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STMicroelectronics STM32MP153CAC3
- Part No.:
- STM32MP153CAC3
- Manufacturer:
- STMicroelectronics
- Category:
- Microprocessors
- Package:
- 361-TFBGA
- Datasheet:
-
STM32MP153CAC3.pdf
- Description:
- IC MPU STM32MP1 650MHZ 361TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,061
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Product details
Overview
STM32MP153CAC3 from STMicroelectronics is a dual-core Arm® Cortex®-A7 (800 MHz) + Cortex®-M4 microprocessor unit with TrustZone® security, TFT LCD controller, 37 communication interfaces (including 2× CAN FD and Gigabit Ethernet), 29 timers, advanced analog peripherals (16-bit ADCs, dual 12-bit DACs), and hardware crypto acceleration (AES-256, SHA-256, TRNG). It targets industrial HMI, edge gateway, and smart building control systems requiring secure Linux/RTOS coexistence.
For engineers reviewing the STM32MP153CAC3 datasheet, STM32MP153CAC3 pinout, STM32MP153CAC3 application, or STM32MP153CAC3 equivalent, key selection considerations include dual-core asymmetric processing capability, DDR3/LPDDR3 memory support up to 1 Gbyte, 176 I/Os with secure/tamper capability, and integrated HDMI-CEC, SPDIF, and SAI audio subsystems.
Technical Context
The device implements a heterogeneous dual-core architecture: two Cortex-A7 cores run Linux in non-secure world with 256-Kbyte unified L2 cache and NEON™ SIMD support, while the Cortex-M4 (209 MHz) handles real-time tasks in secure isolation via TrustZone®. Memory subsystem includes 708 Kbytes of on-chip SRAM split across AXI/AHB domains and backup domain, plus flexible external memory controllers for DDR3/LPDDR3 and NAND.
Communication infrastructure features five PLLs with fractional mode, 6× I²C FM+, 4× UART/USART with ISO7816/LIN/IrDA, 6× SPI (3 with I²S audio-class accuracy), 4× SAI, 2× CAN FD (one TTCAN-capable), USB 2.0 HS Host+OTG, and IEEE 1588v2-enabled Gigabit Ethernet GMAC - all managed via dual AMBA® interconnect matrices (64-bit AXI @ 266 MHz, 32-bit AHB @ 209 MHz).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual Arm® Cortex®-A7 @ 800 MHz + single Cortex®-M4 @ 209 MHz - enables Linux + RTOS co-execution with hardware-enforced isolation |
| Memory Support | Up to 1 Gbyte DDR3/LPDDR3-1066 (16/32-bit) - supports high-bandwidth applications like video streaming and edge AI inference |
| Internal SRAM | 708 Kbytes total: 256 KB AXI SYSRAM + 384 KB AHB SRAM + 64 KB Backup SRAM + 4 KB Backup SRAM - enables fast boot, secure context storage, and RTC retention |
| Analog Peripherals | 2× 16-bit ADCs (up to 3.6 Msps), 2× 12-bit DACs (1 MHz), DFSDM with 8 channels - suitable for precision sensor fusion and closed-loop motor control |
| Security Features | Secure boot, TrustZone® peripherals, active tamper detection, AES-256/HASH-256/TRNG - meets IEC 62443-3-3 SL2 requirements for industrial IoT |
| Graphics & Display | LCD-TFT controller supporting WXGA @60 fps or Full HD @30 fps - drives industrial panels without external GPU |
| Communication Interfaces | 2× CAN FD (1× TTCAN), Gigabit Ethernet GMAC, 4× SAI, SPDIF Rx (4 inputs), HDMI-CEC - enables deterministic fieldbus integration and multi-format audio/video I/O |
Pinout & Package
STM32MP153CAC3 is packaged in a TFBGA361 (12 × 12 mm, 0.5 mm pitch) RoHS-compliant ECOPACK2 package with 361 solder balls. Pin assignment follows ST's B031 mechanical variant per DS12503 Rev 9 Section 4.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDCORE | Core power supply | 1.1 V ±5% supply for CPU cores and L1/L2 caches - requires low-noise regulation and decoupling near ball array |
| VDDIO_1 | I/O bank 1 supply | 1.71–3.6 V supply for GPIOs PB0–PB15, PC0–PC15, PD0–PD15 - supports mixed-voltage interfacing and 5 V-tolerant operation |
| NRST | System reset input | Active-low asynchronous reset controlling both A7 and M4 subsystems - must be debounced externally for reliable power-on initialization |
| BOOT0 | Boot mode selection | Configures primary boot source (FSMC, QSPI, SDMMC, USB, etc.) during power-up - sampled at POR and latched internally |
| OSC_IN / OSC_OUT | External crystal oscillator interface | Connects to 8–48 MHz HSE crystal for system clock generation - critical for Ethernet IEEE 1588 timing and USB HS PHY stability |
| ETH_MDIO / ETH_MDC | GMAC management interface | Provides IEEE 802.3 MDIO/MDC access to PHY registers - required for auto-negotiation and link status monitoring |
Key Features
| Feature | Design Value |
|---|---|
| Asymmetric Dual-Core Architecture | Enables concurrent Linux-based application layer and deterministic real-time control on M4 - eliminates need for separate MCU in gateway designs |
| Integrated TFT LCD Controller | Drives RGB888 panels up to 1920×1080@30 fps with dual-layer composition and programmable LUT - reduces BOM cost vs discrete display controllers |
| Hardware Crypto Acceleration | AES-128/192/256, SHA-256, HMAC, and dual TRNG enable TLS 1.3 handshake in <50 ms - critical for secure OTA firmware updates |
| Flexible External Memory Interface | Supports LPDDR2/LPDDR3, DDR3/DDR3L, and SLC NAND with up to 8-bit ECC - allows cost-optimized memory selection for different performance tiers |
| Advanced Power Management | Standby mode draws only 2 µA (no RTC/LSE/BKPSRAM/RETRAM) with DDR retention - extends battery life in always-on edge nodes |
Applications
| Industrial HMI Panel | Smart Building Gateway |
|---|---|
Use Scenario: Touchscreen operator interface for PLC-controlled HVAC and lighting systems with local data logging and remote diagnostics. IC Role / Device Role / Timing Role: Main application processor running embedded Linux UI stack, managing TFT display, capacitive touch, CAN FD fieldbus, and Ethernet backhaul. Use Value: Integrated LTDC and 2× CAN FD eliminate external display controller and bus bridge ICs; TrustZone® isolates UI code from secure firmware update path. | Use Scenario: Multi-protocol edge gateway aggregating BACnet MS/TP, KNX, and Modbus RTU devices into cloud-connected MQTT/HTTP endpoints. IC Role / Device Role / Timing Role: Central protocol translator and scheduler executing real-time Modbus/CAN parsing on M4 while hosting Linux network stack and TLS on A7 cores. Use Value: Dual-core asymmetry enables deterministic fieldbus response (<100 µs jitter) alongside secure cloud connectivity - no dual-SoC complexity. |
| Video Surveillance Edge Node | Medical Diagnostic Instrument |
Use Scenario: Low-power IP camera with motion-triggered H.264 encoding, local SD card storage, and encrypted upload to HIPAA-compliant cloud service. IC Role / Device Role / Timing Role: Vision processing host interfacing with 8–14-bit DCMI camera sensor, running OpenCV-based analytics on A7, and encrypting streams via hardware AES before transmission. Use Value: Hardware-accelerated crypto cuts encryption latency by 8× vs software-only; 140 MB/s DCMI bandwidth supports 1080p30 raw sensor capture. | Use Scenario: Portable ultrasound or ECG device requiring FDA-cleared signal acquisition, real-time waveform rendering, and secure patient data export. IC Role / Device Role / Timing Role: Signal acquisition controller using 16-bit ADCs at 4.5 Msps, driving TFT display via LTDC, and enforcing secure boot and tamper-evident logging via TrustZone® peripherals. Use Value: On-chip 16-bit ADCs meet IEC 62304 Class C precision requirements; active tamper detection prevents unauthorized firmware modification. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core MPU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP i.MX 8M Mini (LPC55S69) | Quad Cortex-A53 + Cortex-M33; lacks integrated TFT controller and hardware DFSDM; higher typical power draw in Run mode | Better for Android-based UIs and AI inference; less suited for cost-sensitive HMI with direct RGB panel drive | Select when prioritizing Android compatibility and NPU acceleration over display integration and ultra-low Standby current |
| Renesas RZ/G2L (R9A07G043L2) | Dual Cortex-A55 + Cortex-M33; includes 3D GPU but no hardware crypto accelerators beyond TRNG; no CAN FD support | Stronger graphics performance for animated UIs; weaker for secure industrial fieldbus gateways | Select when GPU-accelerated GUI rendering outweighs need for CAN FD, TrustZone® peripheral isolation, and hardware AES/SHA |
Compared with i.MX 8M Mini and RZ/G2L, STM32MP153CAC3 delivers superior integration for secure industrial HMIs - combining TFT controller, CAN FD, hardware crypto, and sub-2 µA Standby - at lower BOM cost and thermal footprint than competing quad-core alternatives.
Availability
STM32MP153CAC3 is available at Aetrix Electronics and suitable for industrial HMI, smart building gateways, and medical diagnostic instruments requiring stable component supply across multi-year production cycles.
Supply support for STM32MP153CAC3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, sensors, and automotive-grade components since 1987.
The STM32MP series targets heterogeneous computing for industrial and IoT edge devices, combining Linux-capable application processors with real-time microcontroller subsystems to simplify secure, long-lifecycle embedded system design.
FAQ
What boot sources does STM32MP153CAC3 support?
STM32MP153CAC3 supports eight boot modes selected via BOOT pins: eMMC/SD card, Quad-SPI NOR/NAND flash, parallel NOR/PSRAM/NAND via FMC, USB device, and serial interfaces (UART/USB). BootROM validates signature and loads FSBL from configured medium, enabling secure chain-of-trust startup with optional OTP-based root key storage.
Does STM32MP153CAC3 require an external PMIC?
No - STM32MP153CAC3 integrates multiple on-die regulators including 1.1 V core LDO, 1.8 V USB PHY LDO, and backup regulator (~0.9 V), but external PMIC is recommended for high-efficiency multi-rail systems. The chip provides PMIC control signals (e.g., VSEL, ENABLE) and monitors rail health via internal voltage sensors and PVD circuitry.
How is TrustZone® implemented across the dual-core architecture?
TrustZone® is implemented at both SoC and peripheral levels: the TZC-400 controller enforces memory access rights for DDR, ETZPC configures trust attributes for on-chip peripherals, and the Cortex-M4 operates exclusively in secure world. Secure monitor calls route A7 requests to M4 for cryptographic operations or tamper response, ensuring hardware-isolated execution of sensitive firmware.
What is the maximum pixel clock frequency supported by the LTDC?
The LTDC supports a maximum pixel clock frequency of 90 MHz, enabling WXGA (1366×768) at 60 fps or Full HD (1920×1080) at 30 fps with RGB888 color depth. Clock is derived from dedicated audio/video PLLs or external sources, and timing parameters (HSPW, VSPW, etc.) are fully programmable to match panel-specific requirements.
STM32MP153CAC3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 361-TFBGA
- Series:
- STM32MP1
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A7
- Number of Cores/Bus Width:
- 2 Core, 32-Bit
- Speed:
- 209MHz, 650MHz
- Co-Processors/DSP:
- ARM® Cortex®-M4
- RAM Controllers:
- DDR3, DDR3L, LPDDR2, LPDDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- HDMI-CEC, LCD
- Ethernet:
- 10/100Mbps (1)
- SATA:
- -
- USB:
- USB 2.0 (2), USB 2.0 OTG+ PHY (3)
- Voltage - I/O:
- 2.5V, 3.3V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 361-TFBGA (12x12)
- Additional Interfaces:
- CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB
STM32MP153CAC3 FAQ
1.How can I place an order for STM32MP153CAC3 through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32MP153CAC3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32MP153CAC3 reliable?
The price and inventory of STM32MP153CAC3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32MP153CAC3 is usually 5 days.
3.What payment methods are accepted for STM32MP153CAC3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32MP153CAC3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STM32MP153CAC3?
STM32MP153CAC3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32MP153CAC3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32MP153CAC3?
For technical support, including STM32MP153CAC3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32MP153CAC3 requirements.
6.How does Aetrix verify that STM32MP153CAC3 is sourced from the original manufacturer or authorized distributors?
All STM32MP153CAC3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32MP153CAC3 meets industry standards.
7.What is the process for return or replacement of STM32MP153CAC3?
All STM32MP153CAC3 units undergo pre-shipment inspection (PSI). If there is an issue with STM32MP153CAC3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32MP153CAC3 part is unused and in its original packaging.
Return procedure for STM32MP153CAC3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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