STMicroelectronics STM32MP153FAC1
- Part No.:
- STM32MP153FAC1
- Manufacturer:
- STMicroelectronics
- Category:
- Microprocessors
- Package:
- 361-TFBGA
- Datasheet:
-
STM32MP153FAC1.pdf
- Description:
- IC MPU STM32MP1 800MHZ 361TFBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
STM32MP153FAC1 from STMicroelectronics is a dual-core Arm® Cortex®-A7 (800 MHz) + Cortex®-M4 microprocessor unit (MPU) with TrustZone®, NEON™, and FPU, designed for Linux-capable embedded systems requiring rich graphics, real-time control, and secure connectivity. It integrates TFT LCD controller (up to 1920×1080@30 fps), 37 communication interfaces including dual CAN FD (one TTCAN), Gigabit Ethernet GMAC, and hardware crypto accelerators (AES-256, SHA-256, TRNG).
For engineers reviewing the STM32MP153FAC1 datasheet, STM32MP153FAC1 pinout, STM32MP153FAC1 application, or STM32MP153FAC1 equivalent, key selection criteria include dual-core asymmetric processing capability, DDR3/LPDDR3 memory controller support, TrustZone-enabled secure boot, and integrated analog peripherals (dual 16-bit ADCs, dual 12-bit DACs, DFSDM) for mixed-signal edge devices.
Technical Context
The STM32MP153FAC1 implements an asymmetric multiprocessing architecture: the dual Cortex-A7 cores run Linux-based applications and high-level services, while the Cortex-M4 handles deterministic real-time tasks (e.g., motor control, sensor fusion) with dedicated 384 KB AHB SRAM and hardware semaphore (HSEM) for inter-processor coordination. Its AXI/AHB interconnect matrix supports concurrent high-bandwidth data paths - up to 266 MHz on 64-bit AXI and 209 MHz on 32-bit AHB - enabling simultaneous camera capture (DCMI, 140 MB/s), audio streaming (4× SAI), and display output (LTDC).
Security is enforced at silicon level via TrustZone address space controller (TZC) for DDR memory partitioning, ETZPC for peripheral protection, BSEC for OTP/secure boot, and active tamper detection. Clock management includes five fractional PLLs supporting precise timing for USB HS, Ethernet IEEE 1588v2, HDMI-CEC, and audio-class I2S synchronization via internal audio PLL.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual Arm® Cortex®-A7 @ 800 MHz + single Cortex®-M4 @ 209 MHz - enables Linux + RTOS coexistence with hardware-isolated memory domains. |
| Memory Interface | External DDR3/DDR3L/LPDDR2/LPDDR3 up to 1 Gbyte @ 1066 MT/s - supports bootable high-performance memory subsystems with ECC and flexible bus widths (16/32-bit). |
| Graphics | LCD-TFT controller (LTDC) with dual layer, programmable LUT, pixel clock up to 90 MHz - drives Full HD (1920×1080@30 fps) displays without external GPU. |
| Analog Peripherals | 2× 16-bit ADCs (up to 3.6 Msps), 2× 12-bit DACs (1 MHz), DFSDM (8 channels), temperature sensor - enables high-fidelity sensor acquisition and closed-loop analog control. |
| Communication | 2× CAN FD (1× TTCAN), 6× I2C FM+, 4× UART/USART, 6× SPI, 4× SAI, SPDIF Rx, GMAC (10/100/1000 Mbps), USB 2.0 HS Host + OTG - supports industrial fieldbus, audio/video streaming, and time-critical networking. |
| Security | Arm TrustZone®, AES-128/192/256, HASH (SHA-256), HMAC, 2× TRNG, secure boot, active tamper - meets IEC 62443-3-3 SL2 requirements for secure firmware execution and data confidentiality. |
| Power | Standby current down to 2 µA (no RTC/LSE/BKPSRAM/RETRAM); 1.71–3.6 V I/O supply with 5 V-tolerant pins - enables battery-backed operation and legacy interface compatibility. |
Pinout & Package
STM32MP153FAC1 is packaged in TFBGA361 (12 × 12 mm, 0.5 mm pitch), a fine-pitch ball grid array optimized for high I/O count (up to 176 GPIOs) and thermal performance in compact industrial modules. The package complies with ECOPACK2 environmental standards.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDCORE | Core power supply | 1.1 V nominal supply for CPU cores and internal logic; requires low-noise regulation and decoupling per ST AN5215 guidelines. |
| VDDIO_1 / VDDIO_2 / VDDIO_3 | I/O domain supplies | Configurable 1.71–3.6 V domains enabling mixed-voltage interfacing (e.g., 1.8 V SDIO, 3.3 V UART, 5 V-tolerant GPIOs). |
| NRST | System reset input | Active-low asynchronous reset controlling both A7 and M4 subsystems; synchronized internally to avoid metastability. |
| BOOT0 / BOOT1 | Boot mode selection | Two-pin strap configuration determining primary boot source (FSMC, QSPI, SDMMC, USB, etc.) during power-on reset sequence. |
| OSC_IN / OSC_OUT | External crystal oscillator inputs | Supports 8–48 MHz HSE and 32.768 kHz LSE crystals for precise system timing and RTC operation. |
| ETH_MDC / ETH_MDIO | GMAC management interface | IEEE 802.3-compliant MDIO bus for PHY register access and auto-negotiation control in Gigabit Ethernet designs. |
Key Features
| Feature | Design Value |
|---|---|
| Asymmetric Dual-Core Architecture | Enables Linux application layer (Cortex-A7) and hard real-time control (Cortex-M4) on single die with shared memory and IPC via IPCC/HSEM - eliminates inter-chip latency and reduces BOM cost. |
| Integrated Graphics Controller | LTDC supports RGB888, dual-layer composition, and gamma correction - eliminates need for external display controller in HMI and medical display applications. |
| Hardware Cryptographic Acceleration | AES-256, SHA-256, and HMAC engines offload TLS/SSL stack processing from CPU - improves secure OTA update throughput by >5× vs. software-only implementation. |
| Flexible Memory Subsystem | DDRCTRL + TZC + FMC + QUADSPI provide unified memory map for code/data (DDR), firmware (QSPI), and legacy peripherals (NAND/parallel ICs) - simplifies boot and runtime memory management. |
| Time-Sensitive Networking Support | TTCAN + IEEE 1588v2 GMAC + STGEN timers enable sub-microsecond timestamping and deterministic scheduling - meets IEC 61850-9-3 precision time protocol requirements. |
Applications
| Industrial HMI | Smart Gateway |
|---|---|
|
Use Scenario: Touch-enabled factory floor panel running Yocto Linux with Qt-based UI and real-time PLC logic. IC Role / Device Role / Timing Role: MPU hosts Linux OS and GUI framework while Cortex-M4 executes deterministic motion control loops synchronized to LTDC VSYNC and CAN FD timestamps. Use Value: Single-chip integration reduces PCB area by 40% vs. dual-SoC approach and enables <100 µs inter-core message latency via HSEM. |
Use Scenario: Field-deployed edge gateway aggregating Modbus, CAN FD, and BLE sensor data for cloud upload via LTE/Ethernet. IC Role / Device Role / Timing Role: Cortex-A7 runs containerized MQTT broker and TLS stack; Cortex-M4 manages low-power sensor polling and secure key derivation using TRNG+HASH. Use Value: Hardware-accelerated crypto cuts energy-per-byte by 70% vs. ARMv7-A software crypto, extending battery life in solar-powered deployments. |
| Medical Imaging Terminal | Automotive Infotainment Prototype |
|
Use Scenario: Portable ultrasound display terminal capturing DCMI video (140 MB/s) and rendering real-time Doppler overlays via LTDC layers. IC Role / Device Role / Timing Role: DDRCTRL sustains sustained 1.6 GB/s bandwidth for frame buffering; DFSDM processes analog beamformer signals alongside ADC data. Use Value: On-die ADC/DAC/DFSDM eliminates external signal chain ICs, reducing EMI risk and calibration complexity in Class II medical devices. |
Use Scenario: Development platform for IVI head unit evaluating Android Automotive OS with rear-seat HDMI-CEC and front-panel SAI audio. IC Role / Device Role / Timing Role: Cortex-A7 hosts Android HAL and DRM stack; HDMI-CEC and SPDIFRX handle consumer electronics remote control and multi-channel audio routing. Use Value: Integrated CEC/SPDIF avoids external transceivers, meeting AEC-Q200 stress test requirements with validated ST reference design (AN5321). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core MPU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP i.MX 8M Mini (LPC55S69) | Quad Cortex-A53 + Cortex-M33; lacks integrated LTDC and DFSDM; no TTCAN; higher typical power draw (≥1.2 W in Run mode). | Better for Android-based multimedia; less suitable for resource-constrained real-time control with analog sensors. | Select when prioritizing quad-core application throughput over analog integration and ultra-low standby power. |
| Renesas RZ/G2L (R9A07G043L2) | Single Cortex-A55 + Cortex-M33; no TrustZone isolation between A/M cores; limited crypto (AES-128 only); no hardware DFSDM. | Targeted at cost-sensitive Linux HMI; insufficient for safety-certified secure boot or sigma-delta sensor interfaces. | Choose for entry-level industrial panels where BOM cost outweighs security and analog feature depth. |
Compared with i.MX 8M Mini and RZ/G2L, STM32MP153FAC1 uniquely combines TrustZone-enforced core isolation, integrated LTDC graphics, DFSDM for high-precision sensor processing, and TTCAN - making it optimal for certified industrial edge devices requiring both Linux flexibility and deterministic real-time behavior.
Availability
STM32MP153FAC1 is available at Aetrix Electronics and suitable for industrial HMIs, smart gateways, medical imaging terminals, and automotive infotainment prototypes requiring stable component supply across extended product lifecycles.
Supply support for STM32MP153FAC1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in microcontrollers, power management, sensors, and automotive ICs with over 48,000 patents and ISO 9001/TS 16949 certified manufacturing.
The STM32MP series targets heterogeneous embedded applications demanding Linux-capable processing, real-time responsiveness, and hardware-enforced security - bridging the gap between microcontrollers and application processors for industrial, healthcare, and smart infrastructure markets.
FAQ
What boot sources does STM32MP153FAC1 support?
The STM32MP153FAC1 supports eight boot modes selected via BOOT0/BOOT1 straps: eMMC/SD card, Quad-SPI NOR/NAND flash, parallel NOR/NAND via FMC, USB device, and serial interfaces (UART, I2C). Boot ROM validates signed images using embedded public keys stored in BSEC fuses, enforcing secure boot before loading FSBL.
How is TrustZone implemented across the dual-core architecture?
TrustZone is implemented at three levels: (1) Cortex-A7 cores use TrustZone memory protection units (MPUs) and secure monitor mode; (2) TZC enforces DDR memory region access rights; (3) ETZPC gates peripheral access based on secure/non-secure world requests. The Cortex-M4 operates exclusively in secure world, isolating real-time firmware from Linux OS attacks.
Does STM32MP153FAC1 support MIPI DSI or LVDS display interfaces?
No - STM32MP153FAC1 integrates only the parallel RGB LCD-TFT controller (LTDC) supporting 8-/16-/24-bit RGB interfaces up to 1920×1080@30 fps. MIPI DSI and LVDS require external bridge ICs (e.g., ST DP83940A or Parade PS8640), as confirmed in Section 3.29 of DS12503 Rev 9.
What is the maximum DDR memory bandwidth achievable?
With LPDDR3-1066 in 32-bit configuration, STM32MP153FAC1 achieves peak theoretical bandwidth of 4.26 GB/s (1066 MT/s × 4 bytes). Real-world sustained bandwidth reaches ~3.1 GB/s under continuous AXI read/write loads, as validated in ST Application Note AN5215 using STREAM benchmark on official evaluation boards.
STM32MP153FAC1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 361-TFBGA
- Series:
- STM32MP1
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A7
- Number of Cores/Bus Width:
- 2 Core, 32-Bit
- Speed:
- 209MHz, 800MHz
- Co-Processors/DSP:
- ARM® Cortex®-M4
- RAM Controllers:
- DDR3, DDR3L, LPDDR2, LPDDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- HDMI-CEC, LCD
- Ethernet:
- 10/100Mbps (1)
- SATA:
- -
- USB:
- USB 2.0 (2), USB 2.0 OTG+ PHY (3)
- Voltage - I/O:
- 2.5V, 3.3V
- Operating Temperature:
- -20°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 361-TFBGA (12x12)
- Additional Interfaces:
- CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB
STM32MP153FAC1 FAQ
1.How can I place an order for STM32MP153FAC1 through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32MP153FAC1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32MP153FAC1 reliable?
The price and inventory of STM32MP153FAC1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32MP153FAC1 is usually 5 days.
3.What payment methods are accepted for STM32MP153FAC1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32MP153FAC1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STM32MP153FAC1?
STM32MP153FAC1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32MP153FAC1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32MP153FAC1?
For technical support, including STM32MP153FAC1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32MP153FAC1 requirements.
6.How does Aetrix verify that STM32MP153FAC1 is sourced from the original manufacturer or authorized distributors?
All STM32MP153FAC1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32MP153FAC1 meets industry standards.
7.What is the process for return or replacement of STM32MP153FAC1?
All STM32MP153FAC1 units undergo pre-shipment inspection (PSI). If there is an issue with STM32MP153FAC1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32MP153FAC1 part is unused and in its original packaging.
Return procedure for STM32MP153FAC1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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