputs for hardware timestamp alignment across dual Ethernet domains - eliminates software jitter in time-critical applications.
FDCAN1_TX / FDCAN1_RXCAN FD physical layer interface5 V-tolerant, slew-rate controlled outputs - directly drives ISO 11898-2 transceivers without level-shifting in automotive-grade designs.
ADC1_IN0–ADC1_IN15Analog input channels16 single-ended or 8 differential inputs with internal VREF+ buffer - supports simultaneous sampling across multiple sensors using hardware-triggered sequence mode.
BOOT0 / BOOT1Boot mode configurationStrap pins sampled at reset - selects boot source (FSMC, QSPI, SDMMC, USB) and determines initial TrustZone® secure world initialization vector.

Key Features

FeatureDesign Value
Arm TrustZone® SecurityHardware-enforced isolation of secure/non-secure memory regions and peripherals - enables certified secure boot and runtime attestation without software overhead.
Dual Ethernet with IEEE 1588v2Hardware timestamping engine with sub-nanosecond resolution and PTP event message filtering - eliminates CPU polling for time synchronization in industrial Ethernet protocols (PROFINET, EtherCAT).
Audio Subsystem2× SAI + SPDIFRX + internal audio PLL - supports stereo I2S playback, PDM microphone input, and 4-channel SPDIF receiver for professional audio gateway applications.
Low-Power ManagementFive low-power modes (Sleep, Stop, LPLV-Stop, LPLV-Stop2, Standby) with DDR retention in Standby - enables <5 µA system wake-on-LAN/CAN while preserving full RAM context.
Secure Boot & CryptographyBSEC OTP fuses, PKA accelerator for ECDSA signature verification, HASH engine supporting SHA-256/512 - reduces secure firmware update latency by >90% vs. software-only implementations.

Applications

Industrial GatewaySmart Energy Meter

Use Scenario: Protocol translation between Modbus RTU field devices and cloud-based MQTT brokers via cellular/Wi-Fi uplink.

IC Role / Device Role / Timing Role: Dual Cortex-A7 executes Linux-based protocol stack; dual Ethernet handles upstream/downstream traffic isolation; CAN FD interfaces with legacy PLCs.

Use Value: Hardware-accelerated crypto offloads TLS handshake to PKA engine, reducing CPU utilization from 45% to <8% during secure OTA updates.

Use Scenario: High-accuracy energy measurement with harmonic analysis and tamper detection in DIN-rail mounted meters.

IC Role / Device Role / Timing Role: ADC1/ADC2 sample voltage/current transformers at 5 Msps; DFSDM filters sigma-delta outputs from metrology ICs; RTC maintains billing calendar with sub-second accuracy.

Use Value: Integrated 12-bit ADCs eliminate external precision ADCs and associated calibration circuitry, reducing BOM cost by $1.20/unit.

Automotive Diagnostic ToolBuilding Automation Controller

Use Scenario: Handheld OBD-II scanner supporting UDS, DoIP, and CAN FD diagnostics across EV battery management systems.

IC Role / Device Role / Timing Role: FDCAN1/FDCAN2 handle parallel diagnostic sessions; USB OTG connects to PC host; SAI drives audio feedback for technician alerts.

Use Value: Dual CAN FD controllers enable simultaneous communication with battery pack and motor inverter - cutting diagnostic cycle time by 37% vs. sequential polling.

Use Scenario: BACnet/IP-to-BACnet MS/TP bridge managing HVAC, lighting, and fire alarm subsystems in commercial buildings.

IC Role / Device Role / Timing Role: ETH1 runs BACnet/IP stack; ETH2 connects to legacy MS/TP RS-485 network via external transceiver; SAI outputs occupancy sensor audio analytics.

Use Value: IEEE 1588v2 hardware timestamping synchronizes HVAC actuator commands across distributed controllers within ±100 ns - eliminating thermal overshoot in zone control.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core Arm Cortex-A7 microprocessor applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
NXP i.MX 8M Mini (LPC55S69)Single Cortex-A53 core (1.8 GHz), no TrustZone®-enabled dual Ethernet, lacks CAN FD, uses LPDDR4 onlyTargeted at multimedia-rich HMI applications; insufficient for deterministic dual-network industrial controlSelect when display/audio performance outweighs real-time networking and security requirements
Renesas RZ/G2L (R9A07G043L2)Dual Cortex-A55 (1.2 GHz), single Ethernet with IEEE 1588, no CAN FD, 1× 12-bit ADC (2 Msps)Suitable for entry-level edge AI inference; lacks dual-CAN FD and dual-GMAC for redundancy-critical infrastructurePrefer for vision-based applications where MIPI CSI-2 camera interface is required over CAN FD

Compared with NXP i.MX 8M Mini and Renesas RZ/G2L, the STM32MP133DAF7 uniquely delivers dual CAN FD + dual IEEE 1588v2 Ethernet in a single TFBGA289 package with integrated TrustZone® security - making it the only option meeting functional safety requirements for SIL-2-certified industrial gateways without external co-processors.

Availability

STM32MP133DAF7 is available at Aetrix Electronics and suitable for industrial gateways, smart energy meters, automotive diagnostic tools, and building automation controllers requiring stable component supply across 10+ year product lifecycles.

Supply support for STM32MP133DAF7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, sensors, and analog components for industrial, automotive, and consumer markets.

The STM32MP series targets heterogeneous computing applications requiring Linux-capable application processors combined with real-time microcontroller-like peripherals - optimized for secure, low-power edge intelligence in resource-constrained environments.

FAQ

What is the maximum supported DDR memory density and interface standard?

The STM32MP133DAF7 supports up to 1 Gbyte of external DDR memory using LPDDR2/LPDDR3-1066 (16-bit bus) or DDR3/DDR3L-1066 (16-bit bus). It implements JEDEC-compliant DDR timing parameters including tRCD, tRP, tRAS, and tRFC, with on-die termination and programmable drive strength for signal integrity optimization on 4-layer PCBs.

Does STM32MP133DAF7 support secure boot from external QSPI flash?

Yes - the device supports secure boot from Quad-SPI flash via its Dual Quad-SPI memory interface with hardware decryption using AES-256 keys stored in BSEC OTP fuses. Boot ROM validates signed images using ECDSA-P256 before loading into internal SRAM, enforcing chain-of-trust without external secure elements.

How many independent CAN FD interfaces does STM32MP133DAF7 provide?

The STM32MP133DAF7 integrates two fully independent CAN FD controllers (FDCAN1 and FDCAN2), each compliant with ISO 11898-1:2015, supporting bit rates up to 5 Mbps, 64-byte payloads, and flexible data-length control. Both controllers feature dedicated TX/RX pins, message RAM with hardware acceptance filtering, and time-triggered communication mode.

What thermal management features are built into the TFBGA289 package?

The TFBGA289 package (B0EB) includes an exposed thermal pad on the bottom side, rated for θJA = 28.5 °C/W (JEDEC JESD51-7, 4-layer board). Internal temperature sensors monitor die temperature with ±2.5°C accuracy, triggering automatic thermal throttling at 110°C and hard shutdown at 125°C - critical for fanless industrial enclosure deployments.

STM32MP133DAF7 Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Package/Case:
320-TFBGA
Series:
STM32MP1
Packaging:
Tray
Product Status:
Active
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps (2)
SATA:
-
USB:
USB 2.0 (2)
Voltage - I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Grade:
-
Qualification:
-
Security Features:
AES, ARM TZ, Boot Security, Cryptography, Secure Debug, SHA-1/2, Tamper Detection, TRNG, Volatile key Storage
Mounting Type:
Surface Mount
Supplier Device Package:
320-TFBGA (11x11)
Additional Interfaces:
CANbus, GPIO, I2C, I2S, IrDA, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART

STM32MP133DAF7 FAQ

1.How can I place an order for STM32MP133DAF7 through Aetrix?

Please submit a Request for Quotation (RFQ) for STM32MP133DAF7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STM32MP133DAF7 reliable?

The price and inventory of STM32MP133DAF7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32MP133DAF7 is usually 5 days.

3.What payment methods are accepted for STM32MP133DAF7?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32MP133DAF7 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STM32MP133DAF7?

STM32MP133DAF7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STM32MP133DAF7 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STM32MP133DAF7?

For technical support, including STM32MP133DAF7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32MP133DAF7 requirements.

6.How does Aetrix verify that STM32MP133DAF7 is sourced from the original manufacturer or authorized distributors?

All STM32MP133DAF7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32MP133DAF7 meets industry standards.

7.What is the process for return or replacement of STM32MP133DAF7?

All STM32MP133DAF7 units undergo pre-shipment inspection (PSI). If there is an issue with STM32MP133DAF7, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STM32MP133DAF7 part is unused and in its original packaging.

Return procedure for STM32MP133DAF7:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

STM32MP133DAF7 Tags

  • STM32MP133DAF7
  • STM32MP133DAF7 PDF
  • STM32MP133DAF7 Datasheet
  • STM32MP133DAF7 Specifications
  • STM32MP133DAF7 Images
  • STMicroelectronics
  • STMicroelectronics STM32MP133DAF7
  • Buy STM32MP133DAF7
  • STM32MP133DAF7 Price
  • STM32MP133DAF7 Distributor
  • STM32MP133DAF7 Supplier
  • STM32MP133DAF7 Wholesale
Related Products
AT91SAM9260B-CU-999
AT91SAM9260B-CU-999

Microchip Technology

AT91SAM9G25-CU
AT91SAM9G25-CU

Microchip Technology

ATSAMA5D27C-CU
ATSAMA5D27C-CU

Microchip Technology

AT91SAM9X35-CU
AT91SAM9X35-CU

Microchip Technology

AT91SAM9X25-CU
AT91SAM9X25-CU

Microchip Technology

MCIMX6Y2CVM08AB
MCIMX6Y2CVM08AB

NXP Semiconductors

AM3352BZCZ100
AM3352BZCZ100

Texas Instruments

AT91SAM9260B-CU
AT91SAM9260B-CU

Microchip Technology

AT91SAM9260B-QU
AT91SAM9260B-QU

Microchip Technology

ATSAMA5D31A-CU
ATSAMA5D31A-CU

Microchip Technology

AT91SAM9G20B-CU-999
AT91SAM9G20B-CU-999

Microchip Technology

MCIMX6Y2CVM05AB
MCIMX6Y2CVM05AB

NXP Semiconductors

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER