STMicroelectronics STM32MP157AAB3T
- Part No.:
- STM32MP157AAB3T
- Manufacturer:
- STMicroelectronics
- Category:
- Microprocessors
- Package:
- 354-LFBGA
- Datasheet:
-
STM32MP157AAB3T.pdf
- Description:
- IC MPU STM32MP1 650MHZ 354LFBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
STM32MP157AAB3T from STMicroelectronics is a dual-core Arm® Cortex®-A7 (800 MHz) + Cortex®-M4 microprocessor unit (MPU) with 3D GPU, TFT/DSI display support, 37 communication interfaces including dual CAN FD controllers, and 708 KB on-chip SRAM. It targets Linux-capable embedded applications requiring real-time co-processing, industrial HMI, and multimedia edge devices.
For engineers reviewing the STM32MP157AAB3T datasheet, STM32MP157AAB3T pinout, STM32MP157AAB3T application, or STM32MP157AAB3T equivalent, key selection criteria include dual-core asymmetric processing capability, TrustZone®-enabled security partitioning, DDR3/LPDDR3 memory controller timing, and TFBGA361 package I/O routing for high-density PCB layout.
Technical Context
The device implements an asymmetric multiprocessing architecture: two Cortex-A7 cores run Linux in secure/non-secure worlds via TrustZone®, while the Cortex-M4 handles deterministic real-time tasks (e.g., motor control, sensor fusion) with FPU and MPU isolation. The interconnect matrix includes 64-bit AXI (266 MHz) and 32-bit AHB (209 MHz) buses with three DMA controllers - one high-speed MDMA and two dual-port DMAs with FIFO and request routing.
Security is enforced at hardware level via TrustZone address space controller (TZC) for DDR, ETZPC for peripheral protection, active tamper detection, and BSEC-managed OTP fuses. Clock management uses six fractional PLLs supporting HDMI, audio, and Ethernet timing requirements with IEEE 1588v2 hardware timestamping in GMAC.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Cores | Dual Arm® Cortex®-A7 @ 800 MHz + single Cortex®-M4 @ 209 MHz - enables Linux + RTOS coexistence with hardware-isolated execution environments |
| Memory | 708 KB on-chip SRAM (256 KB AXI SYSRAM + 384 KB AHB SRAM + 64 KB Backup SRAM + 4 KB Backup SRAM) - supports fast boot, secure context storage, and RTC retention without external RAM |
| Graphics | Vivante® 3D GPU (OpenGL® ES 2.0), up to 26 Mtriangle/s - enables UI acceleration for WXGA (1366×768@60 fps) or Full HD (1920×1080@30 fps) displays |
| Connectivity | 2× CAN FD (one TTCAN-capable), 6× I²C, 8× UART/USART, 6× SPI, 4× SAI, 3× SDMMC, 2× USB 2.0 HS Host + 1× USB 2.0 FS OTG - supports automotive diagnostics, industrial fieldbus bridging, and multi-camera/audio streaming |
| Analog | 2× 16-bit ADCs (up to 3.6 Msps), 2× 12-bit DACs (1 MHz), DFSDM with 8 channels - suitable for precision sensor acquisition and closed-loop analog feedback |
| Package | TFBGA361 (12 × 12 mm, 0.5 mm pitch) - provides 176 user I/Os with 8 secure GPIOs, 6 wakeup pins, and dedicated camera/DSI/DDR routing lanes |
| Power | 1.71–3.6 V I/O supply (5 V-tolerant), 2 µA Standby current (no RTC/LSE/BKPSRAM/RETRAM) - enables battery-backed operation in ultra-low-power monitoring systems |
Pinout & Package
STM32MP157AAB3T is housed in a TFBGA361 package (12 × 12 mm, 0.5 mm ball pitch), compliant with ECOPACK2 environmental standards. The package supports 176 general-purpose I/Os with configurable alternate functions across 16 functional groups (AF0–AF15), including dedicated high-speed interfaces for DDR, DSI, DCMI, and Gigabit Ethernet.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDCORE | Core power supply | 1.0 V ±5% regulated input for Cortex-A7/M4 cores and L2 cache; requires low-noise external regulator |
| VDDIO_1 | I/O bank 1 supply | 1.71–3.6 V supply for GPIOs PA0–PA31, PB0–PB31, PC0–PC31 - supports mixed-voltage interfacing and 5 V tolerance |
| NRST | System reset input | Active-low asynchronous reset for entire SoC; synchronized internally to avoid metastability during power sequencing |
| BOOT0 | Boot mode selection | High at power-up selects internal ROM bootloader; used with BOOT1 to configure boot source (FSMC, QSPI, SDMMC, USB) |
| CLKIN | External clock input | Accepts 8–48 MHz crystal or oscillator for HSE; feeds PLLs for CPU, GPU, DDR, and peripheral clocks |
| DCMI_D0–D13 | Parallel camera interface | 14-bit bidirectional data bus supporting up to 140 MB/s throughput - enables direct connection to CMOS image sensors without external FIFO |
| DSI_CLK_P/N | MIPI DSI clock lane | Differential 1 Gbps clock pair for MIPI DSI v1.2 compliance - drives high-resolution embedded displays with minimal EMI |
| GMII_RXD0–RXD7 | Gigabit Ethernet receive data | 8-bit parallel GMII interface for 1000BASE-T PHY - supports IEEE 1588v2 hardware timestamping for time-critical industrial networking |
Key Features
| Feature | Design Value |
|---|---|
| TrustZone®-enabled secure boot | Hardware-enforced root-of-trust using BSEC-managed OTP keys and immutable ROM bootloader - prevents unauthorized firmware execution |
| Asymmetric core partitioning | Cortex-M4 runs real-time tasks independently of Linux scheduler; IPC via IPCC mailbox ensures deterministic latency under OS load |
| DDR memory retention in Standby | Entire DDR content preserved during Standby mode (2 µA) - enables instant resume without Linux kernel reload or application restart |
| Dual Quad-SPI interface | Two independent QUADSPI controllers supporting XIP (execute-in-place) from external flash - reduces boot time and eliminates need for internal ROM shadowing |
| Hardware crypto acceleration | Dedicated HASH (SHA-256, HMAC) and dual TRNG units - offloads TLS handshake and secure key generation from CPU cores |
Applications
| Industrial HMI | Smart Gateway |
|---|---|
Use Scenario: Touch-enabled operator panel in factory automation with local logic and cloud connectivity. IC Role / Device Role / Timing Role: MPU hosts Linux-based Qt UI on LTDC-driven TFT display while Cortex-M4 manages PLC I/O scanning and CANopen stack timing. Use Value: Dual-core isolation prevents UI jitter during real-time I/O servicing; DDR retention enables sub-second wake-from-standby after power interruption. | Use Scenario: Edge gateway aggregating Modbus, CAN FD, and BLE sensor data for IIoT platform upload. IC Role / Device Role / Timing Role: Cortex-A7 runs containerized protocol translators and MQTT client; Cortex-M4 handles time-triggered CAN FD frame scheduling and hardware timestamping. Use Value: TTCAN support meets automotive-grade synchronization requirements; dual USB HS ports enable simultaneous debug and field firmware update. |
| Medical Imaging Terminal | Automotive Infotainment |
Use Scenario: Portable ultrasound display terminal with real-time image rendering and DICOM export. IC Role / Device Role / Timing Role: Vivante GPU accelerates image post-processing; DCMI captures raw sensor frames; SAI routes audio feedback with <10 µs latency. Use Value: 140 MB/s DCMI bandwidth supports full-resolution ultrasound video streaming; DFSDM filters noise from analog front-end signals. | Use Scenario: In-vehicle infotainment head unit with rear-seat display, voice assistant, and OTA update capability. IC Role / Device Role / Timing Role: Cortex-A7 executes Android Automotive OS and media framework; DSI drives primary display; HDMI-CEC controls AV equipment. Use Value: MIPI DSI 2-lane 1 Gbps link supports WQHD resolution; hardware-accelerated OpenGL ES 2.0 ensures smooth UI animation at 60 fps. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar MPU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| i.MX 8M Mini (NXP) | Quad Cortex-A53 + Cortex-M4, no integrated GPU, supports LPDDR4 but not LPDDR2/LPDDR3 | Lacks 3D graphics acceleration; optimized for headless AI inference rather than rich GUI | Select when prioritizing AI compute over display performance and requiring LPDDR4 support |
| RZ/G2L (Renesas) | Dual Cortex-A55 + Cortex-M33, Mali-G31 GPU, supports DDR3L but no CAN FD or TTCAN | No automotive-grade time-triggered networking; lower GPU throughput (12.5 Mtriangle/s vs 26) | Select for cost-sensitive industrial HMIs needing Armv8-A features but not CAN FD certification |
Compared with i.MX 8M Mini and RZ/G2L, STM32MP157AAB3T uniquely combines TrustZone-secured dual-core Linux/RTOS operation, CAN FD with TTCAN, and Vivante GPU performance in a single TFBGA361 package - making it optimal for safety-aware, display-intensive edge devices where footprint and mixed-criticality execution are decisive.
Availability
STM32MP157AAB3T is available at Aetrix Electronics and suitable for industrial HMI, smart gateways, medical imaging terminals, and automotive infotainment systems requiring stable component supply across extended product lifecycles.
Supply support for STM32MP157AAB3T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power ICs, sensors, and automotive-grade SoCs since 1987.
The STM32MP series was developed to bridge the gap between microcontrollers and application processors - delivering Linux-capable performance with MCU-like power efficiency, security, and ease of use for industrial and consumer edge applications.
FAQ
What boot sources does STM32MP157AAB3T support?
The device supports boot from multiple sources including Quad-SPI flash (XIP-capable), eMMC/SD card, NAND flash via FMC, and USB device mode. Boot mode is selected by BOOT0/BOOT1 pins at power-on reset, and the ROM bootloader validates signed images using public-key cryptography stored in OTP fuses before loading FSBL.
Does STM32MP157AAB3T require external PMIC support?
Yes - while the SoC integrates LDOs for DSI, USB PHY, and backup domains, it relies on an external PMIC (e.g., STPMIC1) to generate VDDCORE (1.0 V), VDDIO (1.8/3.3 V), and DDR termination voltages. The PMIC interface uses I²C and dedicated control signals (e.g., PWRON, RESET_OUT) for coordinated power sequencing.
How is TrustZone® implemented for peripheral access control?
TrustZone is enforced via the ETZPC (Embedded TrustZone Protection Controller), which assigns each peripheral to secure or non-secure privilege levels at reset. Access attempts from non-secure world to secure peripherals trigger bus errors, and configuration is locked after boot via BSEC fuses - preventing runtime reconfiguration without physical OTP programming.
What thermal limitations apply to sustained 800 MHz Cortex-A7 operation?
Sustained dual-core 800 MHz operation requires junction temperature ≤105°C, achievable with ≤2.5 W total power dissipation. In TFBGA361 package, this mandates ≥2-layer PCB with thermal vias under the exposed pad and ≥15 cm² copper pour. Thermal derating begins above 85°C ambient, reducing max frequency to 600 MHz per core per ST's DS12504 Rev 9 Section 7.6.
STM32MP157AAB3T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 354-LFBGA
- Series:
- STM32MP1
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A7
- Number of Cores/Bus Width:
- 2 Core, 32-Bit
- Speed:
- 209MHz, 650MHz
- Co-Processors/DSP:
- ARM® Cortex®-M4
- RAM Controllers:
- DDR3, DDR3L, LPDDR2, LPDDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- HDMI-CEC, LCD
- Ethernet:
- 10/100Mbps, GbE
- SATA:
- -
- USB:
- USB 2.0 (2), USB 2.0 OTG+ PHY (3)
- Voltage - I/O:
- 2.5V, 3.3V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 354-LFBGA (16x16)
- Additional Interfaces:
- CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB
STM32MP157AAB3T FAQ
1.How can I place an order for STM32MP157AAB3T through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32MP157AAB3T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32MP157AAB3T reliable?
The price and inventory of STM32MP157AAB3T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32MP157AAB3T is usually 5 days.
3.What payment methods are accepted for STM32MP157AAB3T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32MP157AAB3T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STM32MP157AAB3T?
STM32MP157AAB3T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32MP157AAB3T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32MP157AAB3T?
For technical support, including STM32MP157AAB3T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32MP157AAB3T requirements.
6.How does Aetrix verify that STM32MP157AAB3T is sourced from the original manufacturer or authorized distributors?
All STM32MP157AAB3T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32MP157AAB3T meets industry standards.
7.What is the process for return or replacement of STM32MP157AAB3T?
All STM32MP157AAB3T units undergo pre-shipment inspection (PSI). If there is an issue with STM32MP157AAB3T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32MP157AAB3T part is unused and in its original packaging.
Return procedure for STM32MP157AAB3T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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