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STMicroelectronics STM32MP157CAB3

Part No.:
STM32MP157CAB3
Manufacturer:
STMicroelectronics
Category:
Microprocessors
Package:
354-LFBGA
Datasheet:
AetrixSTM32MP157CAB3.pdf
Description:
IC MPU STM32MP1 650MHZ 354LFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,081

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Product details

Overview

STM32MP157CAB3 from STMicroelectronics is a dual-core Arm® Cortex®-A7 (800 MHz) + Cortex®-M4 microprocessor unit (MPU) with 3D GPU, TFT/DSI display support, 37 communication interfaces, 29 timers, advanced analog peripherals, and hardware crypto acceleration. It integrates 708 KB on-chip SRAM, TrustZone® security, DDR3/LPDDR3 memory controller, and operates across 1.71–3.6 V I/O supply with 5 V-tolerant pins - deployed in industrial HMIs, edge gateways, and smart building controllers.

For engineers reviewing the STM32MP157CAB3 datasheet, STM32MP157CAB3 pinout, STM32MP157CAB3 application, or STM32MP157CAB3 equivalent, key selection considerations include dual-core Linux-capable architecture, 2× CAN FD with TTCAN support, MIPI DSI 2-lane 1 Gbps interface, Vivante® 3D GPU performance (26 Mtriangle/s), and secure boot with active tamper detection.

Technical Context

The STM32MP157CAB3 implements a heterogeneous dual-core architecture: two Cortex-A7 cores run Linux or Android with L1 caches (32 KB I/D each) and shared 256 KB L2 cache, while the Cortex-M4 (209 MHz) handles real-time tasks with FPU and MPU isolation. TrustZone® enforces secure world/non-secure world partitioning at both CPU and peripheral levels.

Its interconnect matrix comprises a 64-bit AXI bus (266 MHz) and 32-bit AHB bus (209 MHz), enabling concurrent high-bandwidth data paths for GPU, DDR, and peripherals. The 6 PLLs support fractional clock synthesis for precise timing control across USB, Ethernet, DSI, and audio subsystems.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Cores Dual Arm® Cortex®-A7 @ 800 MHz + single Cortex®-M4 @ 209 MHz - enables Linux RTOS coexistence with deterministic real-time response.
GPU Vivante® GC320 OpenGL® ES 2.0 - delivers 26 Mtriangle/s for UI rendering up to Full HD (1920×1080@30 fps) via LTDC controller.
Memory Interface LPDDR2/LPDDR3-1066 or DDR3/DDR3L-1066 (16/32-bit) - supports up to 1 GB external RAM with ECC-capable FMC and Quad-SPI.
Communication Peripherals 2× CAN FD (1× TTCAN), 6× I²C, 8× UART/USART, 6× SPI, 4× SAI, 3× SDMMC, 1× Gigabit Ethernet GMAC - full industrial protocol stack including ISO 11898-1 and IEEE 1588v2.
Analog Subsystem 2× 16-bit ADCs (up to 3.6 Msps), 2× 12-bit DACs (1 MHz), DFSDM with 8 channels - suitable for sensor fusion and closed-loop motor control.
Security Arm® TrustZone®, secure boot, active tamper detection, AES-128/192/256, SHA-256, HMAC, dual TRNG - meets IEC 62443-3-3 SL2 requirements.
Package TFBGA361 (12 × 12 mm, 0.5 mm pitch) - RoHS-compliant ECOPACK2 package with 176 user I/Os and 8 secure GPIOs.

Pinout & Package

STM32MP157CAB3 is housed in a TFBGA361 package (12 × 12 mm, 0.5 mm ball pitch), featuring 361 balls with 176 general-purpose I/Os, 8 secure I/Os, 6 wakeup inputs, and dedicated power/ground distribution optimized for DDR signal integrity and thermal dissipation.

Pin/Terminal Circuit Role Design Meaning
VDDCORE Core power supply 1.1 V nominal supply for Cortex-A7/M4 cores and L2 cache - requires low-noise regulation and decoupling per ST AN5217.
VDDIO_1 I/O bank 1 supply 1.71–3.6 V programmable supply for GPIOs PB0–PB15, PC0–PC15 - enables mixed-voltage interfacing with 5 V-tolerant capability.
NRST System reset input Active-low asynchronous reset controlling all domains - synchronized internally to avoid metastability during power sequencing.
BOOT0 Boot mode selection Strapped high/low to select boot source (FSMC, SDMMC, eMMC, NAND, USB, UART) - determines initial firmware execution path.
CLKIN External clock input Accepts 8–48 MHz crystal or oscillator for HSE - feeds RCC PLLs to generate system clocks for CPU, DDR, USB, and DSI PHYs.
DSI_D0P/N MIPI DSI data lane differential pair High-speed 1 Gbps/lane LVDS-compatible interface for direct connection to display panels - supports video mode and command mode operation.

Key Features

Feature Design Value
Heterogeneous dual-core processing Linux-capable Cortex-A7 cluster + real-time Cortex-M4 offloads time-critical tasks (motor control, sensor preprocessing) without OS latency.
TrustZone-enabled security partitioning Hardware-enforced isolation between secure world (M4 + secure peripherals) and non-secure world (A7/Linux) - prevents unauthorized access to keys and firmware.
Integrated graphics pipeline LTDC controller + Vivante® GPU + DSI PHY eliminates need for external display bridge ICs - reduces BOM cost and PCB layer count in HMI designs.
Industrial connectivity suite 2× CAN FD with TTCAN, Gigabit Ethernet with IEEE 1588v2, and 3× SDMMC (eMMC™/SDIO) enable deterministic fieldbus integration and local storage for edge AI inference logs.
Low-power retention modes Standby mode draws only 2 µA while retaining DDR contents and RTC state - ideal for battery-backed gateways requiring instant wake-up and state recovery.

Applications

Industrial HMI Edge Gateway

Use Scenario: Touchscreen-based operator interface for PLC-controlled machinery with local data logging and remote diagnostics.

IC Role / Device Role / Timing Role: Primary application processor running embedded Linux with Qt-based GUI, managing DSI-driven LCD, CAN FD fieldbus, and SDMMC data storage.

Use Value: Single-chip solution replaces discrete MPU + GPU + display controller, reducing board area by 35% and eliminating external video buffer memory.

Use Scenario: Protocol translation hub aggregating Modbus RTU, CAN FD, and EtherNet/IP traffic into MQTT/HTTPS for cloud upload.

IC Role / Device Role / Timing Role: Dual-core coordinator: Cortex-A7 hosts containerized protocol stacks; Cortex-M4 handles deterministic packet timestamping and CAN message filtering.

Use Value: Hardware-accelerated crypto (AES/SHA) secures OTA updates; Gigabit Ethernet + IEEE 1588v2 ensures sub-microsecond time synchronization across distributed sensors.

Smart Building Controller Medical Imaging Terminal

Use Scenario: Wall-mounted HVAC and lighting controller with local web server, BLE co-processor interface, and tamper-evident enclosure monitoring.

IC Role / Device Role / Timing Role: Secure application host with TrustZone-protected firmware, active tamper detection on GPIOs, and isolated M4 managing environmental sensor fusion.

Use Value: On-chip tamper logic and secure boot prevent physical firmware extraction; 2× 16-bit ADCs directly digitize temperature/humidity without external signal conditioning.

Use Scenario: Portable ultrasound display terminal requiring real-time image rendering, DICOM export, and battery-backed operation.

IC Role / Device Role / Timing Role: Graphics-intensive processor driving 1366×768 RGB888 panel via LTDC, compressing raw echo data using hardware-accelerated AES and CRC units.

Use Value: Vivante GPU renders UI overlays with zero CPU load; DDR retention in Standby mode preserves last scan buffer during brief power loss.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core MPU applications.

Alternative Part Technical Difference Application Difference Selection Advice
NXP i.MX 8M Mini (LPC55S69) Quad-core Cortex-A53 + Cortex-M33; lacks integrated 3D GPU and DSI PHY; higher typical power draw in active mode. Better suited for headless edge AI inference; requires external display bridge for LCDs; no native TTCAN support. Select when prioritizing NPU acceleration over graphics or when migrating from existing i.MX software ecosystem.
Renesas RZ/G2L (R9A07G043L220BU) Single Cortex-A55 + Cortex-M33; includes 3D GPU (Vivante GC320) but no DSI PHY; supports only LPDDR4x, not DDR3. Targeted at cost-sensitive industrial displays with HDMI output; limited CAN FD (1 channel) and no TTCAN capability. Choose for HDMI-based HMIs where DDR3 compatibility and dual CAN FD are non-critical.

Compared with i.MX 8M Mini and RZ/G2L, STM32MP157CAB3 uniquely combines dual Cortex-A7 with Cortex-M4, integrated DSI PHY, dual CAN FD + TTCAN, and TrustZone-secured peripheral isolation - making it optimal for resource-constrained, display-rich, safety-aware industrial edge devices.

Availability

STM32MP157CAB3 is available at Aetrix Electronics and suitable for industrial HMIs, edge gateways, and smart building controllers requiring stable component supply, long-term lifecycle assurance, and qualified automotive-grade traceability.

Supply support for STM32MP157CAB3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, sensors, and automotive semiconductors since 1987.

The STM32MP series targets Linux-capable embedded applications demanding real-time responsiveness, graphical UIs, and hardware-enforced security - bridging the gap between microcontrollers and application processors for industrial and IoT edge systems.

FAQ

What boot sources does STM32MP157CAB3 support?

STM32MP157CAB3 supports eight boot modes selected via BOOT0 and BOOT1 pins: FSMC NOR/NAND, SDMMC (SD/eMMC), USB device, UART, SPI NOR, and internal ROM. Each mode loads the first-stage bootloader (FSBL) from the configured interface, enabling flexible firmware recovery and field updates without JTAG.

Does STM32MP157CAB3 require external PMIC support?

No - STM32MP157CAB3 integrates multiple on-die LDOs (1.1 V core, 1.2 V DSI, 1.8 V USB, 0.9 V backup) and a dedicated backup regulator. External PMIC is optional for enhanced efficiency or multi-rail sequencing in high-reliability systems, but not required for basic operation per ST AN5217 guidelines.

How is TrustZone implemented across CPU and peripherals?

TrustZone is implemented via hardware address space controllers (TZC for DDR, ETZPC for peripherals) that enforce access permissions based on secure/non-secure world status. The Cortex-M4 runs exclusively in secure world, while Cortex-A7 cores switch context via monitor mode; peripherals like RNG, CRYP, and TAMP are locked to secure access only.

What is the maximum pixel clock frequency supported by the LTDC controller?

The LTDC controller supports a maximum pixel clock of 90 MHz, enabling WXGA (1366×768) resolution at 60 fps or Full HD (1920×1080) at 30 fps in RGB888 format. Clock generation is derived from dedicated PLLs with fractional dividers, allowing precise tuning for custom display timings without external clock generators.

STM32MP157CAB3 Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Package/Case:
354-LFBGA
Series:
STM32MP1
Packaging:
Tray
Product Status:
Active
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
209MHz, 650MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI-CEC, LCD
Ethernet:
10/100Mbps, GbE
SATA:
-
USB:
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Voltage - I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Security Features:
ARM TZ
Mounting Type:
Surface Mount
Supplier Device Package:
354-LFBGA (16x16)
Additional Interfaces:
CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB

STM32MP157CAB3 FAQ

1.How can I place an order for STM32MP157CAB3 through Aetrix?

Please submit a Request for Quotation (RFQ) for STM32MP157CAB3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STM32MP157CAB3 reliable?

The price and inventory of STM32MP157CAB3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STM32MP157CAB3 is usually 5 days.

3.What payment methods are accepted for STM32MP157CAB3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STM32MP157CAB3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STM32MP157CAB3?

STM32MP157CAB3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STM32MP157CAB3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STM32MP157CAB3?

For technical support, including STM32MP157CAB3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STM32MP157CAB3 requirements.

6.How does Aetrix verify that STM32MP157CAB3 is sourced from the original manufacturer or authorized distributors?

All STM32MP157CAB3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STM32MP157CAB3 meets industry standards.

7.What is the process for return or replacement of STM32MP157CAB3?

All STM32MP157CAB3 units undergo pre-shipment inspection (PSI). If there is an issue with STM32MP157CAB3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STM32MP157CAB3 part is unused and in its original packaging.

Return procedure for STM32MP157CAB3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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