STMicroelectronics STM32MP153CAB3T
- Part No.:
- STM32MP153CAB3T
- Manufacturer:
- STMicroelectronics
- Category:
- Microprocessors
- Package:
- 354-LFBGA
- Datasheet:
-
STM32MP153CAB3T.pdf
- Description:
- IC MPU STM32MP1 650MHZ 354LFBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
STM32MP153CAB3T from STMicroelectronics is a dual-core Arm® Cortex®-A7 (800 MHz) + Cortex®-M4 microprocessor unit (MPU) with TrustZone®, NEON™, and hardware crypto acceleration (AES-256, SHA-256, RNG), integrated LCD-TFT controller supporting Full HD @30 fps, and 37 communication interfaces including dual CAN FD and Gigabit Ethernet. It targets Linux-capable industrial HMI, edge gateway, and secure IoT edge node applications requiring real-time co-processing and rich peripheral integration.
For engineers reviewing the STM32MP153CAB3T datasheet, STM32MP153CAB3T pinout, STM32MP153CAB3T application, or STM32MP153CAB3T equivalent, key selection considerations include dual-core asymmetric processing capability, DDR3/LPDDR3 memory controller support, TrustZone-enabled secure boot and peripheral isolation, and TFBGA361 (12 × 12 mm, 0.5 mm pitch) package compatibility with industrial thermal and layout constraints.
Technical Context
The device implements an asymmetric multiprocessing architecture: the Cortex-A7 cores run Linux for high-level tasks (networking, UI, application logic), while the Cortex-M4 handles deterministic real-time control (motor sequencing, sensor fusion, safety monitoring) with FPU and MPU. Memory coherency is managed via AXI interconnect and L2 cache.
Security is enforced at silicon level through TrustZone address space controller (TZC) for DDR, embedded TrustZone protection controller (ETZPC), secure boot via BSEC, and isolated M4 resources - enabling hardware-enforced separation between trusted firmware and rich OS environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Cores | Dual Arm® Cortex®-A7 @800 MHz + single Cortex®-M4 @209 MHz - enables Linux + RTOS coexistence with dedicated interrupt routing and inter-processor communication (IPCC) |
| Memory Interface | External DDR up to 1 Gbyte (LPDDR2/LPDDR3-1066 or DDR3/DDR3L-1066, 16/32-bit bus) - supports high-bandwidth graphics and network stack operation |
| Internal SRAM | 708 Kbytes total: 256 KB AXI SYSRAM + 384 KB AHB SRAM + 64 KB Backup SRAM + 4 KB Backup domain SRAM - enables fast context switching and RTC-critical data retention |
| Graphics | LCD-TFT controller with 24-bit RGB888 output, up to 1920×1080 @30 fps and 90 MHz pixel clock - drives industrial panels without external video processor |
| Crypto Acceleration | AES-128/192/256, TDES, SHA-1/224/256, HMAC, two TRNGs - offloads TLS handshake, secure firmware update, and data-at-rest encryption from CPU |
| Communication Peripherals | 2× CAN FD (one TTCAN), 6× I²C, 8× UART/USART, 6× SPI, 4× SAI, 3× SDMMC, 2× USB HS Host + 1× USB FS OTG, Gigabit Ethernet GMAC - supports multi-protocol industrial fieldbus and cloud connectivity |
| Analog | 2× 16-bit ADCs (up to 3.6 Msps), 2× 12-bit DACs (1 MHz), DFSDM with 8 channels - enables precision analog sensing and closed-loop control in same SoC |
| Package | TFBGA361 (12 × 12 mm, 0.5 mm pitch, B031 marking) - RoHS-compliant, optimized for thermal dissipation in fanless industrial enclosures |
Pinout & Package
STM32MP153CAB3T uses a 361-ball TFBGA package (ST part code B031), 12 mm × 12 mm, 0.5 mm ball pitch, with 176 user-configurable I/Os (including 8 secure GPIOs, 6 wakeup inputs, 3 tamper pins, and 1 active tamper). Ball assignment follows ST's standardized pinout for STM32MP15x series, with dedicated power domains (VDDCORE, VDDIO, VDDUSB, VDDA, VREF+, etc.), differential clock inputs (HSE/LSE), and high-speed interface banks (DDR, GMAC, USB PHY).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDCORE | Core power supply | 1.1 V ±5% supply for Cortex-A7/M4 cores and L2 cache - requires low-noise regulation and local decoupling |
| VDDIO | I/O power supply | 1.71–3.6 V supply for all general-purpose I/Os - enables 5 V-tolerant operation on selected pins for legacy interface compatibility |
| HSE_IN / HSE_OUT | High-speed external oscillator | 8–48 MHz crystal interface for system clock accuracy and jitter-sensitive peripherals (USB, Ethernet, audio) |
| NRST | System reset input | Active-low asynchronous reset controlling both A7 and M4 subsystems - compatible with push-button or PMIC-driven reset sequencing |
| BOOT0 / BOOT1 | Boot mode selection | Two-pin strap configuration determining boot source (FSMC, QSPI, SDMMC, USB, UART) - critical for secure firmware recovery and field updates |
| PA0–PA31, PB0–PB31, etc. | General-purpose I/O banks | 176 total GPIOs grouped into 12 banks (GPIOA–GPIOL), each supporting multiple alternate functions (AF0–AF15) - enables flexible peripheral mapping and pin conflict resolution |
Key Features
| Feature | Design Value |
|---|---|
| TrustZone-enabled secure execution environment | Hardware-isolated memory regions and peripheral access control for secure boot, encrypted firmware storage, and runtime attestation |
| Asymmetric dual-core architecture | Independent clock domains, power domains, and interrupt controllers for A7 and M4 - eliminates software scheduling overhead in real-time Linux systems |
| Integrated LCD-TFT controller with dual layer overlay | Direct RGB888 output up to 1920×1080 @30 fps and programmable color LUT - reduces BOM cost and PCB area vs discrete display controller |
| Hardware-accelerated cryptography | Dedicated AES, HASH, and TRNG engines - achieves >100 Mbps encrypted throughput without CPU load, enabling secure OTA updates |
| Flexible memory subsystem | DDR controller + Quad-SPI + FMC + DFSDM - supports boot from flash, high-speed data logging to NAND, and sigma-delta sensor interfacing in one chip |
| Industrial-grade low-power modes | Standby mode consuming 2 µA (no RTC, no LSE, no BKPSRAM) - extends battery life in always-on edge nodes with periodic wake-up |
Applications
| Industrial HMI Panel | Secure Edge Gateway |
|---|---|
Use Scenario: Touchscreen-based operator interface for PLC-controlled machinery with real-time alarm display and recipe management. IC Role / Device Role / Timing Role: MPU executes Linux-based Qt application, drives TFT panel via LTDC, processes touch via I²C, and communicates with PLC over CAN FD or Ethernet. Use Value: Dual-core architecture isolates GUI rendering (A7) from real-time I/O handling (M4), ensuring deterministic response to emergency stop signals while maintaining smooth UI animation. | Use Scenario: Field-deployed protocol translator aggregating Modbus RTU, CAN FD, and BLE sensor data for secure upload to cloud MQTT broker. IC Role / Device Role / Timing Role: A7 runs OpenWrt for networking and TLS-secured MQTT client; M4 manages time-triggered CAN FD messaging and sensor timestamping with sub-microsecond precision. Use Value: Integrated crypto accelerators enable end-to-end encryption of telemetry without performance penalty; TrustZone protects private keys from compromised Linux userspace. |
| Smart Building Controller | Medical Diagnostic Terminal |
Use Scenario: Wall-mounted HVAC and lighting controller with local web UI, Zigbee/Thread radio coexistence, and energy metering via analog front-end. IC Role / Device Role / Timing Role: A7 hosts lightweight web server and Zigbee NCP; M4 samples 16-bit ADCs for current/voltage monitoring and controls PWM fans via advanced timers. Use Value: On-chip DFSDM and dual 16-bit ADCs eliminate external sigma-delta converter; 29 timers provide independent PWM generation for multiple fan zones with synchronized phase-shifted outputs. | Use Scenario: Portable ultrasound or patient monitor requiring high-resolution display, low-latency sensor acquisition, and HIPAA-compliant data export. IC Role / Device Role / Timing Role: LTDC drives medical-grade display; M4 acquires analog front-end data via 16-bit ADC at 3.6 Msps; crypto engines encrypt DICOM files before SD card storage. Use Value: Single-chip integration meets IEC 62304 Class C requirements by minimizing external components; backup SRAM retains calibration data during power loss. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core MPU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP i.MX 8M Mini (LPC55S69) | Quad-core Cortex-A53 + Cortex-M33; lacks integrated TFT controller and TrustZone-peripheral isolation; different DDR PHY timing model | Better for multimedia streaming but requires external display controller; weaker security partitioning for certified medical use | Select when higher Linux performance is needed and display interface is handled externally or via LVDS bridge |
| Renesas RZ/G2L (R9A07G043L22GBG) | Dual Cortex-A55 + Cortex-M33; includes 2D GPU and MIPI-DSI, but no CAN FD or hardware DFSDM; lower crypto throughput | Stronger graphics for infotainment; unsuitable for CAN FD-based industrial automation or precision sigma-delta sensor systems | Prefer for automotive IVI or consumer displays where MIPI interface and GPU acceleration outweigh CAN FD and analog integration needs |
Compared with i.MX 8M Mini and RZ/G2L, STM32MP153CAB3T uniquely combines TrustZone-peripheral isolation, integrated TFT controller, dual CAN FD, and hardware DFSDM - making it optimal for cost-sensitive, security-critical industrial HMIs where analog sensing and display are co-located on a single PCB.
Availability
STM32MP153CAB3T is available at Aetrix Electronics and suitable for industrial HMI, edge gateway, smart building controller, and medical diagnostic terminal applications requiring stable component supply across extended product lifecycles.
Supply support for STM32MP153CAB3T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power ICs, sensors, and analog devices for industrial, automotive, and consumer markets.
The STM32MP series is ST's heterogeneous multicore MPU product line targeting Linux-capable embedded applications with real-time responsiveness, security, and peripheral richness - specifically engineered for industrial edge intelligence and human-machine interaction.
FAQ
What boot sources does STM32MP153CAB3T support?
STM32MP153CAB3T supports boot from internal ROM (with configurable fallback), Quad-SPI flash, parallel NOR/NAND via FMC, SD/eMMC, USB device, and UART. Boot mode is selected using BOOT0/BOOT1 pins, and secure boot enforces cryptographic signature verification of first-stage bootloader (FSBL) stored in external memory or OTP.
Does STM32MP153CAB3T require external DDR memory to operate?
Yes - STM32MP153CAB3T has no embedded DRAM and requires external DDR3/DDR3L or LPDDR2/LPDDR3 memory (up to 1 Gbyte) for Linux execution. Internal 708 Kbytes SRAM is insufficient for full OS operation but supports M4 real-time tasks and boot ROM execution.
How is TrustZone implemented on STM32MP153CAB3T?
TrustZone is implemented via hardware blocks including the TrustZone Address Space Controller (TZC) for DDR memory region protection, Embedded TrustZone Protection Controller (ETZPC) for peripheral access control, and Secure Boot ROM enforcing authenticated firmware loading. The Cortex-A7 cores operate in Secure/Non-secure states, while the Cortex-M4 runs exclusively in Secure state.
What is the maximum camera interface resolution supported?
The DCMI interface supports up to 14-bit parallel input at 140 Mbyte/s, enabling capture of 1920×1080 @30 fps raw Bayer data or 1280×720 @60 fps with embedded sync. It supports ITU-R BT.601/656, JPEG, and YUV422 formats, with hardware cropping and scaling prior to DMA transfer to DDR.
STM32MP153CAB3T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 354-LFBGA
- Series:
- STM32MP1
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A7
- Number of Cores/Bus Width:
- 2 Core, 32-Bit
- Speed:
- 209MHz, 650MHz
- Co-Processors/DSP:
- ARM® Cortex®-M4
- RAM Controllers:
- DDR3, DDR3L, LPDDR2, LPDDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- HDMI-CEC, LCD
- Ethernet:
- 10/100Mbps (1)
- SATA:
- -
- USB:
- USB 2.0 (2), USB 2.0 OTG+ PHY (3)
- Voltage - I/O:
- 2.5V, 3.3V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 354-LFBGA (16x16)
- Additional Interfaces:
- CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB
STM32MP153CAB3T FAQ
1.How can I place an order for STM32MP153CAB3T through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32MP153CAB3T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32MP153CAB3T reliable?
The price and inventory of STM32MP153CAB3T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32MP153CAB3T is usually 5 days.
3.What payment methods are accepted for STM32MP153CAB3T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32MP153CAB3T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STM32MP153CAB3T?
STM32MP153CAB3T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32MP153CAB3T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32MP153CAB3T?
For technical support, including STM32MP153CAB3T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32MP153CAB3T requirements.
6.How does Aetrix verify that STM32MP153CAB3T is sourced from the original manufacturer or authorized distributors?
All STM32MP153CAB3T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32MP153CAB3T meets industry standards.
7.What is the process for return or replacement of STM32MP153CAB3T?
All STM32MP153CAB3T units undergo pre-shipment inspection (PSI). If there is an issue with STM32MP153CAB3T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32MP153CAB3T part is unused and in its original packaging.
Return procedure for STM32MP153CAB3T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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