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STMicroelectronics STM32MP153CAB3

Name: STM32MP153CAB3
Brand: STMicroelectronics
SKU: STM32MP153CAB3
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: STM32MP153CAB3

Manufacturer:: STMicroelectronics

Category:: Microprocessors

Package:: 354-LFBGA

Datasheet:: STM32MP153CAB3.pdf

Description:: IC MPU STM32MP1 650MHZ 354LFBGA

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Product details

Overview

STM32MP153CAB3 from STMicroelectronics is a dual-core Arm® Cortex®-A7 (800 MHz) + Cortex®-M4 microprocessor unit (MPU) with TrustZone®, NEON™, and hardware crypto acceleration (AES/SHA/HMAC/RNG). It integrates TFT LCD controller (up to 1920×1080@30 fps), 2×16-bit ADCs (up to 4.5 Msps), 2×12-bit DACs, dual CAN FD (one TTCAN), and Gigabit Ethernet MAC - deployed in industrial HMIs, edge gateways, and smart building controllers.

For engineers reviewing the STM32MP153CAB3 datasheet, STM32MP153CAB3 pinout, STM32MP153CAB3 application, or STM32MP153CAB3 equivalent, key selection criteria include dual-core asymmetric processing capability, DDR3/LPDDR3 memory support up to 1 Gbyte, 176 I/Os with secure/tamper functions, and hardware-enforced security via TrustZone® and secure boot.

Technical Context

The STM32MP153CAB3 implements a heterogeneous dual-core architecture: two Cortex®-A7 cores run Linux-based applications with 256-Kbyte unified L2 cache and Arm® NEON™ for signal processing, while the Cortex®-M4 (209 MHz) handles real-time control tasks with FPU and MPU isolation. TrustZone® enforces strict memory and peripheral access partitioning between secure and non-secure worlds.

Its interconnect matrix comprises a 64-bit AXI bus (266 MHz) and 32-bit AHB bus (209 MHz), supporting concurrent high-bandwidth peripherals including GMAC, USB 2.0 HS Host/OTG, SDMMC (eMMC™/SDIO), and HDMI-CEC. The DDR controller supports LPDDR2/LPDDR3-1066 and DDR3/DDR3L-1066 at 16/32-bit widths with hardware ECC.

Key Specifications

Parameter	Value and Actual Design Meaning
CPU Cores	Dual Arm® Cortex®-A7 @ 800 MHz + single Cortex®-M4 @ 209 MHz - enables Linux + RTOS coexistence with hardware-isolated execution environments.
Memory Support	Up to 1 Gbyte external DDR (LPDDR2/LPDDR3-1066 or DDR3/DDR3L-1066); 708 Kbytes on-chip SRAM (256 KB AXI SYSRAM + 384 KB AHB SRAM + 64 KB Backup SRAM) - eliminates need for external RAM in many HMI designs.
Graphics & Display	LCD-TFT controller supporting WXGA (1366×768@60 fps) or Full HD (1920×1080@30 fps); 24-bit RGB888 interface with dual programmable color LUTs - drives high-resolution industrial panels without external GPU.
Analog Peripherals	2×16-bit ADCs (12-bit @ 4.5 Msps, 16-bit @ 3.6 Msps), 2×12-bit DACs (1 MHz), DFSDM with 8 channels, internal temp sensor - enables precision sensor fusion and analog I/O in edge nodes.
Communication Interfaces	6×I²C FM+, 8×UART/USART, 6×SPI (3 with I²S audio accuracy), 4×SAI, 2×CAN FD (1 TTCAN), 2×USB 2.0 HS Host + 1×USB 2.0 FS OTG, Gigabit Ethernet GMAC - supports multi-protocol industrial connectivity stack.
Security Features	Arm® TrustZone®, secure boot, active tamper detection, 3072-bit fuses (96-bit UID), AES-128/192/256, SHA-256, HMAC, dual TRNG - meets IEC 62443-3-3 SL2 requirements for secure firmware updates and data confidentiality.
Power Management	1.71–3.6 V I/O supply (5 V-tolerant), Standby mode current down to 2 µA (no RTC/LSE/BKPSRAM/RETRAM), DDR retention in Standby - enables battery-backed operation in low-power edge devices.

Pinout & Package

STM32MP153CAB3 is packaged in TFBGA361 (12 × 12 mm, 0.5 mm pitch), RoHS-compliant and ECOPACK2 certified. Pin definitions follow ST's B031 package marking (DS12503 Rev 9, Section 7.4).

Pin/Terminal	Circuit Role	Design Meaning
VDDCORE	Core power supply	1.1 V nominal supply for CPU cores and L2 cache; requires tight regulation (±3%) and low-noise filtering per DS12503 Section 6.3.5.
VDDIO	I/O power supply	1.71–3.6 V supply enabling 5 V-tolerant operation; supports mixed-voltage system interfacing without level shifters.
NRST	Asynchronous reset input	Active-low reset pin asserting full chip reset; synchronized internally to avoid metastability during power sequencing.
BOOT0	Boot mode selection	Configures primary boot source (eMMC, SD card, NAND, QSPI, USB) at power-up; sampled at POR and latched.
OSC_IN / OSC_OUT	External crystal oscillator inputs	Supports 8–48 MHz HSE and 32.768 kHz LSE crystals; critical for precise clock tree derivation and RTC accuracy.
ETH_MDIO / ETH_MDC	Ethernet management interface	IEEE 802.3-compliant MDIO/MDC interface for PHY configuration and status monitoring in GMAC subsystem.

Key Features

Feature	Design Value
Asymmetric Dual-Core Processing	Linux-capable Cortex-A7 cores handle UI/networking; Cortex-M4 executes deterministic real-time control loops - no RTOS latency penalty on application core.
Hardware Security Partitioning	TrustZone® address space controller (TZC) and embedded TrustZone protection controller (ETZPC) enforce memory/peripheral access boundaries - prevents unauthorized access to secure firmware or keys.
Integrated Graphics Acceleration	LCD-TFT controller with dual layer blending, alpha blending, and programmable gamma correction - reduces CPU load for GUI rendering in resource-constrained HMIs.
Flexible Memory Interface	Dual-mode Quad-SPI + Flexible Memory Controller (FMC) supporting SLC NAND (8-bit ECC) and parallel NOR/PSRAM - enables boot-from-NAND and local code/data storage without external flash controller.
Industrial Communication Stack	2×CAN FD (one time-triggered), 3×SDMMC (eMMC™/SDIO), SPDIF Rx (4 inputs), HDMI-CEC - satisfies protocol diversity in factory automation and building management systems.

Applications

Industrial HMI

Edge Gateway

Use Scenario: Touch-enabled operator panel in PLC-controlled machinery with local data logging and remote diagnostics.

IC Role / Device Role / Timing Role: MPU hosts Qt-based GUI on Linux, runs Modbus TCP gateway, and manages real-time motion control via Cortex-M4.

Use Value: Single-chip integration replaces discrete SoC+FPGA+PMIC solution, reducing BOM cost by ~32% and board area by 45% versus legacy ARM9+XC3S200 design.

Use Scenario: Field-deployed protocol translator aggregating CAN FD, RS-485, and BLE sensor data into MQTT over cellular/Wi-Fi.

IC Role / Device Role / Timing Role: Cortex-A7 runs OpenWrt with Mosquitto broker and protocol stacks; Cortex-M4 handles time-critical CAN FD frame scheduling and CRC validation.

Use Value: Hardware-accelerated crypto (AES/SHA) enables TLS 1.2 offload for secure cloud uplinks without CPU overhead - maintains >15 Mbps throughput under encryption load.

Smart Building Controller

Medical Imaging Front-End

Use Scenario: HVAC and lighting controller with occupancy sensing, energy metering, and BACnet/IP compliance.

IC Role / Device Role / Timing Role: MPU executes BACnet stack and web server; integrated ADCs digitize temperature/humidity sensors; DACs drive analog valve actuators.

Use Value: On-chip 16-bit ADCs (4.5 Msps) eliminate external precision ADC IC, reducing analog front-end component count by 7 parts and improving thermal drift stability.

Use Scenario: Portable ultrasound device requiring real-time beamforming, RF signal conditioning, and DICOM export.

IC Role / Device Role / Timing Role: Cortex-M4 performs FPGA-like timing-critical beam steering calculations; SAI interfaces with audio codec; DCMI captures raw sensor frames.

Use Value: Dual Quad-SPI interface boots from encrypted QSPI flash while DFSDM processes sigma-delta microphone array data - achieves <10 µs jitter in time-of-flight measurements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core MPU applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
NXP i.MX 8M Mini (LQM)	Quad Cortex-A53 + Cortex-M4; lacks TrustZone®-enabled DDR controller and integrated TFT controller; higher typical power (3.2 W vs. 1.8 W @ full load).	Better for Android-based multimedia; less suitable for safety-critical display control due to absence of hardware display compositor.	Select when Android NDK development or quad-core compute density outweighs display/crypto/security integration needs.
Renesas RZ/G2L	Dual Cortex-A55 + Cortex-M33; includes DRAM-less LPDDR4x support but no built-in CAN FD or HDMI-CEC; lower analog integration (no DACs, single 12-bit ADC).	Optimized for vision AI inference (NPU); weaker for mixed-signal industrial control requiring simultaneous analog I/O and fieldbus comms.	Prefer for camera-centric edge AI; avoid where CAN FD, dual DACs, or TFT controller are mandatory.

Compared with i.MX 8M Mini and RZ/G2L, the STM32MP153CAB3 delivers superior integration for display-rich industrial controllers - combining TFT controller, dual CAN FD, hardware crypto, and analog peripherals in one die, reducing external component count and simplifying functional safety certification.

Availability

STM32MP153CAB3 is available at Aetrix Electronics and suitable for industrial HMIs, edge gateways, and smart building controllers requiring stable component supply across 10+ year product lifecycles.

Supply support for STM32MP153CAB3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, sensors, and automotive-grade components since 1987.

The STM32MP series targets heterogeneous computing in industrial and IoT edge applications, combining Linux-capable application processors with real-time microcontroller cores and hardware security - specifically engineered for secure, display-intensive, protocol-diverse embedded systems.

FAQ

What boot sources does the STM32MP153CAB3 support?

The STM32MP153CAB3 supports boot from eMMC™, SD card, NAND Flash (SLC with 8-bit ECC), Quad-SPI NOR/NAND, USB mass storage, and UART. Boot mode is selected via BOOT0 pin and optional BOOT1 strap; configuration is validated by ROM code before executing FSBL from selected medium.

Does the STM32MP153CAB3 require an external PMIC?

No - it integrates multiple on-chip LDOs (1.1 V for core, 1.8 V for USB, 1.8 V for RETRAM, 0.9 V backup regulator) and supports direct connection to single 3.3 V or 5 V input. External PMIC is optional for advanced power sequencing or multi-rail optimization in high-reliability systems.

How is TrustZone® implemented on this device?

TrustZone® is implemented via hardware-enforced memory isolation using the TrustZone Address Space Controller (TZC) for DDR and Embedded TrustZone Protection Controller (ETZPC) for peripherals. Secure monitor firmware (TF-A) manages world switching; secure boot validates chain-of-trust from ROM loader through OP-TEE and Linux kernel.

What is the maximum resolution supported by the LTDC controller?

The LCD-TFT Display Controller (LTDC) supports up to Full HD (1920 × 1080) at 30 fps or WXGA (1366 × 768) at 60 fps, with pixel clock up to 90 MHz. It features dual layers, alpha blending, color LUTs, and dithering - enabling rich GUIs without external graphics accelerator.

STM32MP153CAB3 Specifications

Product attributes: Attribute value

Manufacturer:: STMicroelectronics

Package/Case:: 354-LFBGA

Series:: STM32MP1

Packaging:: Tray

Product Status:: Active

Core Processor:: ARM® Cortex®-A7

Number of Cores/Bus Width:: 2 Core, 32-Bit

Speed:: 209MHz, 650MHz

Co-Processors/DSP:: ARM® Cortex®-M4

RAM Controllers:: DDR3, DDR3L, LPDDR2, LPDDR3

Graphics Acceleration:: Yes

Display & Interface Controllers:: HDMI-CEC, LCD

Ethernet:: 10/100Mbps (1)

SATA:: -

USB:: USB 2.0 (2), USB 2.0 OTG+ PHY (3)

Voltage - I/O:: 2.5V, 3.3V

Operating Temperature:: -40°C ~ 125°C (TA)

Grade:: -

Qualification:: -

Security Features:: ARM TZ

Mounting Type:: Surface Mount

Supplier Device Package:: 354-LFBGA (16x16)

Additional Interfaces:: CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB

STM32MP153CAB3 FAQ

1.How can I place an order for STM32MP153CAB3 through Aetrix?

Please submit a Request for Quotation (RFQ) for STM32MP153CAB3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STM32MP153CAB3 reliable?

The price and inventory of STM32MP153CAB3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32MP153CAB3 is usually 5 days.

3.What payment methods are accepted for STM32MP153CAB3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32MP153CAB3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STM32MP153CAB3?

STM32MP153CAB3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STM32MP153CAB3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STM32MP153CAB3?

For technical support, including STM32MP153CAB3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32MP153CAB3 requirements.

6.How does Aetrix verify that STM32MP153CAB3 is sourced from the original manufacturer or authorized distributors?

All STM32MP153CAB3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32MP153CAB3 meets industry standards.

7.What is the process for return or replacement of STM32MP153CAB3?

All STM32MP153CAB3 units undergo pre-shipment inspection (PSI). If there is an issue with STM32MP153CAB3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STM32MP153CAB3 part is unused and in its original packaging.

Return procedure for STM32MP153CAB3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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