STMicroelectronics STM32MP153CAA3T
- Part No.:
- STM32MP153CAA3T
- Manufacturer:
- STMicroelectronics
- Category:
- Microprocessors
- Package:
- 448-LFBGA
- Datasheet:
-
STM32MP153CAA3T.pdf
- Description:
- IC MPU STM32MP1 650MHZ 448LFBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
STM32MP153CAA3T from STMicroelectronics is a dual-core Arm® Cortex®-A7 (800 MHz) + Cortex®-M4 microprocessor unit (MPU) with TrustZone®, NEON™, and hardware crypto acceleration (AES-256, SHA-256, RNG). It integrates TFT LCD controller (up to 1920×1080@30 fps), 37 communication interfaces including dual CAN FD (one TTCAN), Gigabit Ethernet GMAC, and 2× USB 2.0 HS ports - deployed in industrial HMIs, edge gateways, and smart building controllers.
For engineers reviewing the STM32MP153CAA3T datasheet, STM32MP153CAA3T pinout, STM32MP153CAA3T application, or STM32MP153CAA3T equivalent, key selection criteria include dual-core Linux-capable architecture, DDR3/LPDDR3 memory support up to 1 Gbyte, 708 KB on-chip SRAM split across AXI/AHB domains, TrustZone-enabled secure boot, and TFBGA361 (12×12 mm, 0.5 mm pitch) package compatibility with industrial thermal and EMI requirements.
Technical Context
The device implements a heterogeneous dual-core architecture: two Cortex-A7 cores run Linux-based applications with 256 KB unified L2 cache and Arm NEON for signal processing, while the Cortex-M4 (209 MHz) handles real-time control, sensor fusion, or safety-critical tasks via dedicated inter-processor communication (IPCC) and hardware semaphores (HSEM). TrustZone enforces strict memory and peripheral isolation between secure and non-secure worlds.
Its clock system includes five fractional PLLs supporting precise timing for audio (SAI/I2S), video (LTDC pixel clock up to 90 MHz), and industrial networking (IEEE 1588v2 in GMAC). The interconnect matrix comprises a 64-bit AXI bus (266 MHz) and 32-bit AHB bus (209 MHz), enabling concurrent high-bandwidth data flows between DDR, peripherals, and CPU subsystems without contention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual Arm Cortex-A7 @ 800 MHz + single Cortex-M4 @ 209 MHz - enables Linux + RTOS coexistence with hardware-isolated execution environments. |
| Memory Interface | LPDDR2/LPDDR3-1066 or DDR3/DDR3L-1066 (16/32-bit, up to 1 Gbyte) - supports low-power mobile DRAM and cost-effective industrial SDRAM. |
| On-chip SRAM | 708 KB total: 256 KB AXI SYSRAM + 384 KB AHB SRAM + 64 KB Backup SRAM + 4 KB Backup SRAM - enables fast code/data access, retention during Standby, and secure state storage. |
| Crypto Acceleration | AES-128/192/256, TDES, SHA-1/224/256, HMAC, 2× TRNG - offloads cryptographic operations from CPU, meeting IEC 62443-3-3 SL2 requirements. |
| Graphics & Display | LCD-TFT controller with dual layer, programmable LUT, up to Full HD (1920×1080@30 fps) - eliminates external display bridge IC in HMI designs. |
| Communication Peripherals | 2× CAN FD (1× TTCAN), 6× I2C, 8× UART/USART, 6× SPI, 4× SAI, SPDIF-Rx, GMAC (10/100/1000 Mbps), HDMI-CEC - supports multi-protocol industrial fieldbus and multimedia connectivity. |
| Analog Subsystem | 2× 16-bit ADC (up to 3.6 Msps), 2× 12-bit DAC (1 MHz), DFSDM (8-channel sigma-delta filtering), temp sensor - enables precision analog sensing and closed-loop control without external converters. |
Pinout & Package
STM32MP153CAA3T uses a TFBGA361 package (12 × 12 mm, 0.5 mm ball pitch, RoHS-compliant ECOPACK2), optimized for thermal dissipation and PCB routing density in space-constrained industrial modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDCORE | Core power supply | 1.1 V ±5% supply for Cortex-A7/M4 cores and L2 cache - requires low-noise regulation and local decoupling per ST layout guidelines. |
| VDDIO_3V3 | I/O power domain | 3.3 V supply for all general-purpose I/Os (5 V-tolerant) - enables direct interfacing with legacy industrial logic without level shifters. |
| NRST | Asynchronous reset input | Active-low reset asserting full chip reset; synchronous deassertion ensures controlled boot sequence initiation. |
| BOOT0 | Boot mode selection | High at power-up selects internal ROM bootloader; used with BOOT1 to configure boot source (FSMC, QSPI, SDMMC, USB, etc.). |
| OSC_IN / OSC_OUT | External crystal oscillator interface | Supports 8–48 MHz HSE for system clock accuracy; paired with 32.768 kHz LSE for RTC calendar functions. |
| ETH_MDIO / ETH_MDC | Ethernet management interface | Provides IEEE 802.3-compliant MDIO/MDC access to GMAC PHY registers for link configuration and status monitoring. |
| USB_OTG_HS_DP / DM | USB 2.0 high-speed differential pair | Full-speed OTG operation requires internal PHY enable; HS mode requires external ULPI or HS PHY connection. |
Key Features
| Feature | Design Value |
|---|---|
| TrustZone-enabled secure boot | Verifies signed firmware images before execution and isolates secure peripherals (RNG, CRYP, BSEC) from non-secure world. |
| Dual-domain SRAM architecture | AXI SYSRAM (256 KB) for high-bandwidth CPU access; AHB SRAM (384 KB) for DMA/peripheral buffering; Backup SRAM retains data in Standby mode. |
| Hardware-accelerated multimedia | SAI interfaces support stereo I2S/PDM/SPDIF with internal audio PLL; LTDC supports RGB888, alpha blending, and dual-layer overlay for rich GUI rendering. |
| Industrial-grade timer suite | 29 timers including 2× advanced motor-control timers (TIM1/TIM8), 10× GP timers, 5× LP timers, and RTC with sub-second accuracy - covers servo control, PWM generation, and time-stamped event logging. |
| Flexible memory expansion | FMC supports NAND flash (SLC, 8-bit ECC), NOR, PSRAM, and SRAM; Quad-SPI supports XIP execution from serial flash - reduces BOM cost and footprint. |
Applications
| Industrial HMI | Edge Gateway |
|---|---|
|
Use Scenario: Touchscreen-based operator interface for PLC-controlled machinery with real-time diagnostics and remote maintenance via cellular/Wi-Fi. IC Role / Device Role / Timing Role: MPU executes Linux Qt application, drives 1080p TFT panel via LTDC, manages CAN FD fieldbus communication, and runs M4-based safety watchdog logic. Use Value: Single-chip integration of display, networking, and real-time control eliminates multi-chip coordination overhead and reduces board area by >40% vs discrete SoC+FPGA solutions. |
Use Scenario: Protocol translation hub aggregating Modbus RTU, CANopen, and BACnet MS/TP traffic into MQTT/HTTP for cloud telemetry in smart buildings. IC Role / Device Role / Timing Role: Cortex-A7 hosts containerized protocol stacks; Cortex-M4 handles deterministic packet parsing and timestamping using GMAC IEEE 1588v2 hardware. Use Value: Hardware timestamping accuracy <±50 ns enables synchronized sensor data correlation across distributed HVAC zones without NTP drift compensation. |
| Smart Energy Meter | Medical Imaging Terminal |
|
Use Scenario: DIN-rail mounted meter with tamper detection, encrypted energy logging, and DLMS/COSEM over PRIME or G3-PLC. IC Role / Device Role / Timing Role: Secure boot validates firmware; TrustZone isolates crypto keys; DFSDM processes sigma-delta current sensors; active tamper pins detect enclosure breach. Use Value: On-chip AES-256 and HMAC accelerate DLMS encryption/decryption, achieving >10 kbps authenticated throughput without CPU saturation. |
Use Scenario: Portable ultrasound console requiring low-latency image acquisition, real-time beamforming, and DICOM export over Gigabit Ethernet. IC Role / Device Role / Timing Role: DCMI captures 140 MB/s raw sensor data; Cortex-M4 performs FPGA-like beamforming; GMAC transmits compressed frames with IEEE 1588 timestamping. Use Value: Dual-bus interconnect prevents bandwidth starvation between camera interface, GPU, and network stack - maintains 30 fps full-HD DICOM streaming under full CPU load. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar MPU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP i.MX 8M Mini (LPC55S69) | Quad Cortex-A53 + Cortex-M33; lacks integrated TFT controller and TrustZone-peripheral isolation; no built-in CAN FD. | Better for Android-based UIs but requires external display bridge and separate CAN transceivers. | Select when prioritizing Android compatibility and multi-core A53 performance over display integration and industrial fieldbus support. |
| Renesas RZ/G2L (R9A07G043 | Single Cortex-A55 + Cortex-M33; lower DDR bandwidth (LPDDR4 only); no hardware crypto accelerators (AES/SHA). | Suitable for lightweight Linux gateways but not for crypto-heavy secure boot or high-resolution graphics. | Select for cost-sensitive, low-power gateway designs where display output and hardware crypto are not required. |
Compared with i.MX 8M Mini and RZ/G2L, STM32MP153CAA3T uniquely combines Linux-capable dual A7 cores, integrated TFT controller, dual CAN FD with TTCAN, and full TrustZone peripheral protection - making it optimal for certified industrial HMIs and edge devices requiring both rich UI and deterministic fieldbus control.
Availability
STM32MP153CAA3T is available at Aetrix Electronics and suitable for industrial HMIs, edge gateways, and smart energy meters requiring stable component supply, long-term manufacturability, and automotive-grade reliability (AEC-Q100 not applicable, but qualified per industrial temp range –40°C to +125°C).
Supply support for STM32MP153CAA3T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, MEMS, and automotive semiconductors since 1987.
The STM32MP series targets heterogeneous computing for industrial and IoT edge applications, combining Linux-capable application processors with real-time microcontroller cores - bridging the gap between traditional MCUs and high-end SoCs.
FAQ
What is the maximum DDR memory capacity supported by STM32MP153CAA3T?
The device supports up to 1 Gbyte of external DDR memory, compatible with LPDDR2/LPDDR3-1066 (16/32-bit) and DDR3/DDR3L-1066 (16/32-bit) configurations. This capacity is validated in ST's reference designs and aligns with JEDEC specifications for those memory types.
Does STM32MP153CAA3T include hardware support for IEEE 1588 Precision Time Protocol?
Yes - the integrated Gigabit Ethernet MAC (GMAC) includes full IEEE 1588v2 hardware timestamping capability, supporting one-step and two-step PTP modes with hardware-assisted correction of ingress/egress delays, enabling sub-microsecond synchronization accuracy in industrial automation networks.
How many secure I/O pins does STM32MP153CAA3T provide, and what is their function?
It provides up to 8 secure GPIOs, configurable via the ETZPC (Embedded TrustZone Protection Controller) to restrict access to non-secure software. These pins are used for tamper detection, secure button inputs, or isolated control signals in certified security applications such as payment terminals or energy meters.
Can the Cortex-M4 core run independently while the Cortex-A7 cores are in Standby mode?
Yes - the Cortex-M4 can operate in autonomous mode during A7 Standby, utilizing its own clock domain and accessing AHB SRAM and peripherals like timers, ADC, and UART. This enables ultra-low-power sensor monitoring (<2 µA total system current) without waking the Linux subsystem.
STM32MP153CAA3T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 448-LFBGA
- Series:
- STM32MP1
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A7
- Number of Cores/Bus Width:
- 2 Core, 32-Bit
- Speed:
- 209MHz, 650MHz
- Co-Processors/DSP:
- ARM® Cortex®-M4
- RAM Controllers:
- DDR3, DDR3L, LPDDR2, LPDDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- HDMI-CEC, LCD
- Ethernet:
- 10/100Mbps (1)
- SATA:
- -
- USB:
- USB 2.0 (2), USB 2.0 OTG+ PHY (3)
- Voltage - I/O:
- 2.5V, 3.3V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 448-LFBGA (18x18)
- Additional Interfaces:
- CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB
STM32MP153CAA3T FAQ
1.How can I place an order for STM32MP153CAA3T through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32MP153CAA3T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32MP153CAA3T reliable?
The price and inventory of STM32MP153CAA3T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32MP153CAA3T is usually 5 days.
3.What payment methods are accepted for STM32MP153CAA3T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32MP153CAA3T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STM32MP153CAA3T?
STM32MP153CAA3T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32MP153CAA3T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32MP153CAA3T?
For technical support, including STM32MP153CAA3T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32MP153CAA3T requirements.
6.How does Aetrix verify that STM32MP153CAA3T is sourced from the original manufacturer or authorized distributors?
All STM32MP153CAA3T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32MP153CAA3T meets industry standards.
7.What is the process for return or replacement of STM32MP153CAA3T?
All STM32MP153CAA3T units undergo pre-shipment inspection (PSI). If there is an issue with STM32MP153CAA3T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32MP153CAA3T part is unused and in its original packaging.
Return procedure for STM32MP153CAA3T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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