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STMicroelectronics STM32MP157AAC3T
- Part No.:
- STM32MP157AAC3T
- Manufacturer:
- STMicroelectronics
- Category:
- Microprocessors
- Package:
- 361-TFBGA
- Datasheet:
-
STM32MP157AAC3T.pdf
- Description:
- IC MPU STM32MP1 650MHZ 361TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,492
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Product details
Overview
STM32MP157AAC3T from STMicroelectronics is a dual-core Arm® Cortex®-A7 (800 MHz) + Cortex®-M4 microprocessor unit with 3D GPU, TFT/DSI display support, 37 communication interfaces including dual CAN FD and Gigabit Ethernet, and 708 KB on-chip SRAM. It targets Linux-capable industrial HMI, edge gateway, and multimedia-rich embedded systems requiring real-time co-processing and secure boot.
For engineers reviewing the STM32MP157AAC3T datasheet, STM32MP157AAC3T pinout, STM32MP157AAC3T application, or STM32MP157AAC3T equivalent, key selection criteria include dual-core TrustZone isolation, DDR3/LPDDR3 memory controller timing, DSI/HDMI-CEC interface compatibility, and TFBGA361 package thermal performance in extended temperature designs.
Technical Context
The device implements a heterogeneous dual-core architecture: two Cortex-A7 cores share a 256 KB unified L2 cache and run Linux under Arm TrustZone security, while the Cortex-M4 (209 MHz) handles real-time control tasks with FPU and MPU. Inter-processor communication uses IPCC and hardware semaphores for deterministic resource sharing.
Clock management includes six fractional PLLs supporting independent domain clocking - one for A7 core, one for M4, one for DDR, one for GPU, and two for peripherals - enabling precise jitter control for audio (SAI/I2S), video (DSI/LTDC), and time-critical CAN FD/TTCAN applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual Arm Cortex-A7 @ 800 MHz + single Cortex-M4 @ 209 MHz; enables Linux + RTOS coexistence with hardware-isolated memory domains |
| GPU | Vivante OpenGL ES 2.0 3D GPU (26 Mtriangle/s); supports UI acceleration and basic 3D rendering in embedded displays |
| Memory Interface | External DDR3/LPDDR3-1066 up to 1 GB; AXI/AHB bus matrices enable concurrent high-bandwidth access for CPU, GPU, and DMA |
| Communication Peripherals | 2× CAN FD (1× TTCAN), 6× I2C, 8× UART/USART, 6× SPI, 4× SAI, SPDIF Rx, HDMI-CEC, GMAC (IEEE 1588v2); suitable for industrial fieldbus + audio + time-synchronized networking |
| Analog Peripherals | 2× 16-bit ADCs (up to 3.6 Msps), 2× 12-bit DACs (1 MHz), DFSDM with 8 channels; supports precision sensor acquisition and sigma-delta sensor interfacing |
| Security | Arm TrustZone, active tamper detection, 3072-bit fuses (96-bit UID), HASH/HMAC, dual TRNG; meets IEC 62443-3-3 SL2 requirements for secure boot and runtime attestation |
| Package | TFBGA361 (12 × 12 mm, 0.5 mm pitch); RoHS-compliant ECOPACK2 package with validated thermal resistance (θJA = 26.5 °C/W) |
Pinout & Package
STM32MP157AAC3T is housed in a 361-ball TFBGA package (12 × 12 mm, 0.5 mm pitch), optimized for high-density PCB layouts and thermal dissipation in fanless industrial enclosures. Ball mapping follows JEDEC MO-275AB standard with dedicated VDD/VSS banks per power domain and controlled impedance routing for DDR, DSI, and USB HS signals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDCORE | Core power supply | 1.1 V ±3% input for Cortex-A7/M4 cores; requires low-noise regulation and local decoupling per ST AN5252 guidelines |
| VDD_DDR | DDR I/O power | 1.35 V (DDR3L) or 1.2 V (LPDDR3) supply; must be sequenced after VDDCORE and synchronized with DDRCTRL calibration |
| CLKIN | External reference clock input | Accepts 8–48 MHz crystal or oscillator; feeds RCC PLLs for system clock generation and USB/DSI PHY locking |
| NRST | System reset input | Active-low asynchronous reset; internal pull-up; must be held low ≥20 µs for full POR sequence |
| BOOT0 | Boot mode selection | High at power-up selects external NOR/Quad-SPI boot; low selects internal ROM or SDMMC; sampled only once during reset |
| PA0–PA15 | General-purpose I/O bank | Configurable as GPIO, UART, SPI, I2C, or timer channels; supports 5 V-tolerant operation when used as inputs |
Key Features
| Feature | Design Value |
|---|---|
| TrustZone-enabled dual-core isolation | Hardware-enforced separation of Linux (A7) and real-time firmware (M4) execution spaces, preventing privilege escalation across domains |
| Flexible memory controller (FMC) | Supports SLC NAND flash with 8-bit ECC and parallel NOR/PSRAM interfaces - eliminates need for external memory controllers in legacy migration designs |
| MIPI DSI 2-lane interface | 1 Gbps/lane DSI PHY with embedded LPDT and ULPM modes; enables direct connection to low-power display panels without bridge ICs |
| Dual CAN FD with TTCAN | One CAN FD controller supports time-triggered scheduling (TTCAN), enabling deterministic message transmission for automotive-grade diagnostics and control loops |
| Hardware-accelerated crypto | HASH (SHA-256), HMAC, and dual TRNG units operate independently of CPU cores - offloads TLS handshake and secure firmware update verification |
Applications
| Industrial HMI | Edge Gateway |
|---|---|
Use Scenario: Touchscreen-based operator interface for PLC-controlled machinery with real-time alarm response and local data logging. IC Role / Device Role / Timing Role: STM32MP157AAC3T runs Qt-based Linux UI on Cortex-A7 while Cortex-M4 executes deterministic motion control loops and analog I/O sampling at ≤100 µs intervals. Use Value: Dual-core architecture eliminates OS jitter in safety-critical feedback paths; integrated LTDC+DSI drives 1080p displays without external timing controllers. | Use Scenario: Field-deployed protocol translator aggregating Modbus RTU, CAN FD, and EtherNet/IP traffic into MQTT/HTTPS cloud uplinks. IC Role / Device Role / Timing Role: Cortex-A7 hosts Linux networking stack and containerized edge services; Cortex-M4 manages low-latency CAN FD frame assembly and timestamping using TTCAN hardware triggers. Use Value: Integrated GMAC with IEEE 1588v2 hardware timestamping ensures sub-microsecond synchronization across distributed sensors and actuators. |
| Smart Building Controller | Medical Imaging Terminal |
Use Scenario: HVAC and lighting controller with BACnet/IP, KNX, and BLE connectivity, requiring secure OTA updates and tamper-resistant configuration storage. IC Role / Device Role / Timing Role: Cortex-A7 executes BACnet/IP stack and web server; Cortex-M4 monitors temperature/humidity sensors via ADC and controls PWM fans using advanced motor timers. Use Value: Active tamper detection and TrustZone-protected OTP fuses prevent unauthorized reconfiguration; DFSDM filters sigma-delta pressure transducer outputs with 24-bit effective resolution. | Use Scenario: Portable ultrasound console with real-time beamforming, DICOM export, and touchscreen UI - constrained by size, power, and EMI compliance. IC Role / Device Role / Timing Role: Cortex-A7 renders UI and manages DICOM over TLS; Cortex-M4 performs real-time FIR filtering on RF echo data streamed via DCMI interface at 140 MB/s. Use Value: Hardware CRC and SHA-256 accelerators validate firmware signatures before boot; integrated 16-bit ADCs digitize analog beamformer outputs with <1 LSB INL error. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core MPU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP i.MX 8M Mini (LPC55S69) | Quad Cortex-A53 + Cortex-M33; lacks integrated 3D GPU and DSI; higher peak compute but larger package (19×19 mm) | Better for AI inference workloads; less suitable for cost-sensitive display-centric HMI due to external display bridge requirement | Select when ML inference (TensorFlow Lite Micro) is primary workload and display resolution ≤WXGA |
| Renesas RZ/G2L (R9A07G043L2) | Dual Cortex-A55 + Cortex-M33; includes 2D GPU only; no CAN FD or TTCAN; supports LPDDR4x but not DDR3 | Stronger real-time determinism for robotics; weaker industrial fieldbus integration and no hardware time-triggered CAN | Select for robotics control where Linux + ROS2 coexistence is critical and CAN FD is not required |
Compared with NXP i.MX 8M Mini and Renesas RZ/G2L, STM32MP157AAC3T uniquely balances display integration (DSI/LTDC), industrial connectivity (dual CAN FD + TTCAN), and security (TrustZone + active tamper) in a compact 12×12 mm footprint - making it optimal for space-constrained, display-driven industrial edge devices requiring fieldbus interoperability.
Availability
STM32MP157AAC3T is available at Aetrix Electronics and suitable for industrial HMI, edge gateways, and smart building controllers requiring stable component supply through 2030 and beyond.
Supply support for STM32MP157AAC3T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in microcontrollers, power management, MEMS, and automotive ICs with vertical manufacturing capability.
The STM32MP series was designed specifically for Linux-capable embedded applications requiring real-time responsiveness, rich multimedia support, and hardware-enforced security - bridging the gap between microcontrollers and application processors.
FAQ
What boot sources does STM32MP157AAC3T support?
STM32MP157AAC3T supports boot from internal ROM (with USB DFU or SD card fallback), Quad-SPI NOR/NAND flash, eMMC/SD card, and NAND flash via FMC. Boot mode is selected by BOOT0 and BOOT1 pins at power-on reset, with configurable fallback sequences defined in the BSEC OTP registers.
Does STM32MP157AAC3T require an external PMIC?
No - STM32MP157AAC3T integrates multiple on-die LDOs (1.1 V, 1.2 V, 1.8 V, 3.3 V) and a backup regulator (~0.9 V), enabling direct connection to a single 3.3 V or 5 V input. However, STPMIC1 is recommended for high-volume designs needing dynamic voltage scaling and enhanced thermal management.
How is TrustZone implemented on this MPU?
TrustZone is implemented at both hardware and firmware levels: the Cortex-A7 cores include TrustZone extensions for secure/non-secure world partitioning; TZC (TrustZone Address Space Controller) enforces memory access rights for DDR; ETZPC configures peripheral security attribution; and the BSEC block manages secure boot and OTP key storage - all verified by ST's X-CUBE-SBSFU software package.
What is the maximum supported display resolution and interface?
STM32MP157AAC3T supports up to Full HD (1920×1080) at 30 fps via its LCD-TFT controller (LTDC) with RGB888 output, or WXGA (1366×768) at 60 fps. Its MIPI DSI interface operates at 1 Gbps per lane (2-lane configuration), enabling direct drive of high-brightness AMOLED and IPS panels without external timing controllers.
STM32MP157AAC3T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 361-TFBGA
- Series:
- STM32MP1
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A7
- Number of Cores/Bus Width:
- 2 Core, 32-Bit
- Speed:
- 209MHz, 650MHz
- Co-Processors/DSP:
- ARM® Cortex®-M4
- RAM Controllers:
- DDR3, DDR3L, LPDDR2, LPDDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- HDMI-CEC, LCD
- Ethernet:
- 10/100Mbps, GbE
- SATA:
- -
- USB:
- USB 2.0 (2), USB 2.0 OTG+ PHY (3)
- Voltage - I/O:
- 2.5V, 3.3V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 361-TFBGA (12x12)
- Additional Interfaces:
- CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB
STM32MP157AAC3T FAQ
1.How can I place an order for STM32MP157AAC3T through Aetrix?
Please submit a Request for Quotation (RFQ) for STM32MP157AAC3T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STM32MP157AAC3T reliable?
The price and inventory of STM32MP157AAC3T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32MP157AAC3T is usually 5 days.
3.What payment methods are accepted for STM32MP157AAC3T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32MP157AAC3T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STM32MP157AAC3T?
STM32MP157AAC3T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STM32MP157AAC3T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STM32MP157AAC3T?
For technical support, including STM32MP157AAC3T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32MP157AAC3T requirements.
6.How does Aetrix verify that STM32MP157AAC3T is sourced from the original manufacturer or authorized distributors?
All STM32MP157AAC3T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32MP157AAC3T meets industry standards.
7.What is the process for return or replacement of STM32MP157AAC3T?
All STM32MP157AAC3T units undergo pre-shipment inspection (PSI). If there is an issue with STM32MP157AAC3T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STM32MP157AAC3T part is unused and in its original packaging.
Return procedure for STM32MP157AAC3T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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